JPH0256446U - - Google Patents

Info

Publication number
JPH0256446U
JPH0256446U JP1988134797U JP13479788U JPH0256446U JP H0256446 U JPH0256446 U JP H0256446U JP 1988134797 U JP1988134797 U JP 1988134797U JP 13479788 U JP13479788 U JP 13479788U JP H0256446 U JPH0256446 U JP H0256446U
Authority
JP
Japan
Prior art keywords
package
hole
glass
external lead
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988134797U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0723961Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988134797U priority Critical patent/JPH0723961Y2/ja
Publication of JPH0256446U publication Critical patent/JPH0256446U/ja
Application granted granted Critical
Publication of JPH0723961Y2 publication Critical patent/JPH0723961Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/5449
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP1988134797U 1988-10-14 1988-10-14 半導体素子収納用パッケージ Expired - Fee Related JPH0723961Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988134797U JPH0723961Y2 (ja) 1988-10-14 1988-10-14 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988134797U JPH0723961Y2 (ja) 1988-10-14 1988-10-14 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0256446U true JPH0256446U (cg-RX-API-DMAC10.html) 1990-04-24
JPH0723961Y2 JPH0723961Y2 (ja) 1995-05-31

Family

ID=31393870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988134797U Expired - Fee Related JPH0723961Y2 (ja) 1988-10-14 1988-10-14 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JPH0723961Y2 (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001024252A1 (en) * 1999-09-28 2001-04-05 Matsushita Electric Industrial Co., Ltd. Electronic device and method of manufacture thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0224556U (cg-RX-API-DMAC10.html) * 1988-07-30 1990-02-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0224556U (cg-RX-API-DMAC10.html) * 1988-07-30 1990-02-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001024252A1 (en) * 1999-09-28 2001-04-05 Matsushita Electric Industrial Co., Ltd. Electronic device and method of manufacture thereof

Also Published As

Publication number Publication date
JPH0723961Y2 (ja) 1995-05-31

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees