JPH0256445U - - Google Patents
Info
- Publication number
- JPH0256445U JPH0256445U JP1988134610U JP13461088U JPH0256445U JP H0256445 U JPH0256445 U JP H0256445U JP 1988134610 U JP1988134610 U JP 1988134610U JP 13461088 U JP13461088 U JP 13461088U JP H0256445 U JPH0256445 U JP H0256445U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- semiconductor chip
- resin
- package
- airtight package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988134610U JPH0256445U (enExample) | 1988-10-14 | 1988-10-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988134610U JPH0256445U (enExample) | 1988-10-14 | 1988-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256445U true JPH0256445U (enExample) | 1990-04-24 |
Family
ID=31393527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988134610U Pending JPH0256445U (enExample) | 1988-10-14 | 1988-10-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256445U (enExample) |
-
1988
- 1988-10-14 JP JP1988134610U patent/JPH0256445U/ja active Pending