JPH025535Y2 - - Google Patents

Info

Publication number
JPH025535Y2
JPH025535Y2 JP1984185904U JP18590484U JPH025535Y2 JP H025535 Y2 JPH025535 Y2 JP H025535Y2 JP 1984185904 U JP1984185904 U JP 1984185904U JP 18590484 U JP18590484 U JP 18590484U JP H025535 Y2 JPH025535 Y2 JP H025535Y2
Authority
JP
Japan
Prior art keywords
clamp
spring plate
lead wire
wire
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984185904U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61100135U (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984185904U priority Critical patent/JPH025535Y2/ja
Publication of JPS61100135U publication Critical patent/JPS61100135U/ja
Application granted granted Critical
Publication of JPH025535Y2 publication Critical patent/JPH025535Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)
JP1984185904U 1984-12-07 1984-12-07 Expired JPH025535Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984185904U JPH025535Y2 (https=) 1984-12-07 1984-12-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984185904U JPH025535Y2 (https=) 1984-12-07 1984-12-07

Publications (2)

Publication Number Publication Date
JPS61100135U JPS61100135U (https=) 1986-06-26
JPH025535Y2 true JPH025535Y2 (https=) 1990-02-09

Family

ID=30743363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984185904U Expired JPH025535Y2 (https=) 1984-12-07 1984-12-07

Country Status (1)

Country Link
JP (1) JPH025535Y2 (https=)

Also Published As

Publication number Publication date
JPS61100135U (https=) 1986-06-26

Similar Documents

Publication Publication Date Title
EP0190220B1 (en) Bonding tool and clamp assembly and wire handling method
US6227431B1 (en) Apparatus and method of clamping semiconductor devices using sliding finger supports
US4422568A (en) Method of making constant bonding wire tail lengths
JPH025535Y2 (https=)
CN102791564B (zh) 用于将板靠在机动车辆的固定元件的平的面上进行固定的装置
US5931372A (en) Ultrasonic bonding method and apparatus with locking tool tip
CN115156694B (zh) 一种超声波铝带压焊机的焊头组件
JPH0236279Y2 (https=)
US6116490A (en) Bonding apparatus
US6089439A (en) Wire cutting and feeding device for use in wire bonding apparatus
JPS60196236A (ja) リ−ド線矯正装置
US4856699A (en) Driving mechanism for a high-speed wire contacting device
KR100761200B1 (ko) 보링머신의 스핀들 헤드 클램핑장치
US6491203B2 (en) Wire bonding apparatus
CN220480536U (zh) 引线结构和焊接设备
JP2789393B2 (ja) ボンデイング装置
JP2545551B2 (ja) ワイヤ放電加工機におけるワイヤ切断装置
JPS5918678Y2 (ja) ワイヤボンデイング装置
JPH09300111A (ja) バイト
JPS6173343A (ja) ワイヤボンダ
KR930001395A (ko) 전자 부품의 수지밀봉 성형체에 있어서의 리드자세 수정방법 및 그 수정장치
JPH0227743A (ja) ワイヤボンデイング装置用ワイヤクランパ
KR20020036875A (ko) 와이어 본더용 와이어 클램핑 장치
JPH05861B2 (https=)
JPH0244743A (ja) ワイヤボンディング方法