JPH0254861B2 - - Google Patents

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Publication number
JPH0254861B2
JPH0254861B2 JP17912785A JP17912785A JPH0254861B2 JP H0254861 B2 JPH0254861 B2 JP H0254861B2 JP 17912785 A JP17912785 A JP 17912785A JP 17912785 A JP17912785 A JP 17912785A JP H0254861 B2 JPH0254861 B2 JP H0254861B2
Authority
JP
Japan
Prior art keywords
group
silicon atom
bonded
composition according
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP17912785A
Other languages
Japanese (ja)
Other versions
JPS6239660A (en
Inventor
Tsuneo Mogi
Norio Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Momentive Performance Materials Japan LLC
Original Assignee
Toshiba Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Silicone Co Ltd filed Critical Toshiba Silicone Co Ltd
Priority to JP17912785A priority Critical patent/JPS6239660A/en
Publication of JPS6239660A publication Critical patent/JPS6239660A/en
Publication of JPH0254861B2 publication Critical patent/JPH0254861B2/ja
Granted legal-status Critical Current

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Description

【発明の詳細な説明】[Detailed description of the invention]

〔産業上の利用分野〕 本発明は、常温又は僅かの加熱により、プラス
チツク、ゴム、ガラスや金属などの基材に対して
優れた粘着性を有し、熱衝撃によるゲル内部の亀
裂や基材からの剥離を生じることがなく、かつ高
温での変色及び物性変化のない安定なゲル状物を
形成しうる光学的接合用ゲル組成物に関する。 〔従来の技術〕 従来、ヒドロシリル基とケイ素に結合したビニ
ル基との付加反応によつて硬化してゲル状のポリ
オルガノシロキサンを形成しうる組成物について
は各種の技術が知られており、電気・電子機器の
ポツテイング、エンキヤプシユレーシヨン、外科
手術における埋込材などとして広く用いられてい
る。 このようなポリオルガノシロキサン組成物とし
ては、特開昭48−17847号公報には、ケイ素原子
に結合せる水素原子の量を、ケイ素原子に結合せ
るビニル基1個あたり1個以下で、かつポリオル
ガノハイドロジエンシロキサン1分子中に平均
1.4〜1.8個に相当する量存在せしめる組成物が、
また特開昭54−15957号公報及び特開昭54−48720
号公報に、該水素原子の量を該ビニル基1個当り
0.3〜0.8付近という、比較的少量存在せしめる組
成物が開示され、また、ビニル基含有ポリオルガ
ノシロキサンとして、特開昭54−15957号公報で
はメチルビニルフエニルシロキシ基で末端封鎖さ
れたポリジメチルシロキサン、特開昭54−48720
号公報ではケイ素原子に結合せる少なくとも2個
のビニル基と1個の水酸基を1分子中に含有する
ポリシロキサンを用いることが提案されている。 しかし、このようなゲル状に硬化しうる組成物
ないしそれより得られたゲル状物には、共通して
次のような欠点がある。 粘着性が小さいため基材に密着せず、電子機
器部品などのポツテイングに用いた場合、部品
とゲル状物との間に間隙を生じ、そこから湿気
が侵して腐食や絶縁不良の原因となる。 ゲル状物中に残存するビニル基が高温で酸化
されるので、酸化性雰囲気における耐熱性が悪
い。 組成物中のポリオルガノハイドロジエンシロ
キサンの量が少ないので、硬化直前の配合作業
の際に、該シロキサンないしそれを含む混合液
の配合誤差で、ゲル状物の柔らかさに著しい差
を生ずる。 特開昭54−15957号公報に示されるようなメ
チルビニルフエニルシロキシ末端基は合成が困
難である。 〔発明が解決しようとする問題点〕 これらの問題を解決するために、特開昭56−
143241号公報では基本的に該水素原子の量を該ビ
ニル基1個あたり0.5〜5個となる量存在せしめ
る組成物が開示され、これによつて上記〜の
問題はほぼ解決されている。しかしながら、これ
らのゲル状に硬化しうる組成物は、いずれも熱衝
撃によりシリコーンゲル内部に亀裂が発生するた
め、光学的接合の目的を達成することは不可能で
あつた。また、光学的接合の用途において近年ガ
ラスの他に透明プラスチツクが使用されはじめて
おり、従来のゲルはこれらのプラスチツクに対し
て粘着性が劣り、熱衝撃により基材からの剥離を
起こすことがあつた。 〔問題点を解決するための手段〕 本発明は、これらの欠点をなくし、基材への粘
着性に優れ、熱衝撃によるシリコーンゲル内の亀
裂や基材からの剥離が発生することがなく、かつ
高温で変色のない安定な光学的接合用ゲル組成物
を提供するものである。 本発明者らは、これらの問題点を解消する組成
物について検討した結果、従来用いられていたポ
リオルガノハイドロジエンシロキサンの代わりに
一般式R1Si(OSiR2 2H)3、(R1,R2は前述の通り)
で表わされるシロキサンを用い、さらに触媒の量
をポリオルガノシロキサンの混合物に対し触媒金
属元素の量として0.01〜30ppmにすることにより
目的を達成することを見出し、本発明を完成する
に至つた。 即ち本発明は、 (A) ケイ素原子に結合せるビニル基が1分子中に
平均0.1〜2.0個存在し、ケイ素原子に結合せる
残余の有機基が脂肪族不飽和を含まぬ置換又は
非置換の1価の炭化水素基であり、25℃におけ
る粘度が50〜100000cPであるポリオルガノシ
ロキサン (B) 一般式 R1Si(OSiR2 2H)3 (式中R1はC1〜C4のアルキル基又はフエニ
ル基、R2はC1〜C4のアルキル基を表わす)で
示されるシロキサン、ケイ素原子に結合せる水
素原子の数が(A)のケイ素原子に結合せるビニル
基1個に対して0.1〜0.8個又は1.5〜3.0個とな
る量 及び (C) 白金系触媒、パラジウム系触媒、及びロジウ
ム系触媒からなる群より選ばれた触媒、(A)と(B)
の合計量に対し触媒金属元素の量として0.01〜
30ppmとなる量 からなることを特徴とする光学的接合用ゲル状組
成物に関する。 本発明で用いられる(A)成分のポリオルガノシロ
キサンは、ケイ素原子に結合せるビニル基を1分
子中に平均0.1〜2.0個、好ましくは0.1〜1.4個有
するものである。ビニル基の量が0.1個より少な
いと、架橋に与らないポリオルガノシロキサンが
増加して、硬化して得られたゲル状物の物理的性
質及び基材への粘着性が著しく低下する。またビ
ニル基の量が2.0個より多いと、高温で変色しな
い柔らかいゲル状物を得るという本発明の特徴を
発揮することができない。 (A)のポリオルガノシロキサンのケイ素原子に結
合せる有機基のうち、前述のビニル基以外のもの
としては、メチル基、エチル基、プロピル基、ブ
チル基、アミノ基、ヘキシル基、オクチル基、デ
シル基、ドデシル基のようなアルキル基、フエニ
ル基のようなアリール基、β−フエニルエチル
基、β−フエニルプロピル基のようなアラルキル
基、及びクロロメチル基、シアノエチル基、3,
3,3−トリフルオロプロピル基のような置換炭
化水素基が例示されるが、合成の容易なこと、未
硬化の状態で取り扱いやすいこと、ゲル状物の耐
熱性や物理的性質から、メチル基であることが好
ましい。また、耐塞性を要求されるときは全有機
基中の8モル%まで、特に高い耐熱性、耐放射線
性、又は高い屈折率を要求されるときは全有機基
中の50モル%までのフエニル基を導入することが
推奨される。粘度は25℃において50〜100000cP、
好ましくは300〜5000cPの範囲から選ばれる。ポ
ツテイングに用いられるときは、500〜1500cPの
範囲が最も好ましい。50cPよりも低いと流れや
すく、また反応後の物理的性質が悪い。また
100000cPを越えると作業性が悪くなる。 (A)のポリオルガノシロキサンのシロキサン骨格
は、直鎖状でも分岐状でもよく、また両者の混合
物でもよいが、合成の容易さと、ゲル状物に適度
の柔らかさを与えることから、実質的に直鎖状で
あることが好ましい。少量の環状ポリオルガノシ
ロキサンが共存しても差し支えないが、ケイ素原
子に結合せるビニル基を有していたとしても反応
性が低く、粘着性を持つたゲル状物の形成には寄
与しない。ポリオルガノシロキサン中のビニル基
は、分子の途中のケイ素原子、末端のケイ素原子
のいずれに結合していてもよいが、反応速速度や
反応によるゲル状物形成効果から、末端のケイ素
原子に結合することが好ましい。 このようなポリオルガノシロキサン(A)は、例え
ば両末端にケイ素原子に結合せるビニル基を有す
るビニル基含有ポリオルガノシロキサンと、ビニ
ル基を含まぬ直鎖状ないし分岐状のポリオルガノ
シロキサンを、必要があればビニル基を含まぬポ
リジオルガノシロキサンと共に前述の粘度範囲を
実現する平均分子量と該ビニル基の量を満足する
ように配合し、硫酸、塩酸、活性白土などの酸触
媒、又は水酸化カリウム、水酸化テトラメチルア
ンモニウムなどのアルカリ触媒の存在下に、常法
によりシロキサンの切断、平衡化を行うことによ
つて合成される。この場合、原料の一部として環
状ポリシロキサン、特にビニル基を含まぬ環状ポ
リシロキサンを併用してもよい。平衡化の後、常
法により触媒を除去し、減圧で加熱することによ
り、副生した、ないし未反応の低分子ポリオルガ
ノシロキサンを除去して精製される。 本発明で用いられる(B)成分のシロキサンは、一
般式R1Si(OSiR2 2H)3で表わされ、(A)のポリオル
ガノシロキサンのビニル基と反応してゲル状物を
形成するもので、本発明の特徴となすものであ
る。 R1としてはメチル基、エチル基、プロピル基、
ブチル基などのアルキル基;及びフエニル基が例
示されるが、合成しやすいこと、良好なゲル状物
を与えることからメチル基又はフエニル基が好ま
しい。また、R2としてはメチル基、エチル基、
プロピル基、ブチル基などのアルキル基が例示さ
れるが、材料の得やすさ、合成のしやすかなどか
らメチル基が好ましい。これらのシロキサンは単
独でも2種以上併用して用いても差し支えなく、
これらは常法によりメチルトリメトキシシラン、
フエニルトリメトキシシランとジメチルクロロシ
ランなどのクロロシランを共加水分解することに
より容易に得られる。 (B)成分の配合量は、(A)成分中のケイ素原子に結
合せるビニル基1個に対して(B)成分中のケイ素原
子に結合せる水素原子が0.1〜0.8個又は1.5〜3.0
個、好ましくは0.3〜0.8個となる量である。0.1個
未満だと、架橋が充分に進行せず、ゲル状物が柔
らかくなりすぎるばかりか、高温での変色が著し
くなる。また、0.8個を越え1.5個未満では、硬化
物がゴム状になつてしまい、さらに3.0個を超え
る量では得られたゲル状物が経時的に硬くなつて
しまう。 本発明で用いられる(C)成分の触媒は、(A)成分の
ビニル基と(B)成分のヒドロシリル基との間の付加
反応を促進するためのもので、塩化白金酸、アル
コール変性塩化白金酸、白金とオレフインとの錯
体、白金とケトン類との錯体、白金とビニルシロ
キサンとの錯体などで例示される白金系触媒、テ
トラキス(トリフエニルホスフイン)パラジウ
ム、パラジウム黒とトリフエニルホスフインとの
混合物などで例示されるパラジウム系触媒、ある
いはロジウム系触媒が使用できるが、触媒効果と
取り扱いの容易さから、白金系触媒が好ましい。
(C)成分の配合量は、(A)と(B)の合計量に対し、触媒
金属元素の量として0.01〜30ppmの範囲となる量
である。0.01ppm未満では付加反応が充分に進行
しないためにゲル状物が柔らかくなりすぎ、また
30ppmを越えると高温での変色が著しくなり、本
発明の特長を発揮できなくなる。 本発明の組成物は、アセチレン系化合物のよう
な反応抑制剤の共存や室温で低活性の白金系触媒
を使用することにより単一容器内に保存してもよ
く、また、例えば(A)と(B)を同一容器で(C)を別容
器、または(A)の一部と(B)、(A)の大部分と(C)という
組合せで別々の容器に保存して、硬化直前に均一
に混合し、減圧脱泡して用いてもよい。また、本
発明の組成物に、必要に応じて無機充填剤を添加
して、用途に応じて作業性、硬化後の硬さ、機械
的強さなどを調節することができる。このような
無機質充填剤としては、煙霧質シリカ、シリカエ
アロゲル、沈澱シリカなどが例示される。また、
トルエン、ヘキサンのような溶剤、ポリジメチル
シロキサンのような粘度調節剤、アルケニル基含
有ポリシロキサンのような付加的ベースポリマ
ー、アセチレンアルコール及びそのポリシロキサ
ンとの反応生成物のような硬化抑制剤などを、本
発明の効果を失わない程度で併用しても差し支え
ない。 〔発明の効果〕 本発明により、常温又は僅かの加熱により基材
に対する優れた粘着性を有し、熱衝撃によるシリ
コーンゲル内部の亀裂や基材からの剥離の発生が
なく、かつ高温での変色及び物性の変化の少ない
安定なゲル状物を形成する光学的接合用ゲル組成
物が得られた。 本発明の組成物は、電気・電子部品、特に光学
的に透明性が要求されるオプテイカルカツプリン
グパツド用や意匠上の価値が重要視される部品の
ポツテイング、エンキヤプシユレーシヨン、人体
模型の製作などに用いられる。 〔実施例〕 以下本発明の実施例を示す。なお実施例中、部
とあるのは全て重量部を表わし、また粘度とある
のは25℃における粘度を表わす。なお、記号Me,
Vi及びPnはそれぞれメチル基、ビニル基及びフ
エニル基を表わす。 実施例 1 下に記すような材料を第1表の配合比により均
一に混合して組成物1〜6を調製した。但し、組
成物1,2は本発明品であり、組成物3〜6は比
較品である。 〈(A) 成分として〉 ポリシロキサンA−1:平均式 で表わされるビニル基を含有するポリジメチルシ
ロキサン。粘度;650cP 〈(B) 成分として〉 B−1:PhSi(OSiMe2H)3で表わされるシロキ
サン B−2:MeSi(OSiMe2H)3で表わされるシロキ
サン B−3:平均式 で表わされるポリメチルハイドロジエンシロキサ
ン。 B−4:平均式 で表わされるポリメチルハイドロジエンシロキサ
ン。 B−5:平均式 で表わされるポリメチルハイドロジエンシロキサ
ン。 〈(C) 成分として〉 C−1:塩化白金酸とテトラメチルテトラビニル
シクロテトラシロキサンを加熱して得られたも
の。 白金含有量;白金として2.0重量%
[Industrial Application Field] The present invention has excellent adhesion to base materials such as plastic, rubber, glass, and metal at room temperature or with slight heating, and is capable of preventing cracks inside the gel and base materials due to thermal shock. The present invention relates to a gel composition for optical bonding that can form a stable gel-like material that does not peel off from the substrate and does not discolor or change physical properties at high temperatures. [Prior Art] Conventionally, various technologies have been known for compositions that can be cured to form gel-like polyorganosiloxanes through an addition reaction between a hydrosilyl group and a silicon-bonded vinyl group.・Widely used as potting materials for electronic devices, encapsulations, and implants in surgical procedures. Regarding such a polyorganosiloxane composition, JP-A-48-17847 discloses that the amount of hydrogen atoms bonded to the silicon atom is one or less per vinyl group bonded to the silicon atom, and The average amount per molecule of organohydrodiene siloxane
A composition in which an amount corresponding to 1.4 to 1.8 is present,
Also, JP-A-54-15957 and JP-A-54-48720
In the publication, the amount of hydrogen atoms per vinyl group is
A composition in which a relatively small amount of around 0.3 to 0.8 is present is disclosed, and as a vinyl group-containing polyorganosiloxane, JP-A-54-15957 discloses polydimethylsiloxane end-capped with methylvinylphenylsiloxy groups. , Japanese Patent Publication No. 54-48720
The publication proposes the use of a polysiloxane containing in one molecule at least two vinyl groups and one hydroxyl group bonded to silicon atoms. However, such compositions that can be cured into a gel-like state or gel-like products obtained therefrom have the following drawbacks in common. Due to its low adhesiveness, it does not adhere to the base material, and when used for potting electronic equipment parts, a gap is created between the part and the gel-like material, and moisture can penetrate through the gap, causing corrosion and poor insulation. . Since the vinyl groups remaining in the gel-like material are oxidized at high temperatures, it has poor heat resistance in an oxidizing atmosphere. Since the amount of polyorganohydrodiene siloxane in the composition is small, errors in blending the siloxane or the mixture containing it during blending immediately before curing can cause a significant difference in the softness of the gel-like product. The methylvinylphenylsiloxy terminal group as shown in JP-A-54-15957 is difficult to synthesize. [Problems to be solved by the invention] In order to solve these problems,
Publication No. 143241 basically discloses a composition in which the hydrogen atoms are present in an amount of 0.5 to 5 per vinyl group, thereby almost solving the above problems. However, in all of these compositions that can be cured into a gel-like state, cracks occur inside the silicone gel due to thermal shock, making it impossible to achieve the purpose of optical bonding. In addition, in recent years, transparent plastics have begun to be used in addition to glass in optical bonding applications, and conventional gels have poor adhesion to these plastics and can sometimes peel off from the base material due to thermal shock. . [Means for Solving the Problems] The present invention eliminates these drawbacks, has excellent adhesion to the base material, and does not cause cracks in the silicone gel or peeling from the base material due to thermal shock. The present invention also provides a stable gel composition for optical bonding that does not discolor at high temperatures. The present inventors investigated compositions that solve these problems, and found that instead of the conventionally used polyorganohydrodiene siloxane, compounds with the general formula R 1 Si (OSiR 2 2 H) 3 , (R 1 , R 2 is as mentioned above)
The present inventors have found that the object can be achieved by using a siloxane represented by the following formula and adjusting the amount of the catalyst metal element to the polyorganosiloxane mixture from 0.01 to 30 ppm, and have completed the present invention. That is, the present invention provides (A) an average of 0.1 to 2.0 vinyl groups bonded to the silicon atom in one molecule, and the remaining organic groups bonded to the silicon atom are substituted or unsubstituted vinyl groups that do not contain aliphatic unsaturation. Polyorganosiloxane (B), which is a monovalent hydrocarbon group and has a viscosity of 50 to 100000 cP at 25°C, has the general formula R 1 Si (OSiR 2 2 H) 3 (wherein R 1 is a C 1 to C 4 alkyl or phenyl group, R 2 represents a C 1 to C 4 alkyl group), the number of hydrogen atoms bonded to the silicon atom is (A) per vinyl group bonded to the silicon atom. an amount of 0.1 to 0.8 or 1.5 to 3.0; and (C) a catalyst selected from the group consisting of a platinum-based catalyst, a palladium-based catalyst, and a rhodium-based catalyst; (A) and (B)
0.01~ as the amount of catalytic metal element relative to the total amount of
The present invention relates to a gel composition for optical bonding, characterized in that the content is 30 ppm. The polyorganosiloxane as component (A) used in the present invention has an average of 0.1 to 2.0, preferably 0.1 to 1.4 vinyl groups bonded to silicon atoms in one molecule. When the amount of vinyl groups is less than 0.1, the amount of polyorganosiloxane that does not participate in crosslinking increases, and the physical properties of the gel-like product obtained by curing and the adhesion to the substrate are significantly reduced. Furthermore, if the amount of vinyl groups is more than 2.0, the feature of the present invention, which is to obtain a soft gel-like material that does not discolor at high temperatures, cannot be exhibited. Among the organic groups bonded to the silicon atom of the polyorganosiloxane (A), those other than the vinyl group mentioned above include methyl group, ethyl group, propyl group, butyl group, amino group, hexyl group, octyl group, decyl group. group, alkyl group such as dodecyl group, aryl group such as phenyl group, aralkyl group such as β-phenylethyl group, β-phenylpropyl group, and chloromethyl group, cyanoethyl group, 3,
Substituted hydrocarbon groups such as 3,3-trifluoropropyl groups are examples, but methyl groups are preferred because of their ease of synthesis, ease of handling in an uncured state, and the heat resistance and physical properties of gel-like products. It is preferable that In addition, when occlusion resistance is required, up to 8 mol% of the total organic groups, and when particularly high heat resistance, radiation resistance, or high refractive index is required, up to 50 mol% of the total organic groups. It is recommended to introduce a phenyl group. Viscosity is 50~100000cP at 25℃,
Preferably, it is selected from the range of 300 to 5000 cP. When used for potting, a range of 500 to 1500 cP is most preferred. If it is lower than 50cP, it will flow easily and the physical properties after reaction will be poor. Also
If it exceeds 100000cP, workability will deteriorate. The siloxane skeleton of the polyorganosiloxane (A) may be linear or branched, or may be a mixture of both, but from the viewpoint of ease of synthesis and imparting appropriate softness to the gel-like material, Preferably, it is linear. It is acceptable for a small amount of cyclic polyorganosiloxane to coexist, but even if it has a vinyl group bonded to a silicon atom, its reactivity is low and it does not contribute to the formation of a sticky gel. The vinyl group in polyorganosiloxane may be bonded to either a silicon atom in the middle of the molecule or a silicon atom at the end of the molecule, but it is preferable to bond to the silicon atom at the end due to the reaction rate and the effect of forming a gel-like substance due to the reaction. It is preferable to do so. Such polyorganosiloxane (A) is made of, for example, a vinyl group-containing polyorganosiloxane that has vinyl groups bonded to silicon atoms at both ends, and a linear or branched polyorganosiloxane that does not contain vinyl groups. If available, it is blended with a polydiorganosiloxane that does not contain vinyl groups to satisfy the average molecular weight and amount of vinyl groups that achieve the above-mentioned viscosity range, and an acid catalyst such as sulfuric acid, hydrochloric acid, activated clay, or potassium hydroxide. It is synthesized by cutting and equilibrating siloxane using conventional methods in the presence of an alkali catalyst such as tetramethylammonium hydroxide. In this case, a cyclic polysiloxane, particularly a cyclic polysiloxane containing no vinyl group, may be used in combination as part of the raw material. After equilibration, the catalyst is removed by a conventional method, and by-product or unreacted low-molecular-weight polyorganosiloxane is removed by heating under reduced pressure, thereby purifying the product. The siloxane component (B) used in the present invention is represented by the general formula R 1 Si (OSiR 2 2 H) 3 and reacts with the vinyl group of the polyorganosiloxane (A) to form a gel-like substance. This is a feature of the present invention. R 1 is a methyl group, an ethyl group, a propyl group,
Examples include an alkyl group such as a butyl group; and a phenyl group; however, a methyl group or a phenyl group is preferred because it is easy to synthesize and provides a good gel-like product. In addition, R 2 is a methyl group, an ethyl group,
Examples include alkyl groups such as propyl group and butyl group, but methyl group is preferred from the viewpoint of ease of obtaining materials and synthesis. These siloxanes may be used alone or in combination of two or more.
Methyltrimethoxysilane and
It can be easily obtained by cohydrolyzing phenyltrimethoxysilane and chlorosilane such as dimethylchlorosilane. The blending amount of component (B) is 0.1 to 0.8 or 1.5 to 3.0 hydrogen atoms to be bonded to the silicon atom in component (B) for each vinyl group bonded to the silicon atom in component (A).
, preferably 0.3 to 0.8. If it is less than 0.1, crosslinking will not proceed sufficiently and the gel-like material will not only become too soft but also become noticeably discolored at high temperatures. Further, if the number exceeds 0.8 and is less than 1.5, the cured product will become rubber-like, and if the number exceeds 3.0, the resulting gel-like material will become hard over time. The catalyst of component (C) used in the present invention is for promoting the addition reaction between the vinyl group of component (A) and the hydrosilyl group of component (B), and is a catalyst of chloroplatinic acid, alcohol-modified platinum chloride, etc. Acids, platinum-based catalysts exemplified by complexes of platinum and olefins, complexes of platinum and ketones, complexes of platinum and vinylsiloxane, tetrakis(triphenylphosphine)palladium, palladium black and triphenylphosphine, etc. Palladium-based catalysts or rhodium-based catalysts such as mixtures of the following can be used, but platinum-based catalysts are preferred from the viewpoint of catalytic effect and ease of handling.
The blending amount of component (C) is such that the amount of the catalytic metal element is in the range of 0.01 to 30 ppm based on the total amount of (A) and (B). If it is less than 0.01 ppm, the addition reaction will not proceed sufficiently and the gel will become too soft.
If it exceeds 30 ppm, discoloration at high temperatures will become significant and the features of the present invention will not be exhibited. The composition of the present invention may be stored in a single container by the presence of a reaction inhibitor such as an acetylenic compound or by using a platinum-based catalyst with low activity at room temperature. Store (B) in the same container and (C) in another container, or store part of (A) in combination with (B), or most of (A) with (C) in separate containers, and store them immediately before hardening. It may be used after uniformly mixing and defoaming under reduced pressure. Furthermore, by adding an inorganic filler to the composition of the present invention as needed, workability, hardness after curing, mechanical strength, etc. can be adjusted depending on the application. Examples of such inorganic fillers include fumed silica, silica aerogel, and precipitated silica. Also,
Solvents such as toluene and hexane, viscosity modifiers such as polydimethylsiloxane, additional base polymers such as alkenyl-containing polysiloxanes, cure inhibitors such as acetylene alcohol and its reaction products with polysiloxanes, etc. , may be used in combination to the extent that the effects of the present invention are not lost. [Effects of the Invention] According to the present invention, the silicone gel has excellent adhesion to the substrate at room temperature or by slight heating, does not cause cracks inside the silicone gel or peels from the substrate due to thermal shock, and does not discolor at high temperatures. A gel composition for optical bonding which forms a stable gel-like material with little change in physical properties was obtained. The composition of the present invention is useful for electrical and electronic parts, especially for potting, encapsulation, and human body parts, such as optical coupling pads that require optical transparency, and parts where design value is important. Used for making models, etc. [Example] Examples of the present invention will be shown below. In the examples, all parts are by weight, and viscosity is the viscosity at 25°C. In addition, the symbol Me,
Vi and Pn represent a methyl group, a vinyl group and a phenyl group, respectively. Example 1 Compositions 1 to 6 were prepared by uniformly mixing the materials shown below according to the blending ratios shown in Table 1. However, compositions 1 and 2 are products of the present invention, and compositions 3 to 6 are comparative products. <(A) As a component> Polysiloxane A-1: Average formula A polydimethylsiloxane containing a vinyl group represented by: Viscosity: 650 cP (as component (B)) B-1: Siloxane represented by PhSi (OSiMe 2 H) 3 B-2: Siloxane represented by MeSi (OSiMe 2 H) 3 B-3: Average formula Polymethylhydrodienesiloxane represented by B-4: Average formula Polymethylhydrodienesiloxane represented by B-5: Average formula Polymethylhydrodienesiloxane represented by <As component (C)> C-1: One obtained by heating chloroplatinic acid and tetramethyltetravinylcyclotetrasiloxane. Platinum content: 2.0% by weight as platinum

【表】 数
硬 化 これらの組成物をそれぞれ50℃で2時間加熱し
たところ、いずれも硬化して、いずれも透明な対
応するゲル状物1〜6を得た。ASTM D−1403
に準拠してゲル状物の針入度を測定したところ、
第2表の初期値に示すような値を得た。 耐熱試験 硬化して得られたゲル状物1〜6を、150℃の
空気循環式オーブン中に入れて、針入度の経時変
化の測定、及び変色の程度をAPHA値で測定を
行つた。その結果は第2表に示す通りである。 熱衝撃試験 No.1〜6の組成物40gを、内径18mm、深さ180
mmのガラス製の試験管に注入し、50℃で2時間加
熱して硬化させたものを、熱衝撃試験機にて−20
℃/2h←→80℃/2hのサイクルで熱衝撃試験を所
定回数行い、ゲル内部の亀裂の有無を目視で確認
した。その結果は第2表に示す通りである。 密着性試験 第1図に示す試験体にスペーサーを当ててNo.1
〜6の組成物を注入し、50℃で2時間加熱して硬
化させた後スペーサーを除去した。これらをオー
トグラフ付引張試験機(島津製作所製)を用い
て、50mm/minで接着面に垂直方向に引張り、最
大引張応力、破断時の伸び、及び凝集破壊率を測
定した。その結果を第2表に示す。
[Table] Number of cures When these compositions were heated at 50° C. for 2 hours, they were all cured to give corresponding transparent gels 1 to 6. ASTM D-1403
When the penetration of the gel-like material was measured according to
Values as shown in the initial values in Table 2 were obtained. Heat Resistance Test Gel products 1 to 6 obtained by curing were placed in an air circulation oven at 150°C, and changes in penetration over time were measured, and the degree of discoloration was measured using APHA values. The results are shown in Table 2. Thermal Shock Test 40g of the compositions No. 1 to 6 were tested at an inner diameter of 18mm and a depth of 180mm.
It was injected into a glass test tube with a diameter of -20 mm and heated at 50℃ for 2 hours to harden.
A thermal shock test was conducted a predetermined number of times with a cycle of ℃/2h←→80℃/2h, and the presence or absence of cracks inside the gel was visually confirmed. The results are shown in Table 2. Adhesion test No.1 by applying a spacer to the test piece shown in Figure 1.
The compositions No. 6 to 6 were injected and cured by heating at 50° C. for 2 hours, and then the spacer was removed. These were pulled in a direction perpendicular to the adhesive surface at 50 mm/min using a tensile tester with an autograph (manufactured by Shimadzu Corporation), and the maximum tensile stress, elongation at break, and cohesive failure rate were measured. The results are shown in Table 2.

【表】 △:ゲル内部に若干
亀裂があるが比較的少ない
×:ゲル全体に亀裂
が発生
この結果より、本発明による組成物は加熱によ
る変色が少なく、さらに耐衝撃性に優れ、密着性
も極めて良好である。 実施例 2 実施例1で用いたポリシロキサンA−1 100
部の代わりに平均式 で表わされるビニル基とフエニル基を含有するポ
リオルガノシロキサンを用いたほかは実施例1の
No.1と同様の配合比で組成物を得た。このものを
50℃で2時間加熱したところ、針入度67、
APHA値10のゲル状物を得た。さらに、150℃で
1000時間加熱したところ、針入度60、APHA値
25と良好な状態を保つた。また実施例1と同じ耐
衝撃性試験及び密着性試験を行つたが、耐衝撃性
試験では100サイクルでも亀裂発生は認められず、
また密着性試験は最大引張応力110gf/cm2、破断
時伸び900%、凝集破壊率100%と良好な値を示し
た。
[Table] △: There are some cracks inside the gel, but there are relatively few cracks.
×: Cracks occur in the entire gel. From these results, the composition according to the present invention shows little discoloration due to heating, has excellent impact resistance, and has extremely good adhesion. Example 2 Polysiloxane A-1 used in Example 1 100
Average formula instead of part Example 1 except that a polyorganosiloxane containing a vinyl group and a phenyl group represented by was used.
A composition was obtained with the same blending ratio as No. 1. this thing
When heated at 50℃ for 2 hours, the penetration was 67.
A gel-like material with an APHA value of 10 was obtained. Furthermore, at 150℃
After heating for 1000 hours, penetration rate was 60 and APHA value
25 and kept in good condition. In addition, the same impact resistance test and adhesion test as in Example 1 were conducted, but no cracks were observed in the impact resistance test even after 100 cycles.
Further, the adhesion test showed good values such as maximum tensile stress of 110 gf/cm 2 , elongation at break of 900%, and cohesive failure rate of 100%.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は密着性試験の測定の供した試験体を示
す図である。尚、図中の数値の単位はmmである。 1……アクリル樹脂板、2……シリコーンゲ
ル。
FIG. 1 is a diagram showing a test specimen used for measurement in an adhesion test. Note that the unit of numerical values in the figure is mm. 1...Acrylic resin board, 2...Silicone gel.

Claims (1)

【特許請求の範囲】 1 (A) ケイ素原子に結合せるビニル基が1分子
中に平均0.1〜2.0個存在し、ケイ素原子に結合
せる残余の有機基が脂肪族不飽和を含まぬ置換
又は非置換の1価の炭化水素基であり、25℃に
おける粘度が50〜100000cPであるポリオルガ
ノシロキサン (B) 一般式 R1Si(OSiR2 2H)3 (式中R1はC1〜C4のアルキル基又はフエニ
ル基、R2はC1〜C4のアルキル基を表わす)で
示されるシロキサン、ケイ素原子に結合せる水
素原子の数が(A)のケイ素原子に結合せるビニル
基1個に対して0.1〜0.8個又は1.5〜3.0個とな
る量 及び (C) 白金系触媒、パラジウム系触媒、及びロジウ
ム系触媒からなる群より選ばれた触媒、(A)と(B)
の合計量に対し触媒金属元素の量として0.01〜
30ppmとなる量 からなることを特徴とする光学的接合用ゲル組成
物。 2 (A)のケイ素原子に結合せるビニル基が分子末
端に存在する、特許請求の範囲第1項記載の組成
物。 3 (A)が実質的に直鎖状ポリオルガノシロキサン
である、特許請求の範囲第1項記載の組成物。 4 (A)のケイ素原子に結合せるビニル基以外の有
機基が、メチル基及びフエニル基からなる群より
選ばれた1価の炭化水素基であり、該フエニル基
の量は全有機基中の50モル%以下である、特許請
求の範囲第1項記載の組成物。 5 (A)のケイ素原子に結合せるビニル基以外の有
機基がメチル基である、特許請求の範囲第4項記
載の組成物。 6 (A)の25℃における粘度が300〜5000cPであ
る、特許請求の範囲第1項記載の組成物。 7 (B)のR1がメチル基又はフエニル基である、
特許請求の範囲第1項記載の組成物。 8 (B)のR2がメチル基である、特許請求の範囲
第1項ないし第7項のいずれかに記載の組成物。 9 (B)の量が、(B)のケイ素原子に結合せる水素原
子の数が(A)のケイ素原子に結合せるビニル基1個
に対して0.3〜0.8個となる量である、特許請求の
範囲第1項記載の組成物。 10 (C)の触媒が白金系触媒である、特許請求の
範囲第1項記載の組成物。
[Claims] 1 (A) An average of 0.1 to 2.0 vinyl groups bonded to the silicon atom exist in one molecule, and the remaining organic groups bonded to the silicon atom are substituted or non-substituted without aliphatic unsaturation. Polyorganosiloxane (B) which is a substituted monovalent hydrocarbon group and has a viscosity of 50 to 100000 cP at 25°C. General formula R 1 Si (OSiR 2 2 H) 3 (wherein R 1 is C 1 to C 4 (A) is an alkyl group or phenyl group, R2 represents a C1 to C4 alkyl group), and the number of hydrogen atoms bonded to the silicon atom is equal to one vinyl group bonded to the silicon atom of (A). (C) a catalyst selected from the group consisting of platinum-based catalysts, palladium-based catalysts, and rhodium-based catalysts; (A) and (B);
0.01~ as the amount of catalytic metal element relative to the total amount of
A gel composition for optical bonding characterized by comprising an amount of 30 ppm. 2. The composition according to claim 1, wherein the vinyl group bonded to the silicon atom of (A) is present at the end of the molecule. 3. The composition of claim 1, wherein (A) is a substantially linear polyorganosiloxane. 4. The organic group other than the vinyl group bonded to the silicon atom in (A) is a monovalent hydrocarbon group selected from the group consisting of a methyl group and a phenyl group, and the amount of the phenyl group is The composition according to claim 1, wherein the content is 50 mol% or less. 5. The composition according to claim 4, wherein the organic group other than the vinyl group bonded to the silicon atom in (A) is a methyl group. 6. The composition according to claim 1, wherein (A) has a viscosity of 300 to 5000 cP at 25°C. 7 (B) R 1 is a methyl group or a phenyl group,
A composition according to claim 1. 8. The composition according to any one of claims 1 to 7, wherein R 2 in (B) is a methyl group. 9. A patent claim in which the amount of (B) is such that the number of hydrogen atoms bonded to the silicon atom of (B) is 0.3 to 0.8 per vinyl group bonded to the silicon atom of (A) The composition according to item 1. 10. The composition according to claim 1, wherein the catalyst in (C) is a platinum-based catalyst.
JP17912785A 1985-08-14 1985-08-14 Gel composition for optical connection Granted JPS6239660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17912785A JPS6239660A (en) 1985-08-14 1985-08-14 Gel composition for optical connection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17912785A JPS6239660A (en) 1985-08-14 1985-08-14 Gel composition for optical connection

Publications (2)

Publication Number Publication Date
JPS6239660A JPS6239660A (en) 1987-02-20
JPH0254861B2 true JPH0254861B2 (en) 1990-11-22

Family

ID=16060460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17912785A Granted JPS6239660A (en) 1985-08-14 1985-08-14 Gel composition for optical connection

Country Status (1)

Country Link
JP (1) JPS6239660A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2582690B2 (en) * 1991-09-13 1997-02-19 信越化学工業株式会社 Silicone gel composition with excellent anti-vibration properties
JPH07268219A (en) * 1994-03-31 1995-10-17 Toray Dow Corning Silicone Co Ltd Silicone gel composition for optical filling
US5446185A (en) * 1994-11-14 1995-08-29 Dow Corning Corporation Alkylhydrido siloxanes
US6169155B1 (en) * 1999-01-14 2001-01-02 Dow Corning Corporation Silicone gel composition and silicone gel produced therefrom
EP1312659A1 (en) * 2000-08-17 2003-05-21 Nippon Sheet Glass Co., Ltd. Adhesive composition and optical device using the same
US6905904B2 (en) * 2002-06-24 2005-06-14 Dow Corning Corporation Planar optical waveguide assembly and method of preparing same
EP2418524A1 (en) * 2003-11-19 2012-02-15 Tomoegawa Paper Co., Ltd. Optical connection structure and optical connection method
EP3996693A1 (en) 2019-07-09 2022-05-18 LTS Lohmann Therapie-Systeme AG Transdermal therapeutic system comprising an active agent-containing layer comprising an acrylic polymer and a skin contact layer comprising a silicone gel adhesive
CN114025748A (en) 2019-07-09 2022-02-08 罗曼治疗系统股份公司 Transdermal therapeutic system comprising an active agent-containing layer comprising a silicone-containing polymer and a skin contact layer comprising a silicone gel adhesive
WO2024189206A1 (en) 2023-03-15 2024-09-19 Lts Lohmann Therapie-Systeme Ag Hexagonal self-adhesive layer structure
WO2024189202A1 (en) 2023-03-15 2024-09-19 Lts Lohmann Therapie-Systeme Ag Medical patch comprising capsaicin
WO2024189213A1 (en) 2023-03-15 2024-09-19 Lts Lohmann Therapie-Systeme Ag Medical patch comprising skin irritating active agent

Also Published As

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