JPS6239660A - Gel composition for optical connection - Google Patents

Gel composition for optical connection

Info

Publication number
JPS6239660A
JPS6239660A JP17912785A JP17912785A JPS6239660A JP S6239660 A JPS6239660 A JP S6239660A JP 17912785 A JP17912785 A JP 17912785A JP 17912785 A JP17912785 A JP 17912785A JP S6239660 A JPS6239660 A JP S6239660A
Authority
JP
Japan
Prior art keywords
group
bonded
silicon atom
amount
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17912785A
Other languages
Japanese (ja)
Other versions
JPH0254861B2 (en
Inventor
Tsuneo Mogi
茂木 恒雄
Norio Sato
則夫 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Momentive Performance Materials Japan LLC
Original Assignee
Toshiba Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Silicone Co Ltd filed Critical Toshiba Silicone Co Ltd
Priority to JP17912785A priority Critical patent/JPS6239660A/en
Publication of JPS6239660A publication Critical patent/JPS6239660A/en
Publication of JPH0254861B2 publication Critical patent/JPH0254861B2/ja
Granted legal-status Critical Current

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Abstract

PURPOSE:To provide the titled composition having excellent adhesivity to substrate, resistant to the internal crack of gel and the peeling from the substrate caused by thermal shock, and capable of forming a gel resistant to discoloration and variation of physical properties at high temperature, by compounding a specific polyorganosiloxane with specific amount of a specific siloxane and a catalyst. CONSTITUTION:The objective composition can be produced by compounding (A) a polyorganosiloxane having a viscosity of 50-10,000cp and containing 0.1-2 vinyl groups bonded to Si atom in one molecule, wherein the other organic group bonded to the Si atom is a (substituted) univalent hydrocarbon group free from aliphatic unsaturated bond (e.g. methyl group) with (B) a siloxane of formula (R<1> is 1-4C alkyl or phenyl; R<2> is 1-4C alkyl) and (C) a catalyst selected from platinum-based catalyst, palladium-based catalyst and rhodium-based catalyst. The number of H atoms bonded to Si atom of the component B is 0.1-0.8 or 1.5-3.0 based on one vinyl group bonded to Si atom of the component A, and the amount of metallic element of the component C is 0.01-30ppm based on the sum of the components A and B.

Description

【発明の詳細な説明】 C産業上の利用分野〕 本発明は、常温又は僅かの加熱により、プラスチック、
ゴム、ガラスや金属などの基材に対して優れた粘着性を
有し、熱衝撃によるゲル内部の亀裂や基材からの剥離を
生じることがなく、かつ高温での変色及び物性変化のな
い安定なゲル状物を形成しうる光学的接合用ゲル組成物
に関する。
[Detailed Description of the Invention] C. Industrial Application Field] The present invention provides the ability to process plastics,
It has excellent adhesion to base materials such as rubber, glass, and metal, does not cause cracks inside the gel or peels from the base material due to thermal shock, and is stable without discoloration or physical property changes at high temperatures. The present invention relates to a gel composition for optical bonding that can form a gel-like material.

〔従来の技術〕[Conventional technology]

従来、ヒドロシリル基とケイ素に結合したビニル基との
付加反応によって硬化してゲル状のポリオルガノシロキ
サンを形成しうる組成物については各種の技術が知られ
ており、電気・電子機器のボッティング、エンキャプシ
ュレーション、外科手術における埋込材などとして広く
用いられている。
Conventionally, various techniques have been known for compositions that can be cured to form gel-like polyorganosiloxane through an addition reaction between a hydrosilyl group and a silicon-bonded vinyl group. It is widely used as an encapsulation material and as an implant in surgical procedures.

このようなポリオルガノシロキサン組成物としては、特
開昭48−17847号公報には、ケイ素原子に結合せ
る水素原子の量を、ケイ素原子に結合せるビニル基1個
あたり1個以下で、かつポリオルガノハイドロジエンシ
ロキサン1分子中に平均1.4〜1.8個に相当する量
存在せしめる組成物が、また特開昭54−15957号
公報及び特開昭54−48720号公報に、該水素原子
の量を該ビニル基1個当り0.3〜0.8付近という、
比較的少量存在せしめる組成物が開示され、また、ビニ
ル基含有ポリオルガノシロキサンとして、特開昭54−
15957号公報ではメチルビニルフェニルシロキシ基
で末端封鎖されたポリジメチルシロキサン、特開昭54
−48720号公報ではケイ素原子に結合せる少なくと
も2個のビニル基と1個の水酸基を1分子中に含有する
ポリシロキサンを用いることが提案されている。
Regarding such a polyorganosiloxane composition, JP-A-48-17847 discloses that the amount of hydrogen atoms bonded to the silicon atom is one or less per vinyl group bonded to the silicon atom, and JP-A-54-15957 and JP-A-54-48720 disclose compositions in which the hydrogen atoms are present in an average amount of 1.4 to 1.8 in one molecule of organohydrogensiloxane. The amount of is around 0.3 to 0.8 per vinyl group,
A composition in which a relatively small amount of polyorganosiloxane is present is disclosed, and as a vinyl group-containing polyorganosiloxane, JP-A-54-
No. 15957 discloses polydimethylsiloxane terminal-capped with methylvinylphenylsiloxy groups,
48720 proposes the use of a polysiloxane containing in one molecule at least two vinyl groups bonded to silicon atoms and one hydroxyl group.

しかし、このようなゲル状に硬化しうる組成物ないしそ
れより得られたゲル状物には、共通して次のような欠点
がある。
However, such compositions that can be cured into a gel-like state or gel-like products obtained therefrom have the following drawbacks in common.

■ 粘着性が小さいため基材に密着せず、電子機器部品
などのポツティングに用いた場合、部品とゲル状物との
間に間隙を生じ、そこから湿気が侵入して腐食や絶縁不
良の原因となる。
■ Because the adhesiveness is low, it does not adhere to the base material, and when used for potting electronic equipment parts, gaps are created between the parts and the gel-like material, which allows moisture to enter, causing corrosion and poor insulation. becomes.

■ ゲル状物中に残存するビニル基が高温で酸化される
ので、酸化性雰囲気における耐熱性が悪い。
(2) The vinyl groups remaining in the gel are oxidized at high temperatures, resulting in poor heat resistance in an oxidizing atmosphere.

■ 組成物中のポリオルガノハイドロジエンシロキサン
の量が少ないので、硬化直前の配合作業の際に、該シロ
キサンないしそれを含む混合液の配合誤差で、ゲル状物
の柔らかさに著しい差を生ずる。
(2) Since the amount of polyorganohydrodiene siloxane in the composition is small, errors in blending the siloxane or the mixture containing it during blending immediately before curing can cause a significant difference in the softness of the gel-like product.

■ 特開昭54−15957号公報に示されるようなメ
チルビニルフェニルシロキシ末端基は合成が困難である
(2) It is difficult to synthesize the methylvinylphenylsiloxy end group as shown in JP-A-54-15957.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

これらの問題を解決するために、特開昭56−1432
41号公報では基本的に該水素原子の量を該ビニル基1
個あたり0.5〜5個となる量存在せしめる組成物が開
示され、これによって上記■〜■の問題はほぼ解決され
ている。しかしながら、これらのゲル状に硬化しうる組
成物は、いずれも熱衝撃によりシリコーンゲル内部に亀
裂が発生するため、光学的接合の目的を達成することは
不可能であった。また、光学的接合の用途において近年
ガラスの他に透明プラスチックが使用されはじめており
、従来のゲルはこれらのプラスチックに対して粘着性が
劣り、熱衝撃により基材からの工11離を起こすことが
あった。
In order to solve these problems, Japanese Patent Application Laid-Open No. 56-1432
In Publication No. 41, the amount of hydrogen atoms is basically determined by the vinyl group 1
A composition is disclosed in which the above-mentioned problems 1 to 2 are present in an amount of 0.5 to 5 per piece, thereby almost solving the above-mentioned problems. However, in all of these compositions that can be cured into a gel form, cracks occur inside the silicone gel due to thermal shock, so it has been impossible to achieve the purpose of optical bonding. In addition, in recent years, transparent plastics have begun to be used in addition to glass in optical bonding applications, and conventional gels have poor adhesion to these plastics and can cause separation from the base material due to thermal shock. there were.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、これらの欠点をなくし、基材への粘着性に優
れ、熱衝撃によるシリコーンゲル内の亀裂や基材からの
剥離が発生することがなく、かつ高温で変色のない安定
な光学的接合用ゲル組成物を提供するものである。
The present invention eliminates these drawbacks, and provides excellent adhesion to substrates, no cracks in the silicone gel due to thermal shock, no peeling from the substrate, and stable optical properties that do not discolor at high temperatures. A bonding gel composition is provided.

本発明者らは、これらの問題点を解消する組成物につい
て検討した結果、従来用いられていたポリオルガノハイ
ドロジエンシロキサンの代わりに一般式 R’SI (
OSIR22H) s  (R’ + R”は前述の通
り)で表わされるシロキサンを用い、さらに触媒の量を
ポリオルガノシロキサンの混合物に対し触媒金属元素の
量として0.01〜30ppmにすることにより目的を
達成することを見出し、本発明を完成するに至った。
The present inventors investigated a composition that would solve these problems, and found that instead of the conventionally used polyorganohydrodiene siloxane, the general formula R'SI (
The purpose was achieved by using a siloxane represented by OSIR22H) s (R' + R'' is as described above) and by adjusting the amount of catalyst to 0.01 to 30 ppm as the amount of catalytic metal element relative to the polyorganosiloxane mixture. The present invention has been completed based on this discovery.

即ち本発明は、 (A)ケイ素原子に結合せるビニル基が1分子中に平均
0.1〜2.0個存在し、ケイ素原子に結合せる残余の
有機基が脂肪族不飽和を含まぬ置換又は非置換の1価の
炭化水素基であり、25℃における粘度が50〜100
,000 cPであるポリオルガノシロキサン (B)  一般式 %式%) (式中R1はC8〜C4のアルキル基又はフェニル基、
RZはC3〜C4のアルキル基を表わす)で示されるシ
ロキサン、ケイ素原子に結合せる水素原子の数が(八)
のケイ素原子に結合せるビニル基1個に対して0.1〜
0.8個又は1.5〜3.0個となる量 及び (C)白金系触媒、パラジウム系触媒、及びロジウム系
触媒からなる群より選ばれた触媒、(A)と(B)の合
計量に対し触媒金属元素の量として0.01〜30pp
mとなる量 からなることを特徴とする光学的接合用ゲル状組成物に
関する。
That is, the present invention provides (A) an average of 0.1 to 2.0 vinyl groups to be bonded to the silicon atom in one molecule, and the remaining organic groups to be bonded to the silicon atom are substituted with no aliphatic unsaturation. or an unsubstituted monovalent hydrocarbon group with a viscosity of 50 to 100 at 25°C
,000 cP polyorganosiloxane (B) general formula % formula %) (wherein R1 is a C8 to C4 alkyl group or phenyl group,
RZ represents a C3-C4 alkyl group), the number of hydrogen atoms bonded to the silicon atom is (8)
0.1 to 1 vinyl group bonded to silicon atom
an amount of 0.8 or 1.5 to 3.0, and (C) a catalyst selected from the group consisting of platinum-based catalysts, palladium-based catalysts, and rhodium-based catalysts; the sum of (A) and (B); 0.01 to 30 pp as the amount of catalytic metal element relative to the amount
The present invention relates to a gel-like composition for optical bonding, characterized in that the composition comprises an amount of m.

本発明で用いられる(A)成分のポリオルガノシロキサ
ンは、ケイ素原子に結合せるビニル基を1分子中に平均
0.1〜2.0個、好ましくは0.1〜1.4個有する
ものである。ビニル基の量が0.1個より少ないと、架
橋に与らないポリオルガノシロキサンが増加して、硬化
して得られたゲル状物の物理的性質及び基材への粘着性
が著しく低下する。またビニル基の量が2.0個より多
いと、高温で変色しない柔らかいゲル状物を得るという
本発明の特徴を発揮することができない。
The polyorganosiloxane as component (A) used in the present invention has an average of 0.1 to 2.0, preferably 0.1 to 1.4 vinyl groups bonded to silicon atoms in one molecule. be. If the amount of vinyl groups is less than 0.1, the amount of polyorganosiloxane that does not participate in crosslinking will increase, and the physical properties of the gel-like product obtained by curing and the adhesion to the substrate will decrease significantly. . Moreover, if the amount of vinyl groups is more than 2.0, the characteristic of the present invention, which is to obtain a soft gel-like material that does not discolor at high temperatures, cannot be exhibited.

(A)のポリオルガノシロキサンのケイ素原子に結合せ
る有m基のうち、前述のビニル基以外のものとしては、
メチル基、エチル基、プロピル基、ブチル基、アミノ基
、ヘキシル基、オクチル基、デシル基、ドデシル基のよ
うなアルキル基、フェニル基のようなアリール基、β−
フェニルエチル基、β−フェニルプロピル基のようなア
ラルキル基、及びクロロメチル基、シアノエチルl、3
,3.3− )リフルオロプロピル基のような置換炭化
水素基が例示されるが、合成の容易なこと、未硬化の状
態で取り扱いやすいこと、ゲル状物の耐熱性や物理的性
質から、メチル基であることが好ましい。また、耐寒性
を要求されるときは全有機基中の8モル%まで、特に高
い耐熱性、耐放射線性、又は高い屈折率を要求されると
きは全有機基中の50モル%までのフェニル基を導入す
ることが推奨される。粘度は25℃において50〜10
0.000cP 、好ましくは300〜5,0OOcP
の範囲から選ばれる。ボッティングに用いられるときは
、500〜1 、500cPの範囲が最も好ましい。5
0cPよりも低いと流れやすく、また反応後の物理的性
質が悪い。また100.000cPを越えると作業性が
悪くなる。
Among the m groups bonded to the silicon atom of the polyorganosiloxane (A), those other than the vinyl group mentioned above are:
Alkyl groups such as methyl group, ethyl group, propyl group, butyl group, amino group, hexyl group, octyl group, decyl group, dodecyl group, aryl group such as phenyl group, β-
Aralkyl groups such as phenylethyl group, β-phenylpropyl group, and chloromethyl group, cyanoethyl l,3
, 3.3-) Substituted hydrocarbon groups such as refluoropropyl groups are exemplified, but because of their ease of synthesis, ease of handling in an uncured state, and the heat resistance and physical properties of gel-like products, A methyl group is preferred. In addition, phenyl may contain up to 8 mol% of all organic groups when cold resistance is required, and up to 50 mol% of all organic groups when particularly high heat resistance, radiation resistance, or high refractive index is required. It is recommended to introduce groups. Viscosity is 50-10 at 25℃
0.000cP, preferably 300-5,0OOcP
selected from the range. When used in botting, a range of 500 to 1,500 cP is most preferred. 5
If it is lower than 0 cP, it will flow easily and the physical properties after reaction will be poor. Moreover, if it exceeds 100,000 cP, workability will deteriorate.

(八)のポリオルガノシロキサンのシロキサン骨格は、
直鎖状でも分岐状でもよく、また両者の混合物でもよい
が、合成の容易さと、ゲル状物に適度の柔らかさを与え
ることから、実質的に直鎖状であることが好ましい。少
量の環状ポリオルガノシロキサンが共存しても差し支え
ないが、ケイ素原子に結合せるビニル基を有していたと
しても反応性が低く、粘着性を持ったゲル状物の形成に
は寄与しない。ポリオルガノシロキサン中のビニル基は
、分子の途中のケイ素原子、末端のケイ素原子のいずれ
に結合していてもよいが、反応速度や反応によるゲル状
物形成効果から、末端のケイ素原子に結合することが好
ましい。
The siloxane skeleton of the polyorganosiloxane (8) is
Although it may be linear or branched, or a mixture of both, it is preferably substantially linear for ease of synthesis and for imparting appropriate softness to the gel-like material. It is acceptable for a small amount of cyclic polyorganosiloxane to coexist, but even if it has a vinyl group bonded to a silicon atom, the reactivity is low and it does not contribute to the formation of a sticky gel. The vinyl group in polyorganosiloxane may be bonded to either a silicon atom in the middle of the molecule or a silicon atom at the end of the molecule, but it is preferable to bond to the silicon atom at the end due to the reaction rate and the effect of forming a gel-like substance due to the reaction. It is preferable.

このようなポリオルガノシロキサン(A)は、例えば両
末端にケイ素原子に結合せるビニル基を有するビニル基
含有ポリオルガノシロキサンと、ビニル基を含まぬ直鎖
状ないし分岐状のポリオルガノシロキサンを、必要があ
ればビニル基を含まぬポリジオルガノシロキサンと共に
前述の粘度範囲を実現する平均分子量と該ビニル基の量
を満足するように配合し、硫酸、塩酸、活性白土などの
酸触媒、又は水酸化カリウム、水酸化テトラメチルアン
モニウムなどのアルカリ触媒の存在下に、常法によりシ
ロキサンの切断、平衡化を行うことによって合成される
。この場合、原料の一部として環状ポリシロキサン、特
にビニル基を含まぬ環状ポリシロキサンを併用してもよ
い。平衡化の後、常法により触媒、を除去し、減圧で加
熱することにより、副生じた、ないし未反応の低分子ポ
リオルガノシロキサンを除去して精製される。
Such polyorganosiloxane (A) includes, for example, a vinyl group-containing polyorganosiloxane that has a vinyl group bonded to a silicon atom at both ends, and a linear or branched polyorganosiloxane that does not contain a vinyl group. If available, it is blended with a polydiorganosiloxane that does not contain vinyl groups to satisfy the average molecular weight and amount of vinyl groups that achieve the above-mentioned viscosity range, and an acid catalyst such as sulfuric acid, hydrochloric acid, activated clay, or potassium hydroxide. It is synthesized by cutting and equilibrating siloxane using conventional methods in the presence of an alkali catalyst such as tetramethylammonium hydroxide. In this case, a cyclic polysiloxane, particularly a cyclic polysiloxane containing no vinyl group, may be used in combination as part of the raw material. After equilibration, the catalyst is removed by a conventional method, and by-product or unreacted low molecular weight polyorganosiloxane is removed by heating under reduced pressure, thereby purifying the product.

本発明で用いられる(B)成分のシロキサンは、一般式
 R’5i(OSiR”□H)3で表わされ、(八)の
ポリオルガノシロキサンのビニル基と反応してゲル状物
を形成するもので、本発明の特徴となすものである。
The siloxane (B) component used in the present invention is represented by the general formula R'5i(OSiR"□H)3, and reacts with the vinyl group of the polyorganosiloxane (8) to form a gel-like substance. This is a feature of the present invention.

R1としてはメチル基、エチル基、プロピル基、ブチル
基などのアルキル基;及びフェニル基が例示されるが、
合成しやすいこと、良好なゲル状物を与えることからメ
チル基又はフェニル基が好ましい。また、R2としては
メチル基、エチル基、プロピル基、ブチル基などのアル
キル基が例示されるが、材料の得やすさ、合成のしやす
かなどからメチル基が好ましい。これらのシロキサンは
単独でも2種以上併用して用いても差し支えな(、これ
らは常法によりメチルトリメトキシシラン、フェニルト
リメトキシシランとジメチルクロロシランなどのクロロ
シランを共加水分解することにより容易に得られる。
Examples of R1 include alkyl groups such as methyl group, ethyl group, propyl group, butyl group; and phenyl group,
A methyl group or a phenyl group is preferred because it is easy to synthesize and provides a good gel-like product. Examples of R2 include alkyl groups such as methyl, ethyl, propyl, and butyl groups, and methyl is preferred from the viewpoint of ease of obtaining materials and synthesis. These siloxanes may be used alone or in combination of two or more (these can be easily obtained by cohydrolyzing chlorosilanes such as methyltrimethoxysilane, phenyltrimethoxysilane, and dimethylchlorosilane by a conventional method). .

(B)成分の配合量は、(A)成分中のケイ素原子に結
合せるビニル基1個に対して(B)成分中のケイ素原子
に結合せる水素原子が0.1〜0.8個又は1.5〜3
.0個、好ましくは0.3〜0.8個となる量である。
The blending amount of component (B) is 0.1 to 0.8 hydrogen atoms to be bonded to the silicon atom in component (B) for each vinyl group bonded to the silicon atom in component (A). 1.5-3
.. The amount is 0, preferably 0.3 to 0.8.

0.1個未満だと、架橋が充分に進行せず、ゲル状物が
柔らかくなりすぎるばかりか、高温での変色が著しくな
る。また、0.8個を越え1.5個未満では、硬化物が
ゴム状になってしまい、さらに3.0個を超える量では
得られたゲル状物が経時的に硬くなってしまう。
If it is less than 0.1, crosslinking will not proceed sufficiently, and the gel-like material will not only become too soft, but also become noticeably discolored at high temperatures. Further, if the number exceeds 0.8 and is less than 1.5, the cured product will become rubber-like, and if the number exceeds 3.0, the resulting gel-like material will become hard over time.

本発明で用いられる(C)成分の触媒は、(A)成分の
ビニル基と(B)成分のヒドロシリル基との間の付加反
応を促進するためのもので、塩化白金酸、アルコール変
性塩化白金酸、白金とオレフィンとの錯体、白金とケト
ン類との錯体、白金とビニルシロキサンとの錯体などで
例示される白金系触媒、テトラキス(トリフェニルホス
フィン)パラジウム、パラジウム黒とトリフェニルホス
フィンとの混合物などで例示されるパラジウム系触媒、
あるいはロジウム系触媒が使用できるが、触媒効果と取
り扱いの容易さから、白金系触媒が好ましい。(C)成
分の配合量は、(A)と(B)の合計量に対し、触媒金
属元素の量として0.01〜30ppn+の範囲となる
量である。
The catalyst of component (C) used in the present invention is for promoting the addition reaction between the vinyl group of component (A) and the hydrosilyl group of component (B). Platinum catalysts such as acids, complexes of platinum and olefins, complexes of platinum and ketones, complexes of platinum and vinylsiloxane, tetrakis(triphenylphosphine)palladium, mixtures of palladium black and triphenylphosphine Palladium-based catalysts such as
Alternatively, a rhodium-based catalyst can be used, but a platinum-based catalyst is preferred because of its catalytic effect and ease of handling. The blending amount of component (C) is such that the amount of the catalytic metal element is in the range of 0.01 to 30 ppn+ relative to the total amount of (A) and (B).

0.01ppm未満では付加反応が充分に進行しないた
めにゲル状物が柔らかくなりすぎ、また30ppmを越
えると高温での変色が著しくなり、本発明の特長を発揮
できなくなる。
If it is less than 0.01 ppm, the addition reaction will not proceed sufficiently and the gel-like material will become too soft, and if it exceeds 30 ppm, discoloration at high temperatures will become significant and the features of the present invention will not be exhibited.

本発明の組成物は、アセチレン系化合物のような反応抑
制剤の共存や室温で低活性の白金系触媒を使用すること
により単一容器内に保存してもよく、また、例えば(A
)と(B)を同一容器で(C)を別容器、または(A)
の一部と(Ill) 、(A)の大部分と(C)という
組合せで別々の容器に保存して、硬化直前に均一に混合
し、減圧脱泡して用いてもよい。また、本発明の組成物
に、必要に応じて無機充填剤を添加して、用途に応じて
作業性、硬化後の硬さ、機械的強さなどを調節すること
ができる。このような無機質充填剤としては、煙霧質シ
リカ、シリカエアロゲル、沈澱シリカなどが例示される
。また、トルエン、ヘキサンのような溶剤、ポリジメチ
ルシロキサンのような粘度調節剤、アルケニル基含有ポ
リシロキサンのような付加的ヘースポリマー、アセチレ
ンアルコール及びそのポリシロキサンとの反応生成物の
ような硬化抑制剤などを、本発明の効果を失わない程度
で併用しても差し支えない。
The composition of the present invention may be stored in a single container by the presence of a reaction inhibitor such as an acetylenic compound or by using a platinum-based catalyst with low activity at room temperature.
) and (B) in the same container and (C) in separate containers, or (A)
A portion of (Ill) and most of (A) and (C) may be stored in separate containers, mixed uniformly just before curing, and degassed under reduced pressure before use. Furthermore, by adding an inorganic filler to the composition of the present invention as needed, workability, hardness after curing, mechanical strength, etc. can be adjusted depending on the application. Examples of such inorganic fillers include fumed silica, silica aerogel, and precipitated silica. Also, solvents such as toluene and hexane, viscosity modifiers such as polydimethylsiloxane, additional haze polymers such as alkenyl-containing polysiloxanes, cure inhibitors such as acetylene alcohol and its reaction products with polysiloxanes, etc. There is no problem even if these are used in combination to the extent that the effects of the present invention are not lost.

〔発明の効果〕〔Effect of the invention〕

本発明により、常温又は僅かの加熱により基材に対する
優れた粘着性を有し、熱衝撃によるシリコーンゲル内部
の亀裂や基材からの剥離の発生がなく、かつ高温での変
色及び物性の変化の少ない安定なゲル状物を形成する光
学的接合用ゲル組成物が得られた。
According to the present invention, the silicone gel has excellent adhesion to the substrate at room temperature or by slight heating, does not cause cracks inside the silicone gel or peels from the substrate due to thermal shock, and does not discolor or change physical properties at high temperatures. A gel composition for optical bonding that forms a stable gel-like substance with a small amount was obtained.

本発明の組成物は、電気・電子部品、特に光学的に透明
性が要求されるオプティカルカップリングバンド用や意
匠上の価値が重要視される部品のボッティング、エンキ
ャプシュレーション、人体模型の製作などに用いられる
The composition of the present invention is useful for botting, encapsulation, and encapsulation of electrical/electronic parts, especially optical coupling bands that require optical transparency, parts where design value is important, and human body models. Used for manufacturing, etc.

〔実 施 例〕〔Example〕

以下本発明の実施例を示す。なお実施例中、部とあるの
は全て重量部を表わし、また粘度とあるのは25℃にお
ける粘度を表わす。なお、記号Me、 Vi及びphは
それぞれメチル基、ビニル基及びフェニル基を表わす。
Examples of the present invention will be shown below. In the examples, all parts are by weight, and viscosity is the viscosity at 25°C. Note that the symbols Me, Vi, and ph represent a methyl group, a vinyl group, and a phenyl group, respectively.

実施例1 下に記すような材料を第1表の配合比により均一に混合
して組成物1〜6を調製した。但し、組成物1,2は本
発明品であり、組成物3〜6は比較品である。
Example 1 Compositions 1 to 6 were prepared by uniformly mixing the materials shown below according to the compounding ratios shown in Table 1. However, compositions 1 and 2 are products of the present invention, and compositions 3 to 6 are comparative products.

〈(A)成分として〉 ポリシロキサンA−1:平均式 で表わされるビニル基を含有するポリジメチルシロキサ
ン。粘度; 650cP <(B)成分として〉 B −1: PhSi(OSiMeJ)3で表わされる
シロキサン B −2: MeSi(OSiMeJ)iで表わされる
シロキサン B−3:平均式 で表わされるポリメチルハイドロジエンシロキサン。
<As component (A)> Polysiloxane A-1: Polydimethylsiloxane containing a vinyl group represented by the average formula. Viscosity: 650 cP <As component (B)> B-1: Siloxane represented by PhSi(OSiMeJ)3 B-2: Siloxane represented by MeSi(OSiMeJ)i B-3: Polymethylhydrodiene siloxane represented by the average formula .

B−4:平均式 で表わされるポリメチルハイドロジエンシロキサン。B-4: Average formula Polymethylhydrodienesiloxane represented by

B−5=平均式 で表わされるポリメチルハイドロジエンシロキサン。B-5=average formula Polymethylhydrodienesiloxane represented by

<(C)成分として〉 C−1:塩化白金酸とテトラメチルテトラビニルシクロ
テトラシロキサンを加熱して得られたもの。
<As component (C)> C-1: One obtained by heating chloroplatinic acid and tetramethyltetravinylcyclotetrasiloxane.

白金含有量;白金として2.0重量% 裂−一二匿 これらの組成物をそれぞれ50℃で2時間加熱したとこ
ろ、いずれも硬化して、いずれも透明な対応するゲル状
物1〜6を得た。ASTM D−1403に準拠してゲ
ル状物の針入度を測定したところ、第2表の初期値に示
すような値を得た。
Platinum content: 2.0% by weight as platinum When these compositions were heated at 50°C for 2 hours, they all cured and the corresponding transparent gels 1 to 6 were formed. Obtained. When the penetration degree of the gel-like material was measured in accordance with ASTM D-1403, the values shown in the initial values in Table 2 were obtained.

耐熱試験 硬化して得られたゲル状物1〜6を、150℃の空気循
環式オーブン中に入れて、針入度の経時変化の測定、及
び変色の程度をAPHA値で測定を行った。その結果は
第2表に示す通りである。
Heat Resistance Test The gels 1 to 6 obtained by curing were placed in an air circulation oven at 150° C., and the change in penetration over time was measured, and the degree of discoloration was measured using the APHA value. The results are shown in Table 2.

然五裟成塘 魚1〜6の組成物40gを、内径18mm、深さ180
mmのガラス製の試験管に注入し、50°Cで2時間加
熱して硬化させたものを、熱衝撃試験機にて=20℃/
2h  ←→80℃/2hのサイクルで熱衝撃試験を所
定回数行い、ゲル内部の亀裂の有無を目視で確認した。
40g of the composition of Zan Wuchengtang fish 1 to 6 was placed in a tube with an inner diameter of 18 mm and a depth of 180 mm.
It was injected into a glass test tube (mm) and heated at 50°C for 2 hours to harden, and then tested in a thermal shock tester at 20°C
A thermal shock test was carried out a predetermined number of times in a cycle of 2h←→80°C/2h, and the presence or absence of cracks inside the gel was visually confirmed.

その結果は第2表に示す通りである。The results are shown in Table 2.

蜜j寸UK狡 第1図に示す試験体にスペーサーを当てて嵐1〜6の組
成物を注入し、50℃で2時間加熱して硬化させた後ス
ペーサーを除去した。これらをオートグラフ付引張試験
機(島津製作所製)を用いて、50mm/minで接着
面に垂直方向に引張り、最大引張応力、破断時の伸び、
及び凝集破壊率を測定した。その結果を第2表に示す。
A spacer was applied to the test specimen shown in FIG. 1, and the compositions of Arashi 1 to 6 were injected thereinto, and after curing by heating at 50° C. for 2 hours, the spacer was removed. Using a tensile tester with an autograph (manufactured by Shimadzu Corporation), these were pulled in a direction perpendicular to the adhesive surface at 50 mm/min to determine the maximum tensile stress, elongation at break,
and cohesive failure rate were measured. The results are shown in Table 2.

この結果より、本発明による組成物は加熱による変色が
少なく、さらに耐衝撃性に優れ、密着性も極めて良好で
ある。
These results show that the composition according to the present invention shows little discoloration due to heating, has excellent impact resistance, and has extremely good adhesion.

実施例2 実施例1で用いたポリシロキサンA−1100部の代わ
りに平均式 で表わされるビニル基とフェニル基を含有するポリオル
ガノシロキサンを用いたほかは実施例1のl’hlと同
様の配合比で組成物を得た。このものを50°Cで2時
間加熱したところ、針入度67、A P I+ A値1
0のゲル状物を得た。さらに、150℃で1000時間
加熱したところ、針入度60、APHA値25と良好な
状態を保った。また実施例1と同じ耐衝撃性試験及び密
着性試験を行ったが、耐衝撃性試験では100サイクル
でも亀裂発生は認められず、また密着性試験は最大引張
応力110gf/cm2、破断時伸び900%、凝集破
壊率100%と良好な値を示した。
Example 2 The same formulation as l'hl in Example 1 except that a polyorganosiloxane containing vinyl groups and phenyl groups represented by the average formula was used instead of 1100 parts of polysiloxane A-1 used in Example 1. A composition was obtained by the ratio. When this material was heated at 50°C for 2 hours, the penetration was 67 and the A P I + A value was 1.
0 gel-like material was obtained. Furthermore, when it was heated at 150° C. for 1000 hours, it remained in good condition with a penetration of 60 and an APHA value of 25. In addition, the same impact resistance test and adhesion test as in Example 1 were conducted, but in the impact resistance test, no cracking was observed even after 100 cycles, and in the adhesion test, the maximum tensile stress was 110 gf/cm2, and the elongation at break was 900. %, and the cohesive failure rate was 100%, which was a good value.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は密着性試験の測定の供した試験体を示す図であ
る。尚、図中の数値の単位はmmである。 1・・・アクリル樹脂板 2・・・シリコーンゲル
FIG. 1 is a diagram showing a test specimen used for measurement in an adhesion test. Note that the unit of numerical values in the figure is mm. 1... Acrylic resin plate 2... Silicone gel

Claims (1)

【特許請求の範囲】 1(A)ケイ素原子に結合せるビニル基が1分子中に平
均0.1〜2.0個存在し、ケイ素原子に結合せる残余
の有機基が脂肪族不飽和を含まぬ置換又は非置換の1価
の炭化水素基であり、25℃における粘度が50〜10
0,000cPであるポリオルガノシロキサン(B)一
般式 R^1Si(OSiR^2_2H)_3 (式中R^1はC_1〜C_4のアルキル基又はフェニ
ル基、R^2はC_1〜C_4のアルキル基を表わす)
で示されるシロキサン、ケイ素原子に結合せる水素原子
の数が(A)のケイ素原子に結合せるビニル基1個に対
して0.1〜0.8個又は1.5〜3.0個となる量及
び (C)白金系触媒、パラジウム系触媒、及びロジウム系
触媒からなる群より選ばれた触媒、(A)と(B)の合
計量に対し触媒金属元素の量として0.01〜30pp
mとなる量 からなることを特徴とする光学的接合用ゲル組成物。 2(A)のケイ素原子に結合せるビニル基が分子末端に
存在する、特許請求の範囲第1項記載の組成物。 3(A)が実質的に直鎖状ポリオルガノシロキサンであ
る、特許請求の範囲第1項記載の組成物。 4(A)のケイ素原子に結合せるビニル基以外の有機基
が、メチル基及びフェニル基からなる群より選ばれた1
価の炭化水素基であり、該フェニル基の量は全有機基中
の50モル%以下である、特許請求の範囲第1項記載の
組成物。 5(A)のケイ素原子に結合せるビニル基以外の有機基
がメチル基である、特許請求の範囲第4項記載の組成物
。 6(A)の25℃における粘度が300〜5,000c
Pである、特許請求の範囲第1項記載の組成物。 7(B)のR^1がメチル基又はフェニル基である、特
許請求の範囲第1項記載の組成物。 8(B)のR^2がメチル基である、特許請求の範囲第
1項ないし第7項のいずれかに記載の組成物。 9(B)の量が、(B)のケイ素原子に結合せる水素原
子の数が(A)のケイ素原子に結合せるビニル基1個に
対して0.3〜0.8個となる量である、特許請求の範
囲第1項記載の組成物。 10(C)の触媒が白金系触媒である、特許請求の範囲
第1項記載の組成物。
[Scope of Claims] 1(A) An average of 0.1 to 2.0 vinyl groups bonded to the silicon atom exist in one molecule, and the remaining organic groups bonded to the silicon atom contain aliphatic unsaturation. It is a substituted or unsubstituted monovalent hydrocarbon group with a viscosity of 50 to 10 at 25°C.
0,000 cP polyorganosiloxane (B) general formula R^1Si(OSiR^2_2H)_3 (wherein R^1 is an alkyl group of C_1 to C_4 or a phenyl group, R^2 is an alkyl group of C_1 to C_4 )
In the siloxane represented by, the number of hydrogen atoms bonded to the silicon atom is 0.1 to 0.8 or 1.5 to 3.0 per vinyl group bonded to the silicon atom of (A). and (C) a catalyst selected from the group consisting of platinum-based catalysts, palladium-based catalysts, and rhodium-based catalysts, 0.01 to 30 pp as the amount of catalytic metal element relative to the total amount of (A) and (B).
A gel composition for optical bonding characterized by comprising an amount of m. 2. The composition according to claim 1, wherein the vinyl group bonded to the silicon atom of 2(A) is present at the end of the molecule. 2. The composition of claim 1, wherein 3(A) is a substantially linear polyorganosiloxane. 4 (A) in which the organic group other than the vinyl group bonded to the silicon atom is selected from the group consisting of methyl group and phenyl group 1
2. The composition according to claim 1, wherein the phenyl group is a valent hydrocarbon group, and the amount of the phenyl group is not more than 50 mol% of the total organic groups. 5. The composition according to claim 4, wherein the organic group other than the vinyl group bonded to the silicon atom in 5(A) is a methyl group. The viscosity of 6(A) at 25°C is 300 to 5,000c
The composition according to claim 1, which is P. The composition according to claim 1, wherein R^1 in 7(B) is a methyl group or a phenyl group. 8. The composition according to any one of claims 1 to 7, wherein R^2 in 8(B) is a methyl group. The amount of 9 (B) is such that the number of hydrogen atoms bonded to the silicon atom of (B) is 0.3 to 0.8 per vinyl group bonded to the silicon atom of (A). A composition according to claim 1. 10. The composition according to claim 1, wherein the catalyst in 10(C) is a platinum-based catalyst.
JP17912785A 1985-08-14 1985-08-14 Gel composition for optical connection Granted JPS6239660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17912785A JPS6239660A (en) 1985-08-14 1985-08-14 Gel composition for optical connection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17912785A JPS6239660A (en) 1985-08-14 1985-08-14 Gel composition for optical connection

Publications (2)

Publication Number Publication Date
JPS6239660A true JPS6239660A (en) 1987-02-20
JPH0254861B2 JPH0254861B2 (en) 1990-11-22

Family

ID=16060460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17912785A Granted JPS6239660A (en) 1985-08-14 1985-08-14 Gel composition for optical connection

Country Status (1)

Country Link
JP (1) JPS6239660A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5332795A (en) * 1991-09-13 1994-07-26 Shin-Etsu Chemical Co., Ltd. Silicone gel composition excellent in damping property
US5446185A (en) * 1994-11-14 1995-08-29 Dow Corning Corporation Alkylhydrido siloxanes
US5548038A (en) * 1994-03-31 1996-08-20 Dow Corning Toray Silicone Co., Ltd. Organosiloxane compositions yielding optically clear, non-yellowing organosiloxane gels
EP1024173A1 (en) * 1999-01-14 2000-08-02 Dow Corning Corporation Silicone gel composition and silicone gel produced therefrom
WO2002014451A1 (en) * 2000-08-17 2002-02-21 Nippon Sheet Glass Co., Ltd. Adhesive composition and optical device using the same
WO2005050273A1 (en) * 2003-11-19 2005-06-02 Tomoegawa Paper Co., Ltd. Optical connection structure and optical connection method
JP4849799B2 (en) * 2002-06-24 2012-01-11 ダウ・コーニング・コーポレイション Planar optical waveguide assembly and method of manufacturing the same
WO2021005118A1 (en) 2019-07-09 2021-01-14 Lts Lohmann Therapie-Systeme Ag Transdermal therapeutic system comprising an active agent-containing layer comprising an acrylic polymer and a skin contact layer comprising a silicone gel adhesive
WO2021005117A1 (en) 2019-07-09 2021-01-14 Lts Lohmann Therapie-Systeme Ag Transdermal therapeutic system comprising an active agent-containing layer comprising a silicone-containing polymer and a skin contact layer comprising a silicone gel adhesive

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5332795A (en) * 1991-09-13 1994-07-26 Shin-Etsu Chemical Co., Ltd. Silicone gel composition excellent in damping property
US5548038A (en) * 1994-03-31 1996-08-20 Dow Corning Toray Silicone Co., Ltd. Organosiloxane compositions yielding optically clear, non-yellowing organosiloxane gels
US5446185A (en) * 1994-11-14 1995-08-29 Dow Corning Corporation Alkylhydrido siloxanes
US5493040A (en) * 1994-11-14 1996-02-20 Dow Corning Corporation Alkylhydrido siloxane fluids
EP1024173A1 (en) * 1999-01-14 2000-08-02 Dow Corning Corporation Silicone gel composition and silicone gel produced therefrom
US6169155B1 (en) 1999-01-14 2001-01-02 Dow Corning Corporation Silicone gel composition and silicone gel produced therefrom
WO2002014451A1 (en) * 2000-08-17 2002-02-21 Nippon Sheet Glass Co., Ltd. Adhesive composition and optical device using the same
JP4849799B2 (en) * 2002-06-24 2012-01-11 ダウ・コーニング・コーポレイション Planar optical waveguide assembly and method of manufacturing the same
WO2005050273A1 (en) * 2003-11-19 2005-06-02 Tomoegawa Paper Co., Ltd. Optical connection structure and optical connection method
US7422375B2 (en) 2003-11-19 2008-09-09 Tomoegawa Paper Co., Ltd. Optical connection structure and optical connection method
WO2021005118A1 (en) 2019-07-09 2021-01-14 Lts Lohmann Therapie-Systeme Ag Transdermal therapeutic system comprising an active agent-containing layer comprising an acrylic polymer and a skin contact layer comprising a silicone gel adhesive
WO2021005117A1 (en) 2019-07-09 2021-01-14 Lts Lohmann Therapie-Systeme Ag Transdermal therapeutic system comprising an active agent-containing layer comprising a silicone-containing polymer and a skin contact layer comprising a silicone gel adhesive

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