JPH0253870U - - Google Patents
Info
- Publication number
- JPH0253870U JPH0253870U JP11319988U JP11319988U JPH0253870U JP H0253870 U JPH0253870 U JP H0253870U JP 11319988 U JP11319988 U JP 11319988U JP 11319988 U JP11319988 U JP 11319988U JP H0253870 U JPH0253870 U JP H0253870U
- Authority
- JP
- Japan
- Prior art keywords
- tip
- soldering iron
- heater
- heating
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 34
- 229910052742 iron Inorganic materials 0.000 claims description 17
- 238000005476 soldering Methods 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Control Of Resistance Heating (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988113199U JP2528124Y2 (ja) | 1988-08-29 | 1988-08-29 | 電気半田ごて |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988113199U JP2528124Y2 (ja) | 1988-08-29 | 1988-08-29 | 電気半田ごて |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0253870U true JPH0253870U (xx) | 1990-04-18 |
| JP2528124Y2 JP2528124Y2 (ja) | 1997-03-05 |
Family
ID=31352824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988113199U Expired - Lifetime JP2528124Y2 (ja) | 1988-08-29 | 1988-08-29 | 電気半田ごて |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2528124Y2 (xx) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0634864U (ja) * | 1991-03-11 | 1994-05-10 | かがつう株式会社 | ハンダこて |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8274011B2 (en) | 2009-01-24 | 2012-09-25 | Hakko Corporation | Soldering device and method of making same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56152166U (xx) * | 1980-04-11 | 1981-11-14 |
-
1988
- 1988-08-29 JP JP1988113199U patent/JP2528124Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56152166U (xx) * | 1980-04-11 | 1981-11-14 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0634864U (ja) * | 1991-03-11 | 1994-05-10 | かがつう株式会社 | ハンダこて |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2528124Y2 (ja) | 1997-03-05 |