JPH025313B2 - - Google Patents
Info
- Publication number
- JPH025313B2 JPH025313B2 JP56091479A JP9147981A JPH025313B2 JP H025313 B2 JPH025313 B2 JP H025313B2 JP 56091479 A JP56091479 A JP 56091479A JP 9147981 A JP9147981 A JP 9147981A JP H025313 B2 JPH025313 B2 JP H025313B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- current density
- thickness
- resist
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 13
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 239000011701 zinc Substances 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 239000000243 solution Substances 0.000 description 17
- 238000005530 etching Methods 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 238000009713 electroplating Methods 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000001035 drying Methods 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9147981A JPS57207392A (en) | 1981-06-16 | 1981-06-16 | Method of producing ultrafine thick film printed circuit board |
| US06/323,337 US4401521A (en) | 1980-11-28 | 1981-11-20 | Method for manufacturing a fine-patterned thick film conductor structure |
| EP81305603A EP0053490B1 (en) | 1980-11-28 | 1981-11-26 | Method for manufacturing a fine-patterned thick film conductor structure |
| DE8181305603T DE3170956D1 (en) | 1980-11-28 | 1981-11-26 | Method for manufacturing a fine-patterned thick film conductor structure |
| AT81305603T ATE13794T1 (de) | 1980-11-28 | 1981-11-26 | Verfahren zur herstellung einer fein gemusterten struktur mit dickschichtleitern. |
| KR1019810004604A KR850001363B1 (ko) | 1980-11-28 | 1981-11-27 | 후막 파인패턴(thick film fine pattern) 도전체(導電體)의 제조방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9147981A JPS57207392A (en) | 1981-06-16 | 1981-06-16 | Method of producing ultrafine thick film printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57207392A JPS57207392A (en) | 1982-12-20 |
| JPH025313B2 true JPH025313B2 (fi) | 1990-02-01 |
Family
ID=14027534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9147981A Granted JPS57207392A (en) | 1980-11-28 | 1981-06-16 | Method of producing ultrafine thick film printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57207392A (fi) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5250570A (en) * | 1975-10-20 | 1977-04-22 | Seiko Instr & Electronics | Method of producing circuit substrate |
| JPS52124172A (en) * | 1976-04-13 | 1977-10-18 | Fuji Photo Film Co Ltd | Method of producing printed circuit substrate |
| JPS5381966A (en) * | 1976-12-27 | 1978-07-19 | Hirotoshi Nomura | Method of producing electric circuit part |
-
1981
- 1981-06-16 JP JP9147981A patent/JPS57207392A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5250570A (en) * | 1975-10-20 | 1977-04-22 | Seiko Instr & Electronics | Method of producing circuit substrate |
| JPS52124172A (en) * | 1976-04-13 | 1977-10-18 | Fuji Photo Film Co Ltd | Method of producing printed circuit substrate |
| JPS5381966A (en) * | 1976-12-27 | 1978-07-19 | Hirotoshi Nomura | Method of producing electric circuit part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57207392A (en) | 1982-12-20 |
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