JPH0252861B2 - - Google Patents

Info

Publication number
JPH0252861B2
JPH0252861B2 JP59099680A JP9968084A JPH0252861B2 JP H0252861 B2 JPH0252861 B2 JP H0252861B2 JP 59099680 A JP59099680 A JP 59099680A JP 9968084 A JP9968084 A JP 9968084A JP H0252861 B2 JPH0252861 B2 JP H0252861B2
Authority
JP
Japan
Prior art keywords
multilayer
inorganic material
alumina
thermal conductivity
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59099680A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60245154A (ja
Inventor
Hirozo Yokoyama
Yoshihiko Imanaka
Kazuaki Kurihara
Kishio Yokochi
Hiromi Ogawa
Nobuo Kamehara
Koichi Niwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59099680A priority Critical patent/JPS60245154A/ja
Publication of JPS60245154A publication Critical patent/JPS60245154A/ja
Publication of JPH0252861B2 publication Critical patent/JPH0252861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers

Landscapes

  • Die Bonding (AREA)
JP59099680A 1984-05-19 1984-05-19 半導体装置実装用多層基板 Granted JPS60245154A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59099680A JPS60245154A (ja) 1984-05-19 1984-05-19 半導体装置実装用多層基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59099680A JPS60245154A (ja) 1984-05-19 1984-05-19 半導体装置実装用多層基板

Publications (2)

Publication Number Publication Date
JPS60245154A JPS60245154A (ja) 1985-12-04
JPH0252861B2 true JPH0252861B2 (enExample) 1990-11-14

Family

ID=14253743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59099680A Granted JPS60245154A (ja) 1984-05-19 1984-05-19 半導体装置実装用多層基板

Country Status (1)

Country Link
JP (1) JPS60245154A (enExample)

Also Published As

Publication number Publication date
JPS60245154A (ja) 1985-12-04

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