JPH0252471U - - Google Patents
Info
- Publication number
- JPH0252471U JPH0252471U JP13215988U JP13215988U JPH0252471U JP H0252471 U JPH0252471 U JP H0252471U JP 13215988 U JP13215988 U JP 13215988U JP 13215988 U JP13215988 U JP 13215988U JP H0252471 U JPH0252471 U JP H0252471U
- Authority
- JP
- Japan
- Prior art keywords
- motherboard
- foot portion
- integrated circuit
- circuit device
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13215988U JPH0642371Y2 (ja) | 1988-10-07 | 1988-10-07 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13215988U JPH0642371Y2 (ja) | 1988-10-07 | 1988-10-07 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0252471U true JPH0252471U (de) | 1990-04-16 |
| JPH0642371Y2 JPH0642371Y2 (ja) | 1994-11-02 |
Family
ID=31388869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13215988U Expired - Lifetime JPH0642371Y2 (ja) | 1988-10-07 | 1988-10-07 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642371Y2 (de) |
-
1988
- 1988-10-07 JP JP13215988U patent/JPH0642371Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0642371Y2 (ja) | 1994-11-02 |