JPH0252352U - - Google Patents
Info
- Publication number
- JPH0252352U JPH0252352U JP13055988U JP13055988U JPH0252352U JP H0252352 U JPH0252352 U JP H0252352U JP 13055988 U JP13055988 U JP 13055988U JP 13055988 U JP13055988 U JP 13055988U JP H0252352 U JPH0252352 U JP H0252352U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- semiconductor component
- metal casing
- hook portion
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000002985 plastic film Substances 0.000 claims 1
- 229920006255 plastic film Polymers 0.000 claims 1
- 239000013013 elastic material Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13055988U JPH0252352U (US20090163788A1-20090625-C00002.png) | 1988-10-04 | 1988-10-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13055988U JPH0252352U (US20090163788A1-20090625-C00002.png) | 1988-10-04 | 1988-10-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252352U true JPH0252352U (US20090163788A1-20090625-C00002.png) | 1990-04-16 |
Family
ID=31385836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13055988U Pending JPH0252352U (US20090163788A1-20090625-C00002.png) | 1988-10-04 | 1988-10-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252352U (US20090163788A1-20090625-C00002.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004207384A (ja) * | 2002-12-24 | 2004-07-22 | Ikeda Electric Co Ltd | 電子部品ユニットの放熱構造 |
-
1988
- 1988-10-04 JP JP13055988U patent/JPH0252352U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004207384A (ja) * | 2002-12-24 | 2004-07-22 | Ikeda Electric Co Ltd | 電子部品ユニットの放熱構造 |
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