JPH0252338U - - Google Patents
Info
- Publication number
- JPH0252338U JPH0252338U JP12867488U JP12867488U JPH0252338U JP H0252338 U JPH0252338 U JP H0252338U JP 12867488 U JP12867488 U JP 12867488U JP 12867488 U JP12867488 U JP 12867488U JP H0252338 U JPH0252338 U JP H0252338U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- protective resin
- copper foil
- holding
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims 3
- 230000002787 reinforcement Effects 0.000 claims 1
Landscapes
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12867488U JPH0252338U (ro) | 1988-09-30 | 1988-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12867488U JPH0252338U (ro) | 1988-09-30 | 1988-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252338U true JPH0252338U (ro) | 1990-04-16 |
Family
ID=31382235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12867488U Pending JPH0252338U (ro) | 1988-09-30 | 1988-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252338U (ro) |
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1988
- 1988-09-30 JP JP12867488U patent/JPH0252338U/ja active Pending