JPH0251377B2 - - Google Patents
Info
- Publication number
- JPH0251377B2 JPH0251377B2 JP512484A JP512484A JPH0251377B2 JP H0251377 B2 JPH0251377 B2 JP H0251377B2 JP 512484 A JP512484 A JP 512484A JP 512484 A JP512484 A JP 512484A JP H0251377 B2 JPH0251377 B2 JP H0251377B2
- Authority
- JP
- Japan
- Prior art keywords
- pot
- molding material
- lower mold
- plunger
- pressure regulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012778 molding material Substances 0.000 claims description 18
- 230000001105 regulatory effect Effects 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2669—Moulds with means for removing excess material, e.g. with overflow cavities
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電子部品等をインサートして封止成形
するためのマルチポツト式のトランスフアー成形
金型に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a multi-pot transfer molding die for inserting and sealing electronic parts and the like.
従来にあつては、ポツトへの成形材料の投入量
のばらつきによる成形材料投入圧力をポツト単位
毎に調整することが困難であり、特に成形材料の
投入量が過剰であると圧力によつてインサートさ
れている敏感な電子部品を破損してしまつたり、
成形品にバリを発生させるという問題があつた。
In the past, it was difficult to adjust the molding material injection pressure for each pot due to variations in the amount of molding material input into the pot, and in particular, if the amount of molding material input was excessive, the insert may damage sensitive electronic components,
There was a problem that burrs were generated on the molded product.
本発明は叙上の従来例の欠点を鑑みれなされた
ものであり、その目的とするところは成形材料の
投入量のばらつきによる成形材料の注入圧力をポ
ツト単位毎に調整可能とすることにある。
The present invention has been made in view of the drawbacks of the conventional examples described above, and its purpose is to make it possible to adjust the injection pressure of molding material on a pot-by-pot basis due to variations in the amount of molding material input.
〔発明の開示〕
本発明封止成形金型は、下金型１に設けた縦孔
２内に下金型１に対して上下動するプランジヤー
３を納め、縦孔２内のプランジヤー３上面部に成
形材料４を投入するためのポツト５を形成し、下
金型１と対面する上金型６のポツト５と対向する
位置に引退可能な圧力調整弁７を設け、圧力調整
弁７をスプリング８によつて突出付勢したもので
あり、成形材料の投入量が多過ぎた場合にはスプ
リングに抗して圧力調整弁が引つ込み、成形材料
の投入量のばらつきが調整されるようになつたも
のである。[Disclosure of the Invention] The sealing mold of the present invention houses a plunger 3 that moves up and down with respect to the lower mold 1 in a vertical hole 2 provided in a lower mold 1, and a top surface portion of the plunger 3 in the vertical hole 2. A retractable pressure regulating valve 7 is provided at a position opposite to the pot 5 of the upper mold 6 facing the lower mold 1, and the pressure regulating valve 7 is set by a spring. 8, and if the amount of molding material input is too large, the pressure regulating valve retracts against the spring, so that variations in the amount of molding material input are adjusted. It is something that has become familiar.
以下、本発明の実施例を添付図により詳述す
る。１は下金型であり、下金型１の上金型６との
合せ面Ｐにはキヤビテイ９とランナー１０が設け
られており、ランナー１０の端には下金型１の上
下方向に貫通する縦孔２が穿孔されている。１１
はガイドピン、３は縦孔２内に下方からスライド
可能に挿入されたプランジヤーであり、下金型１
がガイドピン１１に沿つて下降するとプランジヤ
ー３が縦孔２内を上方へ突出してゆくようになつ
ている。又、縦孔２内のプランジヤー３上面部に
は成形材料４を投入するためのポツト５が形成さ
れている。６は上下動して下金型１と対面する上
金型であり、上金型６にはポツト５と対向して上
下スライド自在な圧力調整弁７が設けられてお
り、圧力調整弁７はストツパー１２によつて上金
型６の合せ面Ｐと面一になつた状態で止まるよう
になつている。そして、この引退可能となつた圧
力調整弁７はスプリング８によつて突出方向へ付
勢されている。このようにしてポツト５やプラン
ジヤー３、圧力調整弁７は複数個所に設けられて
おり、各ポツト５ごとに複数個（図示例では４
個）のキヤビテイー９が連通している。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1 is a lower mold, and a cavity 9 and a runner 10 are provided on the mating surface P of the lower mold 1 with the upper mold 6, and a cavity 9 and a runner 10 are provided at the end of the runner 10, and a hole is formed through the lower mold 1 in the vertical direction. A vertical hole 2 is bored. 11
3 is a guide pin, 3 is a plunger slidably inserted into the vertical hole 2 from below, and the lower mold 1
When the plunger 3 descends along the guide pin 11, the plunger 3 projects upward within the vertical hole 2. Further, a pot 5 for charging a molding material 4 is formed on the upper surface of the plunger 3 within the vertical hole 2. Reference numeral 6 denotes an upper mold that moves up and down to face the lower mold 1. The upper mold 6 is provided with a pressure regulating valve 7 that faces the pot 5 and can freely slide up and down. The stopper 12 allows it to stop flush with the mating surface P of the upper mold 6. The pressure regulating valve 7, which is now retractable, is urged in the projecting direction by a spring 8. In this way, the pots 5, plungers 3, and pressure regulating valves 7 are provided at multiple locations, and each pot 5 has a plurality of pots 5 (in the illustrated example, four
) cavities 9 are in communication.
しかして、成形に際しては、キヤビテイー９内
にインサート用の電子部品等を配置し、ポツト５
内に所定量の成形材料４を投入し、上方から上金
型６を下降させて下金型１と合せると、ポツト５
は圧力調整弁７によつて閉じられる。更に上金型
６を下降させると下金型１を押し下げ、プランジ
ヤー３が合せ面Ｐに達するまで縦孔２内を上昇し
てポツト５内を狭めておき、ポツト５内の成形材
料４を加圧してランナー１０を通つてキヤビテイ
ー９内へ注入する。このとき、投入された成形材
料４が多過ぎたポツト５ではプランジヤー３によ
つて成形材料４に加えられた圧力のために圧力調
整弁７が引込み、これによつて電子部品等に過度
の圧力が加わるのを回避できると共に第３図のよ
うに余分の成形材料４はカル１３となつて残る。 Therefore, during molding, insert electronic parts etc. are placed in the cavity 9, and the pot 5 is placed inside the cavity 9.
When a predetermined amount of molding material 4 is put into the pot 5 and the upper mold 6 is lowered from above and combined with the lower mold 1, the pot 5
is closed by a pressure regulating valve 7. When the upper mold 6 is further lowered, the lower mold 1 is pushed down, and the plunger 3 moves up inside the vertical hole 2 until it reaches the mating surface P, narrowing the inside of the pot 5 and processing the molding material 4 in the pot 5. It is injected into the cavity 9 through the runner 10 under pressure. At this time, in the pot 5 where too much molding material 4 has been put in, the pressure regulating valve 7 is retracted due to the pressure applied to the molding material 4 by the plunger 3, and this causes excessive pressure on electronic parts etc. It is possible to avoid the addition of excess molding material 4, and the excess molding material 4 remains as a cull 13 as shown in FIG.
本発明は上叙の如く構成されているから、成形
材料の投入量が多過ぎた場合には圧力調整弁が引
み注入圧が過度に高くなるのを防止でき、インサ
ートされている電子部品等を圧力で破損させた
り、成形品にバリを発生させたりすることを防止
でき、しかもポツト毎に成形材料の投入量のばら
つきを吸収できるという利点がある。
Since the present invention is configured as described above, when the amount of molding material input is too large, the pressure regulating valve is pulled to prevent the injection pressure from becoming excessively high. This method has the advantage of being able to prevent damage to the molded product due to pressure and the occurrence of burrs on the molded product, and to absorb variations in the amount of molding material input from pot to pot.
第１図は本発明の一実施例を示す一部破断した
平面図、第２図は第１図のＸ−Ｘ断面図、第３図
は同上のポツト部分の成形時の状態を示す断面図
である。
１……下金型、２……縦孔、３……プランジヤ
ー、４……成形材料、５……ポツト、６……上金
型、７……圧力調整弁、８……スプリング。
Fig. 1 is a partially broken plan view showing an embodiment of the present invention, Fig. 2 is a cross-sectional view taken along the line X-X in Fig. 1, and Fig. 3 is a cross-sectional view showing the state of the same pot portion during molding. It is. 1...Lower mold, 2...Vertical hole, 3...Plunger, 4...Molding material, 5...Pot, 6...Upper mold, 7...Pressure regulating valve, 8...Spring.
Claims (1)
動するプランジヤーを納め、縦孔内のプランジヤ
ー上面部に成形材料を投入するためのポツトを形
成し、下金型と対面する上金型のポツトと対向す
る位置に引退可能な圧力調整弁を設け、圧力調整
弁をスプリングによつて突出付勢して成ることを
特徴とする封止成形金型。1. A plunger that moves up and down relative to the lower mold is housed in a vertical hole provided in the lower mold, and a pot for charging molding material is formed on the upper surface of the plunger in the vertical hole, facing the lower mold. A sealing molding mold characterized in that a retractable pressure regulating valve is provided at a position facing a pot of an upper mold, and the pressure regulating valve is urged to protrude by a spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP512484A JPS60149423A (en) | 1984-01-13 | 1984-01-13 | Sealed mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP512484A JPS60149423A (en) | 1984-01-13 | 1984-01-13 | Sealed mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60149423A JPS60149423A (en) | 1985-08-06 |
| JPH0251377B2 true JPH0251377B2 (en) | 1990-11-07 |
Family
ID=11602564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP512484A Granted JPS60149423A (en) | 1984-01-13 | 1984-01-13 | Sealed mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60149423A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60214916A (en) * | 1984-04-10 | 1985-10-28 | Matsushita Electric Works Ltd | Regulating mechanism for pressure of sealed molds |
| JPH0238447Y2 (en) * | 1984-11-12 | 1990-10-17 |
-
1984
- 1984-01-13 JP JP512484A patent/JPS60149423A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60149423A (en) | 1985-08-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |