JPH0251259A - Semiconductor device and its manufacture - Google Patents

Semiconductor device and its manufacture

Info

Publication number
JPH0251259A
JPH0251259A JP20146588A JP20146588A JPH0251259A JP H0251259 A JPH0251259 A JP H0251259A JP 20146588 A JP20146588 A JP 20146588A JP 20146588 A JP20146588 A JP 20146588A JP H0251259 A JPH0251259 A JP H0251259A
Authority
JP
Japan
Prior art keywords
lead frame
plastic molding
bonding
opening recess
thermosetting resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20146588A
Other languages
Japanese (ja)
Inventor
Kaoru Tominaga
Shigeru Katayama
Toshio Suetsugu
Kazumi Matsumoto
Original Assignee
Mitsui Petrochem Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Petrochem Ind Ltd filed Critical Mitsui Petrochem Ind Ltd
Priority to JP20146588A priority Critical patent/JPH0251259A/en
Publication of JPH0251259A publication Critical patent/JPH0251259A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Abstract

PURPOSE: To remove such trouble that burr lies on the surface of a lead frame by bonding and uniting the plastic molding with the lead frame through an adhesive layer provided at the whole surface on the opening recess side of the plastic molding.
CONSTITUTION: Thermosetting resin adhesive is applied on the whole surface on the opening recess side of a plastic molding 1 having an opening recess where one or more steps are provided. Next, after placing a lead frame 2 on the application face of the thermosetting resin adhesive, it is heated so as to bond the lead frame 2 to the plastic molding 1. Next, a semiconductor chip 4 is bonded to the pad part 3a of the lead frame, and also the semiconductor chip 4 and the lead frame 3 are electrically connected by wire-bonding. And the plastic molding 1 and the cover material 7 are bonded using thermosetting resin seal agent so as to seal the whole opening recess of the plastic molding 1. Hereby, it can facilitate die-bonding between the pad part and the chip and wire-bonding between the chip and the lead frame as well as elevate moisture resistance.
COPYRIGHT: (C)1990,JPO&Japio
JP20146588A 1988-08-12 1988-08-12 Semiconductor device and its manufacture Pending JPH0251259A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20146588A JPH0251259A (en) 1988-08-12 1988-08-12 Semiconductor device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20146588A JPH0251259A (en) 1988-08-12 1988-08-12 Semiconductor device and its manufacture

Publications (1)

Publication Number Publication Date
JPH0251259A true JPH0251259A (en) 1990-02-21

Family

ID=16441538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20146588A Pending JPH0251259A (en) 1988-08-12 1988-08-12 Semiconductor device and its manufacture

Country Status (1)

Country Link
JP (1) JPH0251259A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06125020A (en) * 1992-10-12 1994-05-06 Kyocera Corp Package for housing semiconductor element
JP2009260280A (en) * 2008-03-21 2009-11-05 Sumitomo Chemical Co Ltd Resin package and method of manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62106653A (en) * 1985-11-05 1987-05-18 Mitsubishi Electric Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62106653A (en) * 1985-11-05 1987-05-18 Mitsubishi Electric Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06125020A (en) * 1992-10-12 1994-05-06 Kyocera Corp Package for housing semiconductor element
JP2009260280A (en) * 2008-03-21 2009-11-05 Sumitomo Chemical Co Ltd Resin package and method of manufacturing the same

Similar Documents

Publication Publication Date Title
JPH01205541A (en) Plastic sealed semiconductor device
JPS58207657A (en) Manufacture of semiconductor device
JPH03204965A (en) Resin-sealed semiconductor device
JPS61166051A (en) Resin seal type semiconductor device
MY133105A (en) Method of preparing an electronic package by co-curing adhesive and encapsulant
JPH02174144A (en) Package for semiconductor device
JPH04214643A (en) Resin-sealed semiconductor device
MY119797A (en) Resin-molded semiconductor device having a lead on chip structure
JPH04357858A (en) Semiconductor device
JPS6149446A (en) Resin seal type semiconductor device
JPH0251259A (en) Semiconductor device and its manufacture
JPH01235363A (en) Semiconductor device
JPS5943554A (en) Resin-sealed semiconductor device
JPS63249341A (en) Semiconductor device
JPH0250438A (en) Semiconductor device
JPS62296528A (en) Resin-sealed semiconductor device
JPH01278757A (en) Lead frame
JPH01257361A (en) Resin-sealed semiconductor device
JPS62229949A (en) Manufacture of resin-sealed semiconductor
JPH02132848A (en) Semiconductor device
JPS62166553A (en) Resin-sealed semiconductor device
JPS61271848A (en) Manufacture of semiconductor package
JPS59218759A (en) Semiconductor device
JPH0260793A (en) Semiconductor device for ic card
JPH03203355A (en) Ultraviolet-erasable semiconductor device