JPH0251158A - Developing device - Google Patents

Abstract

PURPOSE:To uniformly process semiconductor substrates and to reduce the amount of used chemicals by providing rotary mechanisms which rotate the semiconductor substrates stood in a dipping tank. CONSTITUTION:The rotary mechanisms 4 and 5 which rotate the fed semiconductor substrates are provided on the bottom part of the dip ping tank 3 where the semiconductor substrates 1 are put. The semiconductor substrate storage box 2 which contains the semiconductor substrates 1 is put in the dipping tank 3 and then the fed semiconductor substrates 1 are supported by a rotary roller 4 and become loose from the semiconductor substrate storage box 2. When development processing is carried out, the rotary roller 4 is driven for a constant so that the semiconductor substrates are dipped in a liquid developer entirely; and the liquid is discharged from a liquid draining port 8. Consequently, the developer is distributed uniformly over the entire surfaces, the need for entirety dipping is eliminated, and the processing is performed with the minimum amount of liquid developer.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a semiconductor manufacturing apparatus, and particularly to a photoresist developing apparatus.

[Conventional technology]

Conventionally, a photoresist developing apparatus used in semiconductor manufacturing has a mechanism in which a semiconductor substrate is supported by a rotating base, a chemical solution is dropped from a nozzle onto the surface of the substrate, and the substrate is rotated one by one.

[Problem to be solved by the invention]

When a developing device with the conventional structure described above is used, it is necessary to drop a chemical solution onto each semiconductor substrate, and the dropping point and spread of the chemical solution cause non-uniformity in the processing of the surface where the chemical solution has been dropped. The disadvantage is that a large amount of chemical solution is used to spread the chemical solution.

An object of this invention is to process semiconductor substrates uniformly and to reduce the amount of chemicals used.

[Means to solve the problem]

The feature of this invention is that it has a structure that processes multiple semiconductor substrates, and the chemical solution is spread uniformly, and the semiconductor substrates are filled with the chemical solution so that it can be processed with a small amount of chemicals (l/2 immersion tank). The immersion tank has a rotation mechanism at the bottom thereof that rotates the semiconductor substrate placed therein.

[Example 1] Next, the present invention will be described with reference to the drawings. 1 and 2 are a longitudinal sectional view and a transverse sectional view of a developing device for explaining one embodiment of the present invention. The developing device of this embodiment includes a rotating roller 4 that supports and rotates the semiconductor substrate 1, and a drive motor 5 that drives the rotating roller.
have. When the semiconductor substrate storage box 2 containing a plurality of semiconductor substrates 1 is placed in the dipping tank 3, the semiconductor substrates 1 are supported by the rotating rollers 4 and loosely fitted into the semiconductor substrate storage box 2. In the development process, the developer 6 is injected from the chemical injection lower to the center of the semiconductor substrate 1, and the rotating roller 4 is driven for a certain period of time so that the entire semiconductor substrate is immersed in the developer to rotate the semiconductor substrate. conduct. The used developer is discharged from the drain port 8. This method provides an average developer distribution over the entire surface in a uniform time, does not require immersion of the entire surface, and can be processed with a minimum amount of developer.

[Example 2] A second example of the present invention is shown in FIG. This example is
In addition to the configuration of the above-described embodiment, this embodiment has a developing solution inlet vortex filter 9, a developing solution circulation pump 10, a liquid supply valve 11, and a drain valve 12, and has the advantage that the processing liquid can be regenerated.

With this mechanism, the amount of developer used can be further reduced.

[Effects of the Invention] As explained above, by using the developing device of the present invention, it is possible to uniformly distribute the developer over the entire surface of the semiconductor substrate, and compared to the drip nozzle type, it is possible to distribute the developer solution within the surface of the semiconductor substrate and between the substrates. It is possible to eliminate unevenness in processing. moreover,
There is no need for excessive immersion or dripping, and the amount of developer used can be reduced.

[Brief explanation of the drawing]

FIGS. 1 and 2 are longitudinal and transverse cross-sectional views for explaining one embodiment of the present invention. FIG. 3 is a sectional view for explaining the second embodiment. In the top view, 1... semiconductor substrate, 2... semiconductor substrate storage box, 3...
... Immersion tank, 4 ... Rotating roller, 5 ... Motor, 6 ... Developer, 7 ... Supply port, 8 ... Drain port,
9...Filter 10...Pump, 11...Liquid supply valve, 12...Drainage valve.

Claims (1)

[Claims] A developing device comprising: an immersion tank filled with a developer; and a rotation mechanism for rotationally processing a plurality of semiconductor substrates set upright in the immersion tank.