JPH02500691A - Semiconductor laser module and its alignment method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] Semiconductor laser module and its alignment method [Technical field] The present invention provides a semiconductor laser module that optically couples a semiconductor laser and an optical fiber. , and a method for aligning components of the semiconductor laser module.

(Background technology) Single-mode optical fibers with small core diameters (e.g. 10-) have low transmission losses. It is widely used as a transmission line for optical communications in recent years because it is flexible and can be used over a wide band. It's coming.

For long-distance transmission, the emitted light from the semiconductor laser, which is emitted with a divergence angle, is , it is required to connect to the entrance surface of a small optical fiber with a high degree of optical coupling.

Furthermore, at the connection part of the optical transmission line or the part of the optical device inserted into the optical transmission line. , when the light is reflected and the reflected light returns to the semiconductor laser, the oscillation becomes unstable, As a result, the noise contained in the optical signal increases. Therefore, the above semiconductor laser model The module is required to have an isolation function.

Furthermore, semiconductor lasers and collimating lenses that make up the semiconductor laser module Components such as laser beams and focusing lenses are arranged with high precision relative to each other to ensure that the light emitted from the semiconductor laser It must be ensured that the laser light transmitted into the optical fiber is introduced into the optical fiber with high coupling efficiency. Must be.

Conventionally known semiconductor laser modules consist of a semiconductor laser chip that emits laser light. a collimating lens that converts the laser beam into parallel light, and a collimating lens that converts the laser beam into parallel light. a focusing lens having a central axis for focusing light; and a focusing lens having an optical axis and said focusing lens. an optical fiber whose input end face is inclined, into which the laser beam from the laser beam enters. Ru. If the end face of such an optical fiber is inclined, the laser light will be reflected at the incident face and the semiconductor laser will be emitted. This is advantageous in preventing the object from returning to the side.

[Disclosure of the invention]

An object of the present invention is to reflect laser light emitted from a semiconductor laser chip at an input end facet. A semiconductor laser module that prevents the laser from returning to the semiconductor laser chip even if An object of the present invention is to provide a method for aligning a module and its components.

Another object of the present invention is to provide a semiconductor laser chip, a collimating lens, a focusing lens, and the position of components such as optical fibers can be easily and accurately adjusted with respect to each other. How to align a semiconductor laser module that can be fixed and its components It is to provide law.

According to the present invention, there is provided a semiconductor laser chip that emits a laser beam, and a semiconductor laser chip that emits a laser beam. A collimating lens that converts into light and a central axis that focuses the parallel laser light. a converging lens having an optical axis, and a laser beam from the converging lens is incident on the converging lens; an optical fiber whose input end face is inclined; In the system, the focusing lens includes a collimated lens input to the focusing lens. The collimated light beam is arranged such that the optical axis is distant from the central axis of the converging lens. , and the laser beam is input into the optical fiber along the optical axis of the optical fiber. The optical fiber is arranged parallel to the collimated parallel light. A semiconductor laser module is provided.

In one embodiment of the invention, the focusing lens is a first focusing lens having a central axis. a second focusing lens having a central axis and a central axis; The parallel light is first incident on the first converging lens, and the optical axis of the output light is aligned with the first converging lens. The laser beam is parallel to the central axis of the lens and is incident on the second focusing lens. The light is emitted from the second focusing lens and is directed along the optical axis of the optical fiber. It is characterized by being refracted within the second focusing lens so as to be incident on the fiber. Ru.

In yet another embodiment of the present invention, the semiconductor chip and the collimating lens are combined into one and the first focusing lens is housed in a second housing. and the second focusing lens is housed in a third housing. , the optical fiber is housed in one fourth housing, and the first housing and the second housing allows the light emitted from the first focusing lens to be focused on the first focusing lens. The third housing and the front housing are connected to each other parallel to the axis of the bundle lens. The fourth housing is configured to accommodate the third housing such that light is incident on the axis of the optical fiber. The light incident on the axis of the housing is parallel to the axis of the third housing. the second housing and the third housing are connected to each other so that the second housing and the third housing It is characterized in that the row rays are connected to each other so that they coincide.

The axial distance between the second housing and the third housing is equal to the distance between the second housing and the third housing. The light emitted from the second focusing lens housed in the housing of No. 3 is transmitted to the fourth housing. Adjusted to focus on the core axis position of the inclined end face of the optical fiber in the housing is desirable.

In still another embodiment of the present invention, the semiconductor laser chip and the collimating lens are and a mounting means for: fixing and holding the collimating lens. , a cylindrical lens holder with a thread formed on its outer circumferential surface, and an outer surface of the lens holder. A spacer member having an inner peripheral thread portion that engages with the peripheral thread portion, and fixing the spacer member. ・Chip cap for fixing and holding the semiconductor laser chip, which has a flat surface to be bonded. a carrier, the lens holder to a spacer, and the spacer to the chip carrier. a laser chip, and a means for fixing it by welding, respectively. A collimating lens that converts laser light into parallel light, and a collimating lens that collects the parallel laser light. a focusing lens having a central axis for focusing; an optical fiber having an inclined input end face into which laser light is incident; In the method for aligning the body laser module, A monitor device is placed on the input end side of the focusing lens, and a monitor device is placed on the input end side of the focusing lens, and By inputting light into the optical fiber, the light passes through the optical fiber and the input end face The light is emitted from the convergent lens, enters the monitor device through the converging lens, and enters the monitor through the converging lens. rotate the lens so that the light traces a predetermined circle within the monitor device, and By adjusting the position of the lens in the radial direction with respect to the optical axis of the optical fiber, is located at the center of the circle. A method for aligning the tool is provided.

Still another feature of the present invention is a semiconductor laser chip that emits laser light; A collimating lens that converts the laser beam into parallel light, an optical isolator, and a split refractor. The front part of the gradient index lens and the segmented gradient index lens (i.e. Grinrodlen) (2) and an optical fiber having an optical axis and an oblique input end face. In the optical fiber module, the semiconductor laser chip and the collimator a laser-side assembly coupling the lens and the optical isolator in place; an intermediate assembly having means for fixing and holding the front portion of the gradient index lens; and an inner cylinder that fixes and holds the optical fiber, and the inner cylinder is axially an outer cylinder adjustably inserted into the rear part of the segmented gradient index lens; and a fiber side assembly comprising a cylindrical lens holder for fixing and holding the lens. , the cylindrical lens holder is radially adjustable with respect to the optical axis of the optical fiber. attached to the inner cylinder, and the laser side assembly includes an intermediate lens assembly; In the assembly, the intermediate lens assemblies are respectively fixed to the fiber side assemblies. Provided is a semiconductor laser module characterized in that:

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing the optical path of the semiconductor laser module of the present invention; Figure 2 is a diagram showing other optical paths, FIG. 3 is a diagram showing still another optical path, FIG. 4 is a schematic diagram showing the arrangement of a focusing lens and an optical fiber according to the present invention; Figure 5 is a diagram showing the relationship between lens aberration (Δ) and output angle (θ2). FIG. 6 is a diagram showing the optical path of a segmented gradient index lens, and FIG. 7 is a diagram showing a semiconductor according to the present invention. A cross-sectional view of an embodiment of a laser module, FIG. 8 is a diagram showing the optical path of the semiconductor laser module of FIG. 7, and FIG. 9 is a diagram showing the optical path of the semiconductor laser module of FIG. a diagram showing the adjustment means of the conductor laser module; FIG. 10 shows an outline of the means for attaching a semiconductor laser chip and a collimating lens according to the present invention. Schematic cross-sectional view, FIG. 11 is a sectional view of an embodiment of the mounting means shown in FIG. 10, and FIG. a plan view of the embodiment of the attachment means shown, and Figure 13 is a schematic diagram showing the basic arrangement of the main components of a semiconductor laser module. be.

[Best mode for carrying out the invention]

Prior to a detailed explanation of the present invention, a semiconductor laser module will be described with reference to FIGS. 1 to 3. Explain the basic principles of the module. In the figure, A emits laser light Semiconductor laser chip, B is collimating lens that converts laser light into parallel light, C is a focusing lens that focuses parallel light, and D has a central core E, and the focusing lens 1 shows an optical fiber having an inclined input surface into which a laser beam from a laser beam is incident.

As shown in Figure 2, the central axis and core axis are parallel light beams from collimating lens B. When the converging lens C and the optical fiber D are arranged so as to coincide with the axis, the incident The laser beam is refracted at the inclined input surface and is not transmitted along the core axis of the optical fiber D. This results in a decrease in coupling efficiency.

Therefore, as shown in FIG. 3, the refracted light ray enters the optical fiber D along the core axis. If the optical fiber D is arranged at an angle so that the It is clear that the efficiency of optical coupling is improved even if the arrangement is the same.

However, the optical fiber D is arranged at an angle with respect to the central axis of the converging lens C. The components of a semiconductor laser module can be easily and precisely cannot be placed.

Therefore, according to the present invention, as shown in FIG. The converging lens C is arranged so that the central axis of the row light is separated from the central axis of the converging lens C. However, due to this distance, the optical fiber D has its core axis collimated as shown in Figure 2. Even though it can be placed parallel to the optical axis of the parallel light from lens B, the incident light The inclined incident surface refracts the laser light so that it can be transmitted along the core axis of the optical fiber D. Become. Therefore, the optical coupling efficiency is improved and the components of the semiconductor laser module are Allows easy and accurate placement.

For the relative positional relationship between the optical fiber and the focusing lens, refer to Figures 4 and 5. It can be determined by basic geometric calculations as described below. In principle, A ray of light travels either from left to right or vice versa, but in Fig. The optical path of the light rays is exactly the same in both cases.

Therefore, in FIG. 4, the explanation will be made assuming that the light ray moves from left to right.

here, nC: refractive index of the fiber core α: Angle of the inclined surface of the optical fiber A: Refractive index distribution constant of focusing lens θI: Incident angle from the axis of the focusing lens θ2: Output from the axis of the focusing lens Incident angle r: represents the incident position of the focusing lens as a distance from the axis r2: focusing lens The exit position of the s-bundle is expressed as the distance from the axis Z: Distance in the longitudinal direction of the s-bundle lens n (r): refractive index of focusing lens Assuming that, n(r) is expressed as follows.

The optical path of a ray is determined by the following geometric calculation.On the other hand, from a converging lens, The angle of incidence of (i.e., the optimal angle of incidence on the inclined surface of the optical fiber) θ is given by the following equation .

n, sin α=sin(θ, +α) θ+ -5in -' (nc sin α) - α (3) Above formula (2 ), r and r2 are determined. In this case, r2 is The incident position of parallel light in FIG. 1 is shown.

In Fig. 5, the horizontal axis Δ(-) is the amount of misalignment of the lens, that is, the optical axis of the optical fiber and the convergence. The distance between the center axis of the converging lens and the vertical axis θ is the distance between the central axis of the converging lens and the ray of light output from the converging lens. It's an angle. This vertical axis indicates the direction in which θ2 is positive (the light beam output is upward in Figure 4) and the direction in which θ2 is negative. Indicates the absolute value of θ2 when increasing in both directions (the light beam output is downward in Figure 4). ing.

The numerical conditions in the diagram shown in FIG. 5 are as follows.

Core refractive index nc = 1.592 Root A = 0.327 (mm) - 'Pitch of focusing lens P = 0.16 Inclination angle of end face α = 6 degrees Distance between fiber and lens = 0.05m + a Therefore, in this example, Δ = 50 - A segmented gradient index lens that can be advantageously used in embodiments of the present invention This will be explained in detail with reference to FIG.

A gradient index lens is a lens whose refractive index decreases as it moves away from the optical axis. is a cylindrical lens whose refractive index is changed as desired, and the incident light is parallel to the optical axis. Light travels through the lens following a sinusoidal optical path.

Therefore, a gradient index lens cut to the length of 174 pitches of traveling waves is When light is projected parallel to the optical axis from one end face, it is focused at the center of the other end face.

Now, a gradient index lens with a traveling wave length of 174 pitches is placed at the desired angle from the input end face. When it is cut and removed into a thin disk shape at the position, the divided refractive index distribution is obtained as shown in Figure 6. A segmented lens consisting of a front part 4-1 of the shaped lens and a rear part 4-2 of the segmented original-shaped lens. A gradient index lens can be provided.

Such a segmented gradient index lens has a front part 4-1 and a segmented gradient index lens. By adjusting the distance to the rear part 4-2 of the divided original shape ratio distribution type lens, it can be made flat on the optical axis. The light incident on the front part 4-1 of the gradient index lens divided into rows is The light can be focused at a desired distance from the output end face of the rear lens 4-2. .

In FIG. 7, the semiconductor laser module according to the embodiment of the present invention has a conical shape, for example. A semiconductor laser chip 1, such as a laser diode that emits a shaped laser beam, Collimating lens 2 that converts laser light into parallel light, optical aperture that prevents laser light from returning. A laser side assembly 10 in which isolators 3 are combined as desired; and a divided refractive index distribution. Intermediate lens assembly with front part 4-1 of shaped lens; with J40; split refractive index profile A fiber side assembly that combines the rear part 4-2 of the shaped lens and the optical fiber 6 as desired. It is composed of a yellowtail 50.

The semiconductor laser 1 is inserted into one end of the cylindrical hole of the holder 21 and fixed on its axis. and insert the collimating lens 2 at a predetermined position on the other end. The central axis is made to coincide with the optical axis of the laser beam emitted from the laser chimp 1. .

Furthermore, the holder 21 is fixed to the stem 24 and covered with the camp 23 to seal it. and mounted in the cavity of the axis of the cylindrical package 22 made of stainless steel, for example. Ru.

On the other hand, the Faraday rotator 31 is mounted within the magnetic field of the permanent magnet 34, and the Faraday rotator An optical isolator 3 is configured with a polarizer and an analyzer arranged before and after the element 31. With the isolator 3 mounted in the axial hole of the isolator package 35, The contact surfaces of the data package 35 and the package 22 are fixed by laser welding, etc. A user side assembly 10 is configured.

For example, a split lens is installed in the axial hole of the cylindrical lens holder 45 made of stainless steel. The front part 4-1 of the gradient index lens is inserted to form an intermediate lens assembly 40. Ru.

In the fiber side assembly 50, an optical fiber is inserted into the axial center hole of the cylindrical ferrule 61. Insert and secure the end of the input side of the fiber 6, and align the input surface with the axis of the optical fiber 60. , the desired beveled end face of 3 to 10 degrees is finished.

52 has a cylindrical shape made of stainless steel, for example, and has a stepped hole at its axis. It is an inner cylinder in which a ferrule 61 is fitted and fixed in the small diameter part.

51 is, for example, a stem in which the rear part 4-2 of the segmented gradient index lens is fitted into the axial hole. A cylindrical flanged lens holder made of stainless steel, the outer diameter of which is the same as that of the flanged lens. It is sufficiently smaller than the inner diameter of the large diameter portion of the stepped hole of the lens holder 51. In addition, lenses with flange The outer diameter of the collar of the holder 51 is sufficiently smaller than the outer diameter of the inner cylinder 52.

Reference numeral 53 denotes a cylindrical outer cylinder with a flange made of stainless steel, for example. It is designed to be slidably inserted around the circumference in the axial direction.

Optical fiber 6, ferrule 61, flanged lens holder 51, and inner cylinder 52 as described above , and the outer cylinder 53 constitute a fiber side assembly 50.

The fiber side assembly 50 is constructed as follows. Optical fiber 6 and split bending First, adjust the relative position in the radial direction with the rear part 4-2 of the gradient index lens, and then The positional relationship of the inner cylinder 52 is adjusted, and these and the flange lens holder 51 are laser welded. Attach and adhere.

To explain the position adjustment in more detail, as shown in FIG. Connect to a light source 11 such as a laser, and emit infrared light to the rear 4-2 side of the split gradient index lens. A television camera 65 is installed, and a monitor display device 66 is connected to the infrared television camera 65. Connecting.

Therefore, while observing the monitor display device 66, the rear part of the segmented gradient index lens is The flange lens holder 51 is aligned in the X direction so that the light emitted from 4-2 is parallel to the Z axis. Adjustments are made in the axial and Y-axis directions, that is, in the radial direction, and fixed in that state.

To explain in detail, first, the flange lens holder 51 is inserted into the inner cylinder 52 and aligned with a selected axis (for example, an optical axis). the axis of the fiber).

In this way, the trajectory of the light emitted from the rear part 4-2 of the segmented gradient index lens draws a circle on the screen of the monitor display device 266. Next, move the flange lens holder 51 on the X axis. , adjust the Y-axis direction, that is, the radial direction, and place the split refractive index distribution shape at the center of this circle. The light emitted from the rear part 4-2 of the lens is matched. By adjusting in this way, The optical axis of the output beam from the rear part 4-2 of the split index gradient lens is the axis of the optical fiber 6. become parallel.

On the other hand, the positional relationship between the laser side assembly 1 O and the intermediate lens assembly 40 is as described above. It can be done similarly. That is, an intermediate lens is provided on the end face of the laser side assembly 10. The end face of the assembly 4o is brought into contact with the front part 4-1 side of the split gradient index lens. Install an infrared television camera, connect a monitor display device to the infrared television camera, According to the adjustment method of the fiber side assembly 5o, the position of the intermediate lens assembly 40 is adjusted. Adjust the position.

To be more specific, the collimating lens is 2 - Optical isolator 3 - Semiconductor that has passed through the front part 4-1 of the split gradient index lens Observe the light beam of the emitted light from the body laser 1, and make sure that the emitted direction is parallel to the Z axis. Then, the intermediate lens assembly 40 is adjusted and moved in the X-axis and Y-axis directions, that is, in the radial direction. Ru. After completing the adjustment work, in that state, place the lens holder 45 on the isolator. It is fixed to the end face of the package 35, for example, by welding.

To secure the fiber side assembly 50 to the intermediate lens assembly 40, the outer tube 6 is 3 is brought into contact with the end surface of the intermediate lens assembly 4o, and the emitted light of the semiconductor laser 1 is The optical power of is measured on the optical fiber 6 side. During measurement, adjust by sliding the inner cylinder 52 in the axial direction. After alignment and adjustment, the inner cylinder 52 is fixed to the outer cylinder 53 by laser welding or the like.

Next, position the end face of the lens holder 45 and the end face of the outer cylinder 53 in a grand position. Adjust to. When the adjustment is completed, the outer cylinder 53 and the lens holder 45 are laser welded. etc. and sticks.

The optical path of the semiconductor laser module adjusted and fixed as in the above embodiment is shown in Figure 8. show. In the laser side assembly 1o, the emitted light of the semiconductor laser 1 expands into a conical shape. becomes a nearly parallel beam through the collimating lens 2 and advances to the optical isolator 3. go

At this time, due to misalignment of the optical axes of the semiconductor laser 1 and the collimating lens 2, etc., the A light beam tilted with respect to the axis of the laser beam 21 is emitted from the laser side assembly 10. may be done.

However, according to the embodiments described above, the intermediate lens assembly 40 is adjusted as described above. Therefore, the incident light is tilted with respect to the optical axis of the front part 4-1 of the split gradient index lens. front part 4-1 of the segmented gradient index lens, regardless of whether The emitted light is a tapered light beam that is parallel to the optical axis and converged.

When such a light beam enters the rear part 4-2 of the split gradient index lens, the light beam splits. When passing through the rear part 4-2 of the gradient index lens, the optical fiber 6 is not refracted in the axial direction. However, it becomes even more focused. Then, it enters the entrance plane of the optical fiber 6 at a desired angle of incidence. .

As is clear from the above, according to the present invention, the semiconductor laser module has an adjustment method. The direction is only the X-axis direction, Y-axis direction, and the axial direction of the optical fiber, and adjustment work is required. This is a semiconductor laser module that is easy to use and has a high degree of optical coupling.

Since the entrance surface of the optical fiber 6 is an inclined end surface, the rear end of the split gradient index lens The light beam emitted from the section 4-2 is directed towards the end face of the optical fiber 6 or the ferrule 6. Even if the reflected light is reflected by the end face of the semiconductor laser 1, the reflected light does not return to the semiconductor laser 1.

In addition, the light traveling backward through the optical fiber 6 or the rear part 4-1 of the split gradient index lens The reflected light is prevented from returning by the optical isolator 3.

Therefore, the semiconductor laser module of the present invention is a semiconductor laser module whose light source is reflected light. You can prevent it from returning to 1.

Figure 10 shows a part of the laser assembly, namely the semiconductor laser chip and collimating lens. FIG. The collimating lens 72 is a cylindrical lens with an external thread. The semiconductor laser chip 71 is fixed to a holder 73, and the laser holder 73 has a semiconductor laser chip 71 fixed thereto. The chip carrier 75 is fixed on the flat surface of the chip carrier 75. Therefore, for example The lens holder 73 is fixed to the spacer 74 by welding or the like, and this spacer 74 is is fixed to the top carrier 75.

11 and 12 are cross-sectional and plan views of one embodiment of the laser assembly. . For example, a semiconductor laser chip 81 consisting of a laser diode (LD) or the like is fixed. The chip carrier 82 to be mounted is a diamond or the like to which the LD chimp 81 is directly fixed. A chip fixing part 83 made of a metal material, a heat sink part 84 made of copper or the like for heat dissipation, It is integrally constructed with a lens holding part 85 for joining with the lens side. Ru. A through hole 85a passes through the lens holding portion 85 at a position facing the LD chip 81. A spacer 86 is loosely inserted into the through hole 85a. L of spacer 86 On the side opposite to the D tip 81, there is an annular flange 86a having a larger diameter than the through hole 85a. This allows the flange 86a to be connected to the flat surface 85 of the lens holding portion 85. By closely sliding on b, the spacer 86 is positioned in a plane perpendicular to the optical axis. It is now possible to do so. Inside the cylindrical body 86b of the spacer 86, A cylindrical lens holder 87 is closely fitted, and the inside of this lens holder 87 is A collimating lens 88 made of a ball lens or the like is fixed by press-fitting, for example. Ru. In this way, the lens holder 87 and the spacer 86 are joined by screwing together. By changing the screwing position, that is, by adjusting the screwing amount. , the collimating lens 88 can be displaced in the optical axis direction, allowing focus adjustment. It becomes possible to do so.

Focus and alignment can be adjusted by adjusting the screw position and contact sliding position, respectively. When the adjustment is completed, in this state, simultaneously irradiate welding laser light in the direction of arrow A, A welded portion B can be formed in each case. Laser welding allows instant fixation Because of this, there is no risk of optical axis misalignment during the curing time, which is the case when adhesives are used. stomach. Also, there is no risk of changes in optical coupling efficiency over time, as is the case with soldering. .

Here, laser welding is performed at multiple locations at the same time. In order to prevent optical axis misalignment due to non-uniform thermal contraction force acting on the spacer, etc. It's a good thing.

There are no particular regulations regarding the number and position of laser welding points, but the uniformity of the heat shrinkage force mentioned above is required. If you want to achieve a It is desirable that Because the thermal contraction force at each position is canceled out around the optical axis. It is.

Furthermore, the shapes of the spacer 86 and lens holder 87 are also axially symmetrical with respect to the optical axis. It is desirable that the shape is suitable for use due to temperature changes in the environmental conditions in which the module is used. By making each member into an axially symmetrical shape when thermally expanding or contracting, the optical axis This is because the deviation can be minimized.

FIG. 13 has a semiconductor laser chip A and a collimating lens B as described above. A fiber optic having a laser assembly LA and a focusing lens and an optical fiber D. FIG. 2 is a schematic diagram of a semiconductor laser module including an assembly FA.

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Claims (18)

[Claims] 1. A semiconductor laser chip that emits laser light and converts the laser light into parallel light. A focusing device having a collimating lens and a central axis that focuses the collimated laser light. a shaped lens, and an entrance end having an optical axis and into which the laser beam from the focusing lens is incident. In a semiconductor laser module comprising an optical fiber whose surface is inclined , The converging lens is configured such that the collimated parallel light input to the converging lens the laser beam is arranged so as to have an optical axis remote from the central axis of the focusing lens; the optical fiber such that light is input into the optical fiber along the optical axis of the optical fiber; A semiconductor device characterized in that the fiber is arranged parallel to the collimated parallel light. laser module. 2. An optical isolator is placed between the collimating lens and the focusing lens. The semiconductor laser module according to claim 1, characterized in that: 3. The focusing lens has a first focusing lens having a central axis and a central axis. a second converging lens, and the parallel light from the collimating lens first passes through the first collimating lens. The optical axis of the light entering the converging lens is set to the central axis of the first converging lens. parallel and without, The laser light incident on the second focusing lens is emitted from the second focusing lens. the second optical fiber such that the incident light is incident on the optical fiber along the optical axis of the optical fiber; 2. The semiconductor laser module according to claim 1, wherein the semiconductor laser module is refracted within a focusing lens. ule. 4. The semiconductor chip and the collimating lens are housed in one first housing. Accept, accommodating the first focusing lens within a second housing; accommodating the second focusing lens within a third housing; The optical fiber is housed in one fourth housing, and the first housing and The second housing focuses the light emitted from the first focusing lens into the first focusing lens. are connected to each other parallel to the axis of the lens, The third housing and the fourth housing allow light to enter the optical fiber axis. such that the light incident on the axis of the third housing is interconnected parallel to the axis of the ring, The second housing and the third housing are arranged so that the parallel light rays coincide with each other. 4. The semiconductor laser module according to claim 3, wherein the semiconductor laser module is connected to each other. Le. 5. The axial distance between the second housing and the third housing is The light emitted from the second focusing lens housed in the third housing is emitted from the fourth lens. The inclined end face of the optical fiber in the housing is adjusted to focus on the core axis position. 5. The semiconductor laser module according to claim 4, wherein: 6. comprising means for attaching the semiconductor laser chip and the collimating lens; Mounting means: A cylindrical shape with threads formed on the outer circumferential surface that fixes and holds the collimating lens. and an inner threaded portion that engages with the outer threaded portion of the lens holder. a spacer member; The semiconductor laser chip, which has a flat surface to which the spacer member is fixed and bonded, is fixed. The chip carrier to be fixed and held, the lens holder to the spacer, and the spacer to the spacer. and a means for fixing the chip to the rear by welding, respectively. 2. The semiconductor laser module according to claim 1, wherein the semiconductor laser module has the following characteristics. 7. A semiconductor laser chip that emits laser light and converts the laser light into parallel light. A focusing device having a collimating lens and a central axis that focuses the collimated laser light. a shaped lens, and an input end having an optical axis and into which the laser light from the focusing lens is incident. In a semiconductor laser module comprising an optical fiber having an inclined surface, , A monitor device is placed on the input end side of the focusing lens, and a monitor device is placed on the input end side of the focusing lens, and By inputting light into the optical fiber, the light passes through the optical fiber and the input end face The light is emitted from the convergent lens, enters the monitor device through the converging lens, and enters the monitor through the converging lens. rotating the lens so that the light traces a predetermined circle within the monitoring device; adjusting the position of the focusing lens in the radial direction with respect to the optical axis of the optical fiber; A semiconductor laser characterized in that the light is positioned at the center of the circle by How to align the laser module. 8. The monitoring device includes an infrared video camera and an optical display device from which an image of the light can be obtained. and using infrared rays as the light incident from the output end of the optical fiber. The positioning method according to claim 7, characterized in that: 9. The focusing lens includes a first focusing lens and a second focusing lens. The second focusing lens is disposed opposite to the incident end surface of the optical fiber, and A converging lens is disposed on the output end side of the collimating lens, and the converging lens In the case where the chip and the collimating lens are housed in one housing, the front The first focusing lens is positioned relative to the housing as follows. That is, A monitor device is arranged on the incident side of the first focusing lens, and The emitted light is sent to the monitor via the collimating lens and the first focusing lens. input to the monitor device and rotate the first converging lens so that the laser beam is directed to the monitor. Draw a predetermined circle within the device, and make sure that the laser beam is located at the center of the circle. radially adjusting the first focusing lens with respect to the axis of the housing; A method for aligning a semiconductor laser module, characterized in that: 10. An optical isolator is placed between the collimating lens and the focusing lens. 10. The positioning method according to claim 9, characterized in that: 11. The semiconductor module includes the semiconductor chip and the collimating lens in one the first focusing lens is housed in one second housing; a third housing, and the second focusing lens is housed in a third housing. and the optical fiber is housed in one fourth housing, adjusting the positions of the first housing and the second housing; adjusting the positions of the third housing and the fourth housing; The second housing and the third housing are connected to the light beam from the optical fiber. adjust the position so that it matches the laser beam from the semiconductor laser chip. 10. The positioning method according to claim 9. 12. The distance between the second housing and the third housing is determined by the distance between the second housing and the third housing. The emitted light from the second converging lens housed in the housing enters the fourth housing. is adjusted to focus on the core axis position of the inclined end face of the optical fiber in the optical fiber. The positioning method according to claim 11, characterized in that: 13. The semiconductor module includes the semiconductor laser chip and the collimating lens. the attachment means: fixing and holding the collimating lens; A cylindrical lens holder with threads formed on the outer circumferential surface, and an outer circumference of the lens holder. A spacer member having an inner circumferential threaded portion that engages with the threaded portion, and a spacer member that fixes/fixes the spacer member. A chip carrier that fixes and holds the semiconductor laser chip and has a flat surface to which the semiconductor laser chip is attached. including the rear, The output optical axis from the laser chip is aligned with the optical axis of the collimating lens. adjusting the position of the spacer on the flat surface of the chip carrier; The lens holder is attached to the slide so that the light emitted from the collimating lens becomes parallel light. Rotate within the screw hole of the spacer member to attach the lens holder to the spacer member. The spacer members are each fixed to the chip carrier by welding. The alignment method according to claim 11. 14. A semiconductor laser chip that emits laser light and a converter that converts the laser light into parallel light. a collimating lens, an optical isolator, and a front part of a segmented gradient index lens; A rear part of a segmented gradient index lens and an optical fiber having an optical axis and an inclined input end face. In the optical fiber module arranged in this order, the semiconductor laser chip and , a laser that couples the collimating lens and the optical isolator at a predetermined position. side assembly; an intermediate assembly including means for fixing and holding the front portion of the segmented gradient index lens; Li and an inner cylinder that fixes and holds the optical fiber; and an inner cylinder that adjusts in the axial direction. The outer sillage that is inserted so that it can be articulated and the rear part of the segmented gradient index lens are fixed. ・A fiber side assembly comprising a cylindrical lens holder to hold the front The cylindrical lens holder is radially adjustable with respect to the optical axis of the optical fiber. attached to the inner cylinder, and said laser side assembly is attached to an intermediate lens assembly. Specifically, the intermediate lens assemblies are respectively fixed to the fiber side assemblies. A semiconductor laser module characterized by: 15. The cylindrical lens holder has a radial axis that abuts the end surface of the inner cylinder. 15. The semiconductor laser module according to claim 14, further comprising a flange portion. . 16. Further comprising means for attaching the semiconductor laser chip and the collimating lens. The mounting means includes a circular portion having an externally threaded portion that fixes and holds the collimating lens. a cylindrical lens holder; a spacer member having an internally threaded portion that engages with the externally threaded portion of the lens holder; fixing the semiconductor laser chip, the semiconductor laser chip having a flat surface to which the spacer member is fixed; - Attach the chip carrier to be held and the lens holder to the spacer member. and means for fixing the carrier members to the chip carrier by welding, respectively. 15. The semiconductor laser module according to claim 14. 17. The optical isolator is provided with polarizers on both sides of a Faraday rotator. The semiconductor laser module according to claim 14, characterized in that: 18. Each assembly has a housing made of stainless steel, and each assembly has a housing made of stainless steel. A claim characterized in that the housings are connected to each other by laser welding. 15. The semiconductor laser module according to item 14.