JPH0249329B2 - - Google Patents
Info
- Publication number
- JPH0249329B2 JPH0249329B2 JP57213362A JP21336282A JPH0249329B2 JP H0249329 B2 JPH0249329 B2 JP H0249329B2 JP 57213362 A JP57213362 A JP 57213362A JP 21336282 A JP21336282 A JP 21336282A JP H0249329 B2 JPH0249329 B2 JP H0249329B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- epoxy
- epoxy resin
- phenol
- polycondensate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011342 resin composition Substances 0.000 claims description 18
- 239000003822 epoxy resin Substances 0.000 claims description 17
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 15
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 9
- -1 aralkyl ether Chemical compound 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000011256 inorganic filler Substances 0.000 description 7
- 229910003475 inorganic filler Inorganic materials 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 239000012778 molding material Substances 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- QSSXJPIWXQTSIX-UHFFFAOYSA-N 1-bromo-2-methylbenzene Chemical compound CC1=CC=CC=C1Br QSSXJPIWXQTSIX-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 125000000113 cyclohexyl group Chemical class [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21336282A JPS59105018A (ja) | 1982-12-07 | 1982-12-07 | 封止用樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21336282A JPS59105018A (ja) | 1982-12-07 | 1982-12-07 | 封止用樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59105018A JPS59105018A (ja) | 1984-06-18 |
| JPH0249329B2 true JPH0249329B2 (ko) | 1990-10-29 |
Family
ID=16637917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21336282A Granted JPS59105018A (ja) | 1982-12-07 | 1982-12-07 | 封止用樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59105018A (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002220576A (ja) * | 2001-01-26 | 2002-08-09 | Hitachi Chem Co Ltd | 接着剤組成物、接着部材、半導体搭載用支持部材及び半導体装置等 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2675746B2 (ja) * | 1993-10-26 | 1997-11-12 | 松下電工株式会社 | 半導体封止用エポキシ樹脂成形材料 |
| US6297332B1 (en) | 1998-04-28 | 2001-10-02 | Mitsui Chemicals, Inc. | Epoxy-resin composition and use thereof |
| KR101237137B1 (ko) * | 2000-02-15 | 2013-02-25 | 히타치가세이가부시끼가이샤 | 반도체 장치 |
| US8552572B2 (en) | 2008-08-01 | 2013-10-08 | Sumitomo Bakelite Co., Ltd. | Resin composition for encapsulating semiconductor and semiconductor device using the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53299A (en) * | 1976-06-25 | 1978-01-05 | Hitachi Ltd | Epoxy resin composition |
| JPS5967660A (ja) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置 |
-
1982
- 1982-12-07 JP JP21336282A patent/JPS59105018A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53299A (en) * | 1976-06-25 | 1978-01-05 | Hitachi Ltd | Epoxy resin composition |
| JPS5967660A (ja) * | 1982-10-12 | 1984-04-17 | Toshiba Corp | 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002220576A (ja) * | 2001-01-26 | 2002-08-09 | Hitachi Chem Co Ltd | 接着剤組成物、接着部材、半導体搭載用支持部材及び半導体装置等 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59105018A (ja) | 1984-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0468345B2 (ko) | ||
| JPH08245755A (ja) | エポキシ樹脂組成物および電子部品封止装置 | |
| JPH0249329B2 (ko) | ||
| JPH0513185B2 (ko) | ||
| JP2641183B2 (ja) | 封止用樹脂組成物 | |
| JPH0528243B2 (ko) | ||
| JPS6042418A (ja) | 封止用樹脂組成物 | |
| JPH0548770B2 (ko) | ||
| JPH1030049A (ja) | エポキシ樹脂組成物および電子部品封止装置 | |
| JPH0621152B2 (ja) | 封止用樹脂組成物 | |
| JPH0562612B2 (ko) | ||
| JPH0739471B2 (ja) | 封止用樹脂組成物 | |
| JPS60161423A (ja) | 封止用樹脂組成物 | |
| JPH1112442A (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JPH093169A (ja) | 封止用樹脂組成物および電子部品封止装置 | |
| JPH0621154B2 (ja) | 封止用樹脂組成物 | |
| JPH0314050B2 (ko) | ||
| JPH0676477B2 (ja) | 封止用樹脂組成物 | |
| JPS6143621A (ja) | 封止用樹脂組成物 | |
| JPH0668006B2 (ja) | 封止用樹脂組成物 | |
| JPS60152522A (ja) | 封止用樹脂組成物 | |
| JPH0249328B2 (ko) | ||
| JP3298084B2 (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JPH0676476B2 (ja) | 封止用樹脂組成物 | |
| JPH0747681B2 (ja) | 封止用樹脂組成物 |