JPH0249140U - - Google Patents
Info
- Publication number
- JPH0249140U JPH0249140U JP12774388U JP12774388U JPH0249140U JP H0249140 U JPH0249140 U JP H0249140U JP 12774388 U JP12774388 U JP 12774388U JP 12774388 U JP12774388 U JP 12774388U JP H0249140 U JPH0249140 U JP H0249140U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- lead
- semiconductor device
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000008188 pellet Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12774388U JPH0249140U (it) | 1988-09-29 | 1988-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12774388U JPH0249140U (it) | 1988-09-29 | 1988-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0249140U true JPH0249140U (it) | 1990-04-05 |
Family
ID=31380445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12774388U Pending JPH0249140U (it) | 1988-09-29 | 1988-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0249140U (it) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04136484A (ja) * | 1990-09-28 | 1992-05-11 | Matsushita Electric Ind Co Ltd | 電子点火装置 |
| JP2006253681A (ja) * | 2005-03-07 | 2006-09-21 | Agere Systems Inc | 集積回路パッケージ |
| US7230320B2 (en) | 2003-02-18 | 2007-06-12 | Hitachi, Ltd. | Electronic circuit device with reduced breaking and cracking |
| JP2008066457A (ja) * | 2006-09-06 | 2008-03-21 | Asmo Co Ltd | 自動車用モータの制御用コネクタ一体型半導体モジュール |
-
1988
- 1988-09-29 JP JP12774388U patent/JPH0249140U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04136484A (ja) * | 1990-09-28 | 1992-05-11 | Matsushita Electric Ind Co Ltd | 電子点火装置 |
| US7230320B2 (en) | 2003-02-18 | 2007-06-12 | Hitachi, Ltd. | Electronic circuit device with reduced breaking and cracking |
| JP2006253681A (ja) * | 2005-03-07 | 2006-09-21 | Agere Systems Inc | 集積回路パッケージ |
| JP2008066457A (ja) * | 2006-09-06 | 2008-03-21 | Asmo Co Ltd | 自動車用モータの制御用コネクタ一体型半導体モジュール |
| JP4745925B2 (ja) * | 2006-09-06 | 2011-08-10 | アスモ株式会社 | 自動車用モータの制御用コネクタ一体型半導体モジュール |