JPH0248168A - Surface grinding - Google Patents

Abstract

PURPOSE:To precisely grind a work by forming an annular groove on the external surface of a rotary body on the spindle of a machine tool, turning this rotary body, moving the work in the direction of the Z-axis, pressing it against the rotary body, and moving the work in the direction of the X-axis according to the pressing force or reciprocating the work in the direction of the Y-axis. CONSTITUTION:A metal block retained on the main spindle of a machine tool is turned and ground in the form of a rotary body 2 under the control of a computer and simultaneously, an annular groove 2a is formed on the external surface of the rotary body 2 during the turning and grinding operation. Then with abrasive grain supplied, the rotary body is turned on the main spindle and the work 1 held on an X-Y-Z-axis stage 3 is moved in the direction of the Z-axis until pressed by the rotary body 2. The work is moved in the direction of the X-axis while the pressing force is being measured by a pressure sensor 8 and controlled, and also moved in the reciprocating orbit 3a on the Y-axis plane, whereby grinding the surface of the work 1. As a result, the shaping precision for the work 1 is improved in both the longitudinal direction and the lateral direction and the suitable surface roughness may be provided.

Description

[Detailed description of the invention]

[Industrial Field of Application] The present invention relates to a method for polishing the surface of thin plate ceramics and the like. [Prior Art] In recent years, highly precisely processed ceramics have been frequently used for substrates of electronic components. For example, alumina titanium carbide (A j! z 03/
Tic) is used, and the slot height of the head portion is required to have a dimensional accuracy of 1.5±0.5 μm, a flatness of 0.04 μm, and a surface roughness of 0.02 μm, which are extremely high precision. Conventionally, throat hide has been polished using a curved surface polishing device using a machine tool as shown in FIGS. 4 and 5. In Fig. 4, machine tool A performs rotary grinding, ■ is a workpiece, 2 is a cylindrical lap, 4 is abrasive grains, 5 is an abrasive grain supply device, 6 is a precision spindle, 7 is x, y, z stage, 8 is a pressure sensor, 9 is a personal computer for creating a program, and 10 is an NC controller that controls the machine tool A. In the conventional polishing method, after a metal block is attached to the precision spindle 6 of the machine tool A, a cylindrical lap of the rotating body is machined by rotary grinding, and the workpiece 1 is placed N against the cylindrical lap 2.
Surface polishing was performed while supplying abrasive grains 4 by moving an xy, z stage 7 controlled by a C controller. At this time, if the initial conditions such as the polishing load, the amount of polishing in the X direction at each X coordinate of the workpiece, the amount of Y-axis movement, and the amount of polishing per unit speed are entered into the computer 9, the computer 9
The amount of movement and movement speed of the three axes of the stage 7 are calculated, the control program is sent to the NC controller 10, and the X, YZ stage 7 is moved based on the program to obtain a machined surface of the desired shape. Ta. Here, the polishing amount in the X direction at each X coordinate of the workpiece 1 is the fifth
Representative point δ1 shown in the figure. δ2. - δ, - δ7, using the values measured in advance with a point contact type surface measuring instrument, etc., interpolate between them to find the polishing amount function δ(x), calculate the corresponding X-axis moving speed, The method used was polishing. Figure 6 shows the results of polishing with this conventional device. 1b shows the interference fringes when flatness was measured using a HeNe laser, and the same or equivalent parts as in Figure 5 are the same. A symbol is attached. [Problems to be Solved by the Invention] However, although the conventional polishing method described above can obtain shape accuracy of 0.3 μm or less in a short time, Approximately 0.4μ over the entire area
There were problems in that not only sag in m occurred, but also the surface roughness increased to 0.09 μm. An object of the present invention is to provide a surface polishing method that eliminates the above-mentioned problems and provides a machined surface with good shape accuracy and surface roughness, especially in the transverse direction (Y direction) of the workpiece. It is said that [Means for Solving the Problems] In the present invention, a metal block held on the main shaft of a machine tool is rotary-ground by computer control to form a rotary body 2, and the outer periphery of this rotary body 2 is rotary-grinded. An annular groove 2a is formed, and the rotary body 2 is rotated on the main axis while supplying abrasive grains, and the workpiece 1 placed on mutually orthogonal X, Y, and Z axis stages 3 is moved in the Z axis direction. The surface of the workpiece 1 is moved to press against the rotating body 2, and this pressure contact force is measured and controlled by the pressure sensor 7, and the surface of the workpiece 1 is moved in the X-axis direction and reciprocated in the Y-axis direction. Polish. [Operation] The surface of the rotating outer periphery of the cylindrical lamp 2 provided with the annular groove 2a is polished while giving the workpiece l a reciprocating swing in the Y-axis direction. A machined surface with good shape accuracy in both the longitudinal direction (X-axis direction in FIG. 3) and the transverse direction (Y-axis direction in FIG. 3) of the workpiece 1 and good surface roughness can be obtained. [Example] The present invention will be described below with reference to the drawings. FIG. 1 shows an enlarged perspective view of the stage, processing tools, etc. of a machine tool that performs rotary grinding. In the figure, 3 is an XY, Z stage, and the movement of this stage 3 is controlled by an NC controller not shown. A substantially rectangular workpiece ■ is placed on the stage 3 via a pressure sensor 8.
is a rotating cylindrical lamp rotatably mounted on a precision main shaft (not shown). A plurality of rings a2a are formed in the cylindrical wrap 2 in the circumferential direction by rotary grinding. This cylindrical wrap 2 is made by attaching a predetermined metal block, such as tin, to the main shaft of a machine tool, rotating it and processing it into a precise cylindrical shape, and then removing part of the outer periphery of this cylinder using another tool. It is made by forming several precise annular grooves 2a. An NC controller (not shown) rotates the cylindrical wrap 2 and moves the x-, y-, and z-axis stages 3. At this time, while supplying industrial diamond abrasive grains,
The workpiece 1 is brought into pressure contact with a rotating cylindrical wrap 2 with a programmed pressing force, and this pressing force is measured by a pressure sensor 8 and monitored by an NC controller, etc., and polished using abrasive grains. At this time, polishing load, X at each X coordinate of the workpiece
A program with initial conditions such as the amount of polishing in the direction, the amount of Y-axis oscillation, the amount of polishing per unit speed, etc. is input into a personal computer or the like in advance. A program is sent from this personal computer or the like to an NC controller (not shown) to control the machine tool and execute the above operations. In particular, while moving the stage 3 in the X direction, it is reciprocated in the Y direction at a preprogrammed period. As a result, the corner of the annular groove 2a grinds the surface of the workpiece 1 by rotation and movement in the Y direction. In this way, polishing is performed in a zigzag trajectory starting from one end in the X direction and ending at the end. Figures 2 and 3 show the results of actual processing using this polishing method, and Figure 1a in Figure 3 shows interference fringes when flatness was measured using a He-Ne laser. . As shown in Figure 2, increasing the rocking speed improves the surface roughness in the Y-axis direction, and the Rmax value, which was 0.09 μm, can be increased to more than 500 fins/min. It can be seen that the thickness is improved to 0.025 μm. or,
As shown in FIG. 3, it can be seen that the flatness, which was conventionally about 0.4 μm, has been improved to 0.15 μm. In the second embodiment, a cylindrical lamp was used, but a conical lamp or the like may be used depending on the shape of the finished surface of the workpiece. Further, in the above embodiment, the method of adding vibration was performed using the control progera l, but a method such as using oscillation of a piezo element may also be applied. Furthermore, as an abrasive grain, −
In addition to the diamond used for boat fishing, fine abrasive grains such as colloidal silica (particle size 0.02 to 0.12 μm) can also be used, and it is also possible to make the flatness about 0.04 μm. [Effects of the Invention] As described above, according to the present invention, a metal block held on the main shaft of a machine tool is rotary ground by computer control to form a rotating body, and a rotating body is formed on the outer periphery of this rotating body. An annular groove is formed by grinding, and the rotating body is rotated on the main axis while supplying abrasive grains, and the workpiece placed on mutually orthogonal X, Y, and Z axis stages is moved in the Z axis direction. The workpiece is brought into pressure contact with the rotating body, and this pressure contact force is measured and controlled by a pressure sensor, and the surface of the workpiece is polished while being moved in the X-axis direction and reciprocated in the Y-axis direction. Therefore, when processing workpieces such as ultra-thin ceramic plates in the longitudinal direction (
This has the effect of providing a machined surface with good shape accuracy in both the X-axis direction) and the lateral direction (Y-axis direction) and with good surface roughness.

[Brief explanation of the drawing]

FIG. 1 is a partial enlarged view of curved surface polishing according to an embodiment of the present invention;
Fig. 2 is a diagram showing the experimental results regarding surface roughness, Fig. 3 is a diagram showing the experimental results regarding shape accuracy, Fig. 4 is a conventional equipment system diagram, Fig. 5 is an enlarged view of a conventional polishing part, and Fig. 6 is a diagram showing experimental results regarding surface roughness. The figure is a diagram showing experimental results regarding conventional shape accuracy. In the figure, ■ is the workpiece, 1a is the interference pattern of the polished surface according to the present invention when the flatness was measured using a He-Ne laser, and 1b is the interference pattern when the flatness was measured using the He-Ne laser. 2 is a cylindrical lamp, 2a is an annular groove, 3 is an x, y, and z axis stage, 3
a is a swing locus, and 8 is a pressure sensor. Agent Masuo Oiwa (and 2 others) Report procedure amendment (voluntary) 5. Full text of the specification to be amended. 6. Contents of the amendment The entire text of the specification shall be amended as shown in the attached sheet. Above 2. Name of the invention Surface polishing method 3. Relationship with the case of the person making the amendment Patent applicant address 2-2-3 Marunouchi, Chiyoda-ku, Tokyo Name (601) Mitsubishi Electric Corporation Representative Moriya Shiki 4 , Agent address: 2-2-3 Marunouchi, Chiyoda-ku, Tokyo Description (Masasa Shiura) 1. Name of the invention Surface polishing method 2. Claims Gripping on the main shaft of a machine tool by computer control A rotating body is formed by rotating the metal block, and an annular groove is formed on the outer periphery of this rotating body using a rotating concave plate.The rotating body is rotated on its main axis while supplying abrasive grains, and the grooves are perpendicular to each other. X to do,
The workpiece placed on the Y- and Z-axis stage is moved in the Z-axis direction and pressed against the rotating body, and this pressure contact force is measured and controlled by a pressure sensor, and the workpiece is moved in the X-axis direction and A surface polishing method in which the surface of the workpiece is polished while reciprocating in the axial direction. 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a method for polishing the surface of thin plate ceramics and the like. [Prior Art] In recent years, highly precisely processed ceramics have been frequently used for substrates of electronic components. For example, alumina titanium carbide (A 12203/T
IC) is used, and the slot height of the head part has a dimensional accuracy of 1.5 ± 0.5 μm, a flatness of 0.04 μm, and a surface roughness of 0.
．． Very high precision of 0.02 μm is required. Conventionally, throat hide has been polished using a curved surface polishing device using a machine tool as shown in FIGS. 4 and 5. In Fig. 4, machine tool A performs rotary cutting, 1 is a workpiece, 2 is a cylindrical lamp, 4 is an abrasive grain, 5 is an abrasive grain supply device, 6 is a precision spindle, 7 is an X, Y, In the Z stage, 8 is a pressure sensor, 9 is a computer for creating a program, and 10 is an NC controller that controls the machine tool A. In the conventional polishing method, after a metal block is attached to the precision spindle 6 of the machine tool A, a cylindrical lamp of the rotating body is machined by rotary cutting, and the workpiece 1 is placed against the cylindrical lap 2.
Surface polishing was performed while supplying abrasive grains 4 by moving an XY and Z stage 7 controlled by a C controller. At this time, if the initial conditions such as the polishing load, the amount of polishing in the X direction at each X coordinate of the workpiece, the amount of Y-axis movement, and the amount of polishing per unit speed are entered into the computer 9, the computer 9
The movement amount and movement speed of the three axes of the stage 7 are calculated, and the control program is sent to the NC controller 10, and based on it, the X, Y. The Z stage 7 was moved to obtain a machined surface of a desired shape. Here, X at each X coordinate of workpiece 1
The polishing amount in the direction is defined as the polishing amount at the representative point δ1. shown in FIG. δ2.
- δ, -δ, using the value measured in advance with a 41-digit sensor or polishing mark etc. for each chip in the wafer manufacturing process, and interpolating between them to calculate the polishing amount function δ (
x), calculate the corresponding moving speed of the X-axis, and then perform polishing. Figure 6 shows the results of polishing with this conventional device, where 1b is He
This figure shows interference fringes when the flatness was measured using a Ne laser, and the same or equivalent parts as in FIG. 5 are given the same reference numerals. [Problems to be Solved by the Invention] However, in the conventional polishing method described above, although a shape accuracy of 0.3 μm or less can be obtained in a short time, Approximately 0.4μ over the entire area
There were problems in that not only sag in m occurred, but also the surface roughness increased to 0.09 μm. An object of the present invention is to provide a surface polishing method that eliminates the above-mentioned problems and provides a machined surface with good shape accuracy and surface roughness, especially in the transverse direction (Y direction) of the workpiece. It is said that [Means for Solving the Problems] In the present invention, the rotating body 2 is formed by rotary cutting a metal block held on the main shaft of a machine tool under computer control, and the outer periphery of the rotating body 2 is formed by rotary cutting. An annular groove 2a is formed, and the rotary body 2 is rotated on the main axis while supplying abrasive grains, and the workpiece 1 placed on mutually orthogonal X, Y, and Z axis stages 3 is moved in the X axis direction. The surface of the workpiece 1 is moved to press against the rotating body 2, and this pressure contact force is measured and controlled by the pressure sensor 7, and the surface of the workpiece 1 is moved in the X-axis direction and reciprocated in the Y-axis direction. Polish. [Operation] The surface of the rotating outer periphery of the cylindrical wrap 2 provided with the annular groove 2a is polished while giving the workpiece 1 reciprocating rocking in the Y-axis direction. A machined surface with good shape accuracy and good surface roughness can be obtained in both the longitudinal direction (X-axis direction in FIG. 3) and the transverse direction (Y-axis direction in FIG. 3) of the workpiece 1. [Example] The present invention will be described below with reference to the drawings. FIG. 1 shows an enlarged perspective view of the stage, processing tools, etc. of a machine tool that performs rotary cutting. In the figure, 3 is an X, Y, and Z stage, and the movement of this stage 3 is controlled by an NC controller not shown. A substantially rectangular workpiece l is placed on the stage 3 via a pressure sensor 8.
2 is a rotating cylindrical lamp rotatably mounted on a precision main shaft (not shown). A plurality of annular grooves 2a are formed in the cylindrical wrap 2 in the circumferential direction by rotary cutting. This cylindrical wrap 2 is made by attaching a predetermined metal block, such as tin, to the main shaft of a machine tool and cutting it rotary to form a precise cylindrical shape.
Next, using another tool, a portion of the outer periphery of this cylinder was removed to form several precise annular grooves 2a. An NC controller (not shown) rotates the cylindrical wrap 2 and moves the X, Y, and Z axis stages 3. At this time, while supplying industrial diamond abrasive grains, the workpiece 1 is brought into pressure contact with the rotating cylindrical wrap 2 with a programmed pressing force, and this pressing force is measured by the pressure sensor 8.
Polishing is performed using abrasive grains while monitoring with a C controller or the like. At this time, a program whose initial conditions include the polishing load, the amount of polishing in the X direction at each X coordinate of the workpiece, the amount of Y-axis oscillation, the amount of polishing per unit speed, etc. is input into a personal computer or the like in advance. A program is sent from this personal computer or the like to an NC controller (not shown) to control the machine tool and execute the above operations. In particular, while moving the stage 3 in the X direction, it is reciprocated in the Y direction at a preprogrammed period. As a result, the corner of the annular groove 2a rotates the surface of the workpiece l by Y
Polish by directional movement. In this way, polishing is performed in a zigzag trajectory starting from one end in the X direction and ending at the end. 2 and 3 show the results of actual processing using this polishing method, and 1a in FIG. 3 shows interference fringes when the flatness was measured using a He--Ne laser. As shown in Fig. 2, increasing the rocking speed improves the surface roughness in the Y-axis direction.
It can be seen that the thickness is improved to 0.025 μm. In addition, as shown in Figure 3, the flatness, which was conventionally about 0.4 μm, has decreased to 0.
．． It can be seen that the thickness is improved to 15 μm. Although a cylindrical lamp is used in the above embodiment, a conical lamp or the like may be used depending on the shape of the finished surface of the workpiece. Further, in the above embodiments, the method of adding vibration was performed using a control program, but a method such as using oscillation of a Pieg element may also be applied. Furthermore, as the abrasive grains, - in addition to diamonds used for boat fishing, fine abrasive grains such as colloidal silica (particle size 0.02 to 0.12 μm) can also be used to achieve a flatness of about 0.04 μm. It is also possible. [Effects of the Invention] As explained above, according to the present invention, a metal block held on the main shaft of a machine tool is rotatably cut by computer control to form a rotating body, and a rotating body is formed on the outer periphery of the rotating body. An annular groove is formed by cutting, the rotating body is rotated on the main axis while supplying abrasive grains, and the workpiece placed on mutually orthogonal X, Y, and Z axis stages is moved in the Z axis direction. The workpiece is brought into pressure contact with the rotating body, and this pressure contact force is measured and controlled by a pressure sensor, and the surface of the workpiece is polished while being moved in the X-axis direction and reciprocated in the Y-axis direction. Therefore, when processing workpieces such as ultra-thin ceramic plates in the longitudinal direction (
This has the effect of providing a machined surface with good shape accuracy in both the X-axis direction) and the lateral direction (Y-axis direction) and with good surface roughness.

[Brief explanation of the drawing]

=7 FIG. 1 is a partial enlarged view of curved surface polishing according to an embodiment of the present invention.
Fig. 2 is a diagram showing the experimental results regarding surface roughness, Fig. 3 is a diagram showing the experimental results regarding shape accuracy, Fig. 4 is a conventional equipment system diagram, Fig. 5 is an enlarged view of a conventional polishing part, and Fig. 6 is a diagram showing experimental results regarding surface roughness. The figure is a diagram showing experimental results regarding conventional shape accuracy. In the figure, 1 is the workpiece, 1a is the interference pattern of the polished surface according to the present invention when the flatness was measured using a He-Ne laser, and 1b is the interference pattern when the flatness was measured using the He-Ne laser. 2 is a cylindrical lamp, 2a is an annular groove, 3 is an X, Y, and Z axis stage, 3a is a swing locus, and 8 is a pressure sensor.

Claims (1)

[Claims] A metal lump held on the main shaft of a machine tool is rotary-ground by computer control to form a rotary body, and an annular groove is formed on the outer periphery of this rotary body by rotary grinding, and the rotary body is rotated while supplying abrasive grains. are rotated on the main axis, and X, which are perpendicular to each other,
The workpiece placed on the Y- and Z-axis stage is moved in the Z-axis direction and pressed against the rotating body, and this pressure contact force is measured and controlled by a pressure sensor, and the workpiece is moved in the X-axis direction and A surface polishing method in which the surface of the workpiece is polished while reciprocating in the axial direction.