JPH0247828U - - Google Patents
Info
- Publication number
- JPH0247828U JPH0247828U JP12747488U JP12747488U JPH0247828U JP H0247828 U JPH0247828 U JP H0247828U JP 12747488 U JP12747488 U JP 12747488U JP 12747488 U JP12747488 U JP 12747488U JP H0247828 U JPH0247828 U JP H0247828U
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- wave element
- case member
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図はこの考案の一実施例を示す斜視図であ
る。第２図は第１図実施例の分解斜視図である。
第３図は第１図および第２図に示す弾性表面波装
置に用いられる弾性表面波素子を示す斜視図であ
る。第４図は第１図および第２図に示す弾性表面
波装置に用いられるケース部材を示す斜視図であ
る。
図において、１０は弾性表面波装置、１２は基
台、１４ａ，１４ｂ，１４ｃおよび１４ｄは電極
、１６は弾性表面波素子、２０ａおよび２０ｂは
インタデイジタル電極、２２ａ，２２ｂ，２２ｃ
および２２ｄははんだ材、２６はケース部材を示
す。
FIG. 1 is a perspective view showing an embodiment of this invention. FIG. 2 is an exploded perspective view of the embodiment shown in FIG.
FIG. 3 is a perspective view showing a surface acoustic wave element used in the surface acoustic wave device shown in FIGS. 1 and 2. FIG. FIG. 4 is a perspective view showing a case member used in the surface acoustic wave device shown in FIGS. 1 and 2. FIG. In the figure, 10 is a surface acoustic wave device, 12 is a base, 14a, 14b, 14c and 14d are electrodes, 16 is a surface acoustic wave element, 20a and 20b are interdigital electrodes, 22a, 22b, 22c
22d represents a solder material, and 26 represents a case member.
Claims (1)
され、前記基台にフエースダウンボンデイングさ
れる弾性表面波素子、および 前記弾性表面波素子を覆うケース部材を含む弾
性表面波装置であつて、 前記弾性表面波素子の外寸と前記ケース部材の
内寸とがほぼ同じ大きさに形成され、 前記弾性表面波素子の前記インタデイジタル電
極が形成されていない面の少なくとも一部分が前
記ケース部材の内面に接着された、弾性表面波装
置。[Claims for Utility Model Registration] A base on which electrodes are formed; a surface acoustic wave element on which interdigital electrodes are formed on one main surface thereof and face-down bonded to the base; and the surface acoustic wave element. A surface acoustic wave device including a covering case member, wherein the outer dimensions of the surface acoustic wave element and the inner dimensions of the case member are formed to be approximately the same size, and the interdigital electrodes of the surface acoustic wave element are formed. A surface acoustic wave device, wherein at least a portion of a surface that is not bonded is bonded to an inner surface of the case member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12747488U JPH0247828U (en) | 1988-09-28 | 1988-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12747488U JPH0247828U (en) | 1988-09-28 | 1988-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247828U true JPH0247828U (en) | 1990-04-03 |
Family
ID=31379942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12747488U Pending JPH0247828U (en) | 1988-09-28 | 1988-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247828U (en) |
-
1988
- 1988-09-28 JP JP12747488U patent/JPH0247828U/ja active Pending