JPH0247289A - 硫酸銅めっき方法 - Google Patents
硫酸銅めっき方法Info
- Publication number
- JPH0247289A JPH0247289A JP19737188A JP19737188A JPH0247289A JP H0247289 A JPH0247289 A JP H0247289A JP 19737188 A JP19737188 A JP 19737188A JP 19737188 A JP19737188 A JP 19737188A JP H0247289 A JPH0247289 A JP H0247289A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- copper
- copper sulfate
- iron material
- strike
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims description 79
- 229910000365 copper sulfate Inorganic materials 0.000 title claims description 37
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 title claims description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 17
- 239000010949 copper Substances 0.000 title claims description 16
- 229910052802 copper Inorganic materials 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 55
- 229910052742 iron Inorganic materials 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 25
- 230000002378 acidificating effect Effects 0.000 claims description 8
- 238000009713 electroplating Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000005554 pickling Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 3
- -1 iron ions Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000001988 toxicity Effects 0.000 description 3
- 231100000419 toxicity Toxicity 0.000 description 3
- 238000013019 agitation Methods 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000003518 caustics Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- RSEBUVRVKCANEP-UHFFFAOYSA-N 2-pyrroline Chemical compound C1CC=CN1 RSEBUVRVKCANEP-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 206010011703 Cyanosis Diseases 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- BWFPGXWASODCHM-UHFFFAOYSA-N copper monosulfide Chemical compound [Cu]=S BWFPGXWASODCHM-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910000358 iron sulfate Inorganic materials 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- AVTYONGGKAJVTE-OLXYHTOASA-L potassium L-tartrate Chemical compound [K+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O AVTYONGGKAJVTE-OLXYHTOASA-L 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 239000001472 potassium tartrate Substances 0.000 description 1
- 229940111695 potassium tartrate Drugs 0.000 description 1
- 235000011005 potassium tartrates Nutrition 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- ZVJHJDDKYZXRJI-UHFFFAOYSA-N pyrroline Natural products C1CC=NC1 ZVJHJDDKYZXRJI-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19737188A JPH0247289A (ja) | 1988-08-08 | 1988-08-08 | 硫酸銅めっき方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19737188A JPH0247289A (ja) | 1988-08-08 | 1988-08-08 | 硫酸銅めっき方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0247289A true JPH0247289A (ja) | 1990-02-16 |
JPH0521993B2 JPH0521993B2 (enrdf_load_stackoverflow) | 1993-03-26 |
Family
ID=16373387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19737188A Granted JPH0247289A (ja) | 1988-08-08 | 1988-08-08 | 硫酸銅めっき方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0247289A (enrdf_load_stackoverflow) |
-
1988
- 1988-08-08 JP JP19737188A patent/JPH0247289A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0521993B2 (enrdf_load_stackoverflow) | 1993-03-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5454930A (en) | Electrolytic copper plating using a reducing agent | |
US3152009A (en) | Electroless nickel plating | |
DE3428345C2 (enrdf_load_stackoverflow) | ||
US2636850A (en) | Electroplating of copper from cyanide electrolytes | |
US2654701A (en) | Plating aluminum | |
US4904354A (en) | Akaline cyanide-free Cu-Zu strike baths and electrodepositing processes for the use thereof | |
US3264199A (en) | Electroless plating of metals | |
US3637474A (en) | Electrodeposition of palladium | |
US3879270A (en) | Compositions and process for the electrodeposition of metals | |
US3131134A (en) | Electroplating from an organic electrolytic solution | |
US3684666A (en) | Copper electroplating in a citric acid bath | |
US2457059A (en) | Method for bonding a nickel electrodeposit to a nickel surface | |
JPH0270084A (ja) | 金めっき浴及び金めっき方法 | |
US4673471A (en) | Method of electrodepositing a chromium alloy deposit | |
JPS591668A (ja) | 改良無電解金めつき浴及びめつき方法 | |
JPH0247289A (ja) | 硫酸銅めっき方法 | |
US5174870A (en) | Electrocleaning method | |
DE3347593C2 (enrdf_load_stackoverflow) | ||
US3667991A (en) | Processes for nickel plating metals | |
US3667972A (en) | Chemical nickel plating baths | |
US3617451A (en) | Thiosulfate copper plating | |
US4615774A (en) | Gold alloy plating bath and process | |
US3694326A (en) | Pretreatment of stainless steel for electroplating | |
US3475290A (en) | Bright gold plating solution and process | |
US2966448A (en) | Methods of electroplating aluminum and alloys thereof |