JPH0247072U - - Google Patents
Info
- Publication number
- JPH0247072U JPH0247072U JP1988126049U JP12604988U JPH0247072U JP H0247072 U JPH0247072 U JP H0247072U JP 1988126049 U JP1988126049 U JP 1988126049U JP 12604988 U JP12604988 U JP 12604988U JP H0247072 U JPH0247072 U JP H0247072U
- Authority
- JP
- Japan
- Prior art keywords
- guide
- semiconductor device
- rail
- groove
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
Landscapes
- Chutes (AREA)
Description
第１図は本考案の一実施例の案内装置の断面図
、第２図は第１図の実施例の案内装置でＺＩＰ型
の半導体装置を案内する場合の一部断面図、第３
図は第１図の実施例の案内装置でＳＯＰ型の半導
体装置を案内する場合の一部断面図、第４図は従
来例の断面図、第５図は他の従来例の断面図であ
る。
１……案内装置、２……上レール、３……下レ
ール、４……ＤＩＰ型の半導体装置、６……案内
面、９〜１６……案内溝、２０……ＺＩＰ型の半
導体装置、２２……ＳＯＰ型の半導体装置。
FIG. 1 is a sectional view of a guiding device according to an embodiment of the present invention, FIG. 2 is a partial sectional view of the guiding device according to the embodiment of FIG. 1 for guiding a ZIP type semiconductor device, and FIG.
The figure is a partial sectional view of the case where an SOP type semiconductor device is guided by the guiding device of the embodiment shown in FIG. 1, FIG. 4 is a sectional view of a conventional example, and FIG. 5 is a sectional view of another conventional example. . DESCRIPTION OF SYMBOLS 1... Guide device, 2... Upper rail, 3... Lower rail, 4... DIP type semiconductor device, 6... Guide surface, 9-16... Guide groove, 20... ZIP type semiconductor device, 22...SOP type semiconductor device.
Claims (1)
用空間を介して半導体装置を案内する半導体装置
用案内装置において、 一方のレールには、平面状の案内面が形成され
、他方のレールには、複数種類の半導体装置の各
パツケージ形状に個別に対応した形状の案内溝が
形成され、 案内対象とされる半導体装置のパツケージ形状
に対応した前記他方のレールの案内溝が、前記一
方のレールの案内面に対向配置されることにより
、当該半導体装置に対応した案内用空間が構成さ
れることを特徴とする半導体装置用案内装置。[Claim for Utility Model Registration] In a guide device for a semiconductor device that guides a semiconductor device through a guide space formed between a pair of opposing rails, one rail has a planar guide surface. A guide groove is formed in the other rail in a shape corresponding to each package shape of a plurality of types of semiconductor devices, and a guide groove in the other rail corresponding to the package shape of the semiconductor device to be guided is formed. A guide device for a semiconductor device, characterized in that a groove is arranged to face the guide surface of the one rail, thereby forming a guide space corresponding to the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126049U JPH0537935Y2 (en) | 1988-09-26 | 1988-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126049U JPH0537935Y2 (en) | 1988-09-26 | 1988-09-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0247072U true JPH0247072U (en) | 1990-03-30 |
| JPH0537935Y2 JPH0537935Y2 (en) | 1993-09-27 |
Family
ID=31377206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988126049U Expired - Lifetime JPH0537935Y2 (en) | 1988-09-26 | 1988-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537935Y2 (en) |
-
1988
- 1988-09-26 JP JP1988126049U patent/JPH0537935Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0537935Y2 (en) | 1993-09-27 |
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