JPH0247049U - - Google Patents
Info
- Publication number
- JPH0247049U JPH0247049U JP1988126836U JP12683688U JPH0247049U JP H0247049 U JPH0247049 U JP H0247049U JP 1988126836 U JP1988126836 U JP 1988126836U JP 12683688 U JP12683688 U JP 12683688U JP H0247049 U JPH0247049 U JP H0247049U
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor element
- insulating frame
- placing part
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126836U JPH0247049U (US07576130-20090818-C00114.png) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126836U JPH0247049U (US07576130-20090818-C00114.png) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247049U true JPH0247049U (US07576130-20090818-C00114.png) | 1990-03-30 |
Family
ID=31378719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988126836U Pending JPH0247049U (US07576130-20090818-C00114.png) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247049U (US07576130-20090818-C00114.png) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5917271A (ja) * | 1982-07-20 | 1984-01-28 | Nec Corp | セラミツクパツケ−ジ半導体装置 |
| JPS60214546A (ja) * | 1984-04-10 | 1985-10-26 | Hitachi Ltd | 半導体装置 |
| JPS613663A (ja) * | 1984-06-16 | 1986-01-09 | Narumi China Corp | 金属部材の鑞付け前処理方法 |
| JPS6252949A (ja) * | 1985-08-30 | 1987-03-07 | Nec Corp | 積層型セラミツクパツケ−ジ |
-
1988
- 1988-09-27 JP JP1988126836U patent/JPH0247049U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5917271A (ja) * | 1982-07-20 | 1984-01-28 | Nec Corp | セラミツクパツケ−ジ半導体装置 |
| JPS60214546A (ja) * | 1984-04-10 | 1985-10-26 | Hitachi Ltd | 半導体装置 |
| JPS613663A (ja) * | 1984-06-16 | 1986-01-09 | Narumi China Corp | 金属部材の鑞付け前処理方法 |
| JPS6252949A (ja) * | 1985-08-30 | 1987-03-07 | Nec Corp | 積層型セラミツクパツケ−ジ |
