JPH0247040U - - Google Patents
Info
- Publication number
- JPH0247040U JPH0247040U JP1988125909U JP12590988U JPH0247040U JP H0247040 U JPH0247040 U JP H0247040U JP 1988125909 U JP1988125909 U JP 1988125909U JP 12590988 U JP12590988 U JP 12590988U JP H0247040 U JPH0247040 U JP H0247040U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- elastic spring
- wiring pattern
- electrode
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/07251—
-
- H10W72/20—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988125909U JPH0247040U (enExample) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988125909U JPH0247040U (enExample) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247040U true JPH0247040U (enExample) | 1990-03-30 |
Family
ID=31376933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988125909U Pending JPH0247040U (enExample) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247040U (enExample) |
-
1988
- 1988-09-27 JP JP1988125909U patent/JPH0247040U/ja active Pending