JPH0193729U - - Google Patents
Info
- Publication number
- JPH0193729U JPH0193729U JP18989387U JP18989387U JPH0193729U JP H0193729 U JPH0193729 U JP H0193729U JP 18989387 U JP18989387 U JP 18989387U JP 18989387 U JP18989387 U JP 18989387U JP H0193729 U JPH0193729 U JP H0193729U
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- semiconductor element
- metal film
- wiring metal
- conductive member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
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- H10W72/884—
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- H10W90/754—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18989387U JPH0193729U (enExample) | 1987-12-16 | 1987-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18989387U JPH0193729U (enExample) | 1987-12-16 | 1987-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0193729U true JPH0193729U (enExample) | 1989-06-20 |
Family
ID=31480901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18989387U Pending JPH0193729U (enExample) | 1987-12-16 | 1987-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0193729U (enExample) |
-
1987
- 1987-12-16 JP JP18989387U patent/JPH0193729U/ja active Pending