JPH01108942U - - Google Patents

Info

Publication number
JPH01108942U
JPH01108942U JP1988002781U JP278188U JPH01108942U JP H01108942 U JPH01108942 U JP H01108942U JP 1988002781 U JP1988002781 U JP 1988002781U JP 278188 U JP278188 U JP 278188U JP H01108942 U JPH01108942 U JP H01108942U
Authority
JP
Japan
Prior art keywords
mount seat
metal base
type semiconductor
case body
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988002781U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988002781U priority Critical patent/JPH01108942U/ja
Publication of JPH01108942U publication Critical patent/JPH01108942U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/884

Landscapes

  • Die Bonding (AREA)
JP1988002781U 1988-01-13 1988-01-13 Pending JPH01108942U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988002781U JPH01108942U (enExample) 1988-01-13 1988-01-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988002781U JPH01108942U (enExample) 1988-01-13 1988-01-13

Publications (1)

Publication Number Publication Date
JPH01108942U true JPH01108942U (enExample) 1989-07-24

Family

ID=31203851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988002781U Pending JPH01108942U (enExample) 1988-01-13 1988-01-13

Country Status (1)

Country Link
JP (1) JPH01108942U (enExample)

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