JPH01108942U - - Google Patents
Info
- Publication number
- JPH01108942U JPH01108942U JP1988002781U JP278188U JPH01108942U JP H01108942 U JPH01108942 U JP H01108942U JP 1988002781 U JP1988002781 U JP 1988002781U JP 278188 U JP278188 U JP 278188U JP H01108942 U JPH01108942 U JP H01108942U
- Authority
- JP
- Japan
- Prior art keywords
- mount seat
- metal base
- type semiconductor
- case body
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988002781U JPH01108942U (enExample) | 1988-01-13 | 1988-01-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988002781U JPH01108942U (enExample) | 1988-01-13 | 1988-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01108942U true JPH01108942U (enExample) | 1989-07-24 |
Family
ID=31203851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988002781U Pending JPH01108942U (enExample) | 1988-01-13 | 1988-01-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01108942U (enExample) |
-
1988
- 1988-01-13 JP JP1988002781U patent/JPH01108942U/ja active Pending