JPH0246855U - - Google Patents
Info
- Publication number
- JPH0246855U JPH0246855U JP12242688U JP12242688U JPH0246855U JP H0246855 U JPH0246855 U JP H0246855U JP 12242688 U JP12242688 U JP 12242688U JP 12242688 U JP12242688 U JP 12242688U JP H0246855 U JPH0246855 U JP H0246855U
- Authority
- JP
- Japan
- Prior art keywords
- target
- back plate
- sputtering cathode
- protective material
- shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122426U JPH0730681Y2 (ja) | 1988-09-19 | 1988-09-19 | スパッタリングカソード |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122426U JPH0730681Y2 (ja) | 1988-09-19 | 1988-09-19 | スパッタリングカソード |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0246855U true JPH0246855U (da) | 1990-03-30 |
| JPH0730681Y2 JPH0730681Y2 (ja) | 1995-07-12 |
Family
ID=31370347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988122426U Expired - Lifetime JPH0730681Y2 (ja) | 1988-09-19 | 1988-09-19 | スパッタリングカソード |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0730681Y2 (da) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014508222A (ja) * | 2011-02-09 | 2014-04-03 | アプライド マテリアルズ インコーポレイテッド | 保護されたバッキングプレートを有するｐｖｄスパッタリングターゲット |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5647564A (en) * | 1979-09-26 | 1981-04-30 | Ulvac Corp | Operation of magnetron-type sputtering device |
| JPS609873A (ja) * | 1983-06-29 | 1985-01-18 | Fujitsu Ltd | スパツタ用タ−ゲツトの固定方法 |
-
1988
- 1988-09-19 JP JP1988122426U patent/JPH0730681Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5647564A (en) * | 1979-09-26 | 1981-04-30 | Ulvac Corp | Operation of magnetron-type sputtering device |
| JPS609873A (ja) * | 1983-06-29 | 1985-01-18 | Fujitsu Ltd | スパツタ用タ−ゲツトの固定方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014508222A (ja) * | 2011-02-09 | 2014-04-03 | アプライド マテリアルズ インコーポレイテッド | 保護されたバッキングプレートを有するｐｖｄスパッタリングターゲット |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0730681Y2 (ja) | 1995-07-12 |