JPH024668A - Electronic parts in series - Google Patents

Abstract

PURPOSE:To increase an adhesive strength of a carrier tape and a cover film, by forming slits on an adhesion face of the carrier tape with the cover film. CONSTITUTION:A cover film 15 and a lower cover film 18 have a double layer structure comprising polyester layers 19a, 19b and polyethylene layers 20a, 20b for example. Slits 21, 22, which are formed in the area corresponding to adhesion area 7, 8, are made by running of one appropriate cutter in the longitudinal direction of a carrier tape 13 or by rotation of a roller with blades on the peripheral face thereof on a carrier tape 13. When the cover film 15 is bonded with the carrier tape 13 by means of a heat-sealing method, polyethylene layer 20a is melted and hence it enters to fill up at least a part of the slits 21, 22. Accordingly, the cover films 15 can bond together the carrier tape 13 with a high adhesive strength, realizing a nearly constant adhesive strength in the longitudinal direction of the carrier tape 13.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a carrier tape in which a plurality of cavities each housing an electronic component are formed and distributed in the longitudinal direction;
It relates to an electronic component series, which includes a cover film that is adhered to a carrier tape to cover the cavity in order to hold the electronic components housed in the cavity. This is related to improvements that can be made.

[Prior Art] FIG. 5 shows a conventional electronic component series 1 in a top view.

The electronic component series 1 includes a carrier tape 3 formed with a plurality of cavities 2 distributed at equal intervals in the longitudinal direction.

Each of the cavities 2 houses a chip-shaped electronic component 4 such as a multilayer ceramic capacitor chip. Further, the carrier tape 3 is provided with a plurality of perforations 5 at a pitch that correlates with the pitch at which the cavities 2 are formed.

In order to keep the electronic component 4 as described above housed in the cavity 2, a cover film 6 is adhered to the carrier tape 3 so as to cover the cavity 2. A heat sealing method is usually used for this bonding, and a heated trowel is used to mark the bonding area 7 shown by hatching in FIG.
．． At 8 the cover film 6 is adhered to the carrier tape 3. This cover film 6 is peeled off from the carrier tape 3 when the electronic component 4 is taken out from the cavity 2.

The carrier tape 3 may be composed of a resin sheet with the cavities 2 integrally formed by embossing, but in other typical embodiments, the carrier tape 3 is constructed as follows.

That is, a base tape made of cardboard having a thickness that is approximately equal to or slightly larger than the thickness of the electronic component 4 to be housed is prepared, a through hole that will become the cavity 2 is formed in this base tape, and a through hole that will become the cavity 2 is formed in the base tape. A lower cover film is adhered in substantially the same manner as the cover film 6 to close the bottom surface. This provides a carrier tape 3 that provides a cavity 2 with a closed bottom.

[Problems to be Solved by the Invention] The adhesive strength of the above-mentioned cover film 6 to the carrier tape 3 is defined as, for example, 20 to 70 g by the Japan Electronics Industry Association standards, and must satisfy this.

As described above, the cover film 6 is bonded to the carrier tape 3 by thermocompression bonding using a heated iron. At this time, the adhesive strength can be adjusted by adjusting the iron temperature, iron pressure, crimping time,
In particular, when the portion of the carrier tape 3 forming the adhesive area 7°8 is made of cardboard as described above, the surface condition of the carrier tape 3 may be It differs slightly depending on the quality, and in many cases, it is not possible to stably obtain the desired adhesive strength using only the above-mentioned adjustment means. In other words, it is difficult to control the surface condition of cardboard during the manufacturing process, and depending on the manufacturing lot, the surface may become too dense, making it difficult for the adhesive component provided on the cover film 6 to penetrate, making it difficult to obtain sufficient adhesive strength. In some cases, the adhesive component may not be adhered to the cover film 6, or the adhesive component may protrude outside the cover film 6.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component series that can solve the problems of the prior art described above.

[Means for Solving the Problems] The present invention provides a carrier tape formed with a plurality of cavities distributed in a longitudinal direction, an electronic component housed in each of the cavities, and a carrier tape in which a plurality of cavities are disposed in each cavity. and a cover film that is adhered to the carrier tape so as to cover the cavity in order to keep the electronic component in a housed state, and is peeled off from the carrier tape when the electronic component is taken out from the cavity. In order to solve the above-mentioned technical problem, the present invention is characterized in that a slit is formed in the surface of the carrier tape to which the cover film is adhered.

[Operations and Effects of the Invention] According to the present invention, the slits formed in the carrier film allow reception or penetration of the adhesive component for adhesion to the cover film.

Therefore, since the adhesive area between the carrier tape and the cover film can be substantially increased, the adhesive strength between the carrier tape and the cover film can be improved. Further, since the adhesive strength can be improved by the presence of the slit, variations in the adhesive strength can be reduced as a result, and the adhesive state can be stabilized.

Moreover, since the adhesive component is received or permeated into the slit, the adhesive component is prevented from protruding from the cover film.

Furthermore, the adhesive strength between the carrier tape and the cover film can be adjusted by changing the number, depth, shape, and other forms of slit formation.

[Explanation of Embodiment] FIG. 1 shows an electronic component series 11 as an embodiment of the present invention.
FIG. FIG. 2 is an enlarged sectional view taken along the line ■--■ in FIG.

The electronic component group 11 is the electronic component group 1 shown in FIG.
Similarly, a carrier tape 13 formed with a plurality of cavities 12 distributed at equal intervals in the longitudinal direction, an electronic component 14 housed in each of the cavities 12, and an electronic component 14.
A cover film 15 is adhered to the carrier tape 13 so as to cover the cavity 12 in order to keep the electronic component 14 housed in the cavity 12, and is peeled off from the carrier tape 13 when the electronic component 14 is taken out from the cavity 12. Be prepared. The carrier tape 13 is also formed with perforations 16 at a pitch that correlates with the pitch at which the cavities 12 are formed.

In this embodiment, as clearly shown in FIG. 2, the carrier tape 13 includes a base tape 17 made of cardboard and a lower cover film 18. The cavity 12 is formed with a hole passing through the base tape 17, and the bottom surface of this through hole is closed by the lower cover film 18.

Both the cover film 15 and the lower cover film 18 are made of, for example, a polyester layer 19a.

19b, and polyethylene layers 20a and 2 that are bonded to each polyester layer 19a and 19b and constitute an adhesive component.
It has a two-layer structure consisting of 0b and 0b.

Slits 21, 22 are formed in areas corresponding to the adhesive areas 7, 8 shown in FIG. 5, respectively. Such slits 21, 22 may be formed by running a suitable cutter in the longitudinal direction of the carrier tape 13, or by moving the cutter over the carrier tape 13 with a roller having blades formed on its circumferential surface. I can do it.

As shown in FIG. 2, when the cover film 15 is adhered to the carrier tape 13 by applying the heat sealing method, the polyethylene layer 20a melts and the slits 21.
22 so as to fill at least a portion thereof. Therefore, the cover film 15 can be adhered to the carrier tape 13 with higher adhesive strength while achieving substantially constant adhesive strength in the longitudinal direction of the carrier tape 13.

Note that the slits 21 and 22 may be formed only on the side to which the cover film 15, which is peeled off when the electronic component 14 is taken out from the cavity 12, is adhered;
As shown in the figures, slits 23, 24 may also be provided with respect to the area where the lower cover film 18 is glued.

In this way, the electronic components 14 can be taken out from the cover film 15 side or the lower cover film 18 side regardless of whether the electronic component series 11 is on the front or the back side.

The following experiment was conducted in connection with the embodiment shown in FIGS. 1 and 2.

That is, the adhesive strength of the cover films 15 was compared under the same conditions by thermocompression bonding the cover films 15 with and without slits 21.22 (depth 0.5 mm). .

The average adhesive strength was 30g for the one without slits, while it was 21.2g for the one without slits.
In the case of No. 2, the weight was 45 g, and it was confirmed that the adhesive strength was improved.

In addition, the variation in adhesive strength (difference between the maximum value and the minimum value) was 30 g for the one without slits, but 20 g for the one with slits 21 and 22. It was confirmed that the variation was reduced.

The number, depth, shape, and other forms of the slits may be appropriately selected depending on the required adhesive strength. Other examples of how the slits are formed will be described below with reference to the drawings.

Referring to FIG. 3, two slits 25 are provided in connection with each adhesive area formed on both side edges of the cover film.
．． 26 as well as 27.28 are formed. These slits 25 to 28 each have a V-shaped cross section.

Therefore, it can be seen from this example that the cross-sectional shape of the slit is arbitrary.

Referring to FIG. 4, sleeves 29 and 30 extending diagonally with respect to the longitudinal direction of carrier tape 13 are formed in adhesive areas along both side edges of cover film 15, respectively. These slits 29°30 are the carrier tape 1
3 may be formed to extend perpendicularly to the longitudinal direction of 3. The density at which each thrift 29, 30 is formed may be selected depending on the required adhesive strength.

In FIGS. 3 and 4, parts corresponding to those shown in FIGS. 1 and 2 described above are given the same reference numerals, and redundant explanations will be omitted.

In the embodiment described above, the cover film 15 had a two-layer structure of the polyester JW 19a and the polyethylene layer 20a, as shown in FIG. 2, but it may also have a single-layer structure made of thermoplastic resin. It may be a three or more layered structure in which at least the surface in contact with the carrier tape 13 is made of thermoplastic resin. Moreover, in order to adhere the cover film to the carrier tape, in addition to applying a heat sealing method, for example, an adhesive, a pressure-sensitive adhesive, or the like may be used.

Further, in the illustrated embodiment, the carrier tape 13 is composed of a base tape 17 made of cardboard and a lower cover film 18, but it may also be an integrally molded product made of resin, for example. It may be composed of a resin sheet formed by embossing.

[Brief explanation of the drawing]

FIG. 1 shows an electronic component series 11 as an embodiment of the present invention.
FIG. FIG. 2 is an enlarged sectional view taken along the line ■--■ in FIG. FIG. 3 is an enlarged sectional view for explaining another embodiment of the present invention, showing a base tape 17 provided for the carrier tape. FIG. 4 is a top view showing an electronic component series as still another embodiment of the present invention. FIG. 5 is a top view showing a conventional electronic component series 1. In the figure, 7 and 8 are adhesive areas, 11 is an electronic component series, and 1
2 is a cavity, 13 is a carrier tape, 14 is an electronic component, 15 is a cover film, 20 a is a polyethylene layer (adhesive component), 21. 22. 25.26,27,
28, 29, and 30 are slits. Figure 4 Figure 4

Claims (1)

[Scope of Claims] A carrier tape formed with a plurality of cavities distributed in the longitudinal direction, an electronic component housed in each of the cavities, and a state in which the electronic component is kept housed in the cavity. a cover film that is adhered to the carrier tape so as to cover the cavity and is peeled off from the carrier tape when the electronic component is taken out from the cavity; An electronic component series, characterized in that a slit is formed on a surface to which the cover film is adhered.