JPH0246632U - - Google Patents
Info
- Publication number
- JPH0246632U JPH0246632U JP12617288U JP12617288U JPH0246632U JP H0246632 U JPH0246632 U JP H0246632U JP 12617288 U JP12617288 U JP 12617288U JP 12617288 U JP12617288 U JP 12617288U JP H0246632 U JPH0246632 U JP H0246632U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- heat generating
- thermal head
- soft adhesive
- generating resistors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案にかかるサーマルヘツドの一実
施例を示す断面図、第２図は第１図の丸部の拡大
断面図、第３図は第１図に示すサーマルヘツドの
ヘツド基板の斜視図、第４図は従来のサーマルヘ
ツドを示す断面図である。 １：金属支持板、２：ヘツド基板、３：発熱抵
抗体、７：軟質接着剤層、７ａ：板状体。
施例を示す断面図、第２図は第１図の丸部の拡大
断面図、第３図は第１図に示すサーマルヘツドの
ヘツド基板の斜視図、第４図は従来のサーマルヘ
ツドを示す断面図である。 １：金属支持板、２：ヘツド基板、３：発熱抵
抗体、７：軟質接着剤層、７ａ：板状体。
Claims (1)
- 上面に多数の発熱抵抗体が直線状に配列被着さ
れて成るヘツド基板を、軟質接着剤層を介し金属
支持板上に接着固定して成るサーマルヘツドにお
いて、少なくとも前記発熱抵抗体の直下部に位置
する軟質接着剤層中に３０×１０−３ｃａｌ／cm
．ｓｅｃ．℃以上の熱伝導率を有する粉体もしく
は板状体を埋入したことを特徴とするサーマルヘ
ツド。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12617288U JPH0246632U (ja) | 1988-09-26 | 1988-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12617288U JPH0246632U (ja) | 1988-09-26 | 1988-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0246632U true JPH0246632U (ja) | 1990-03-30 |
Family
ID=31377443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12617288U Pending JPH0246632U (ja) | 1988-09-26 | 1988-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0246632U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5725974A (en) * | 1980-07-23 | 1982-02-10 | Hitachi Ltd | Thermal head |
-
1988
- 1988-09-26 JP JP12617288U patent/JPH0246632U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5725974A (en) * | 1980-07-23 | 1982-02-10 | Hitachi Ltd | Thermal head |