JPH0245997A - Flux cleaning device - Google Patents
Flux cleaning deviceInfo
- Publication number
- JPH0245997A JPH0245997A JP19673188A JP19673188A JPH0245997A JP H0245997 A JPH0245997 A JP H0245997A JP 19673188 A JP19673188 A JP 19673188A JP 19673188 A JP19673188 A JP 19673188A JP H0245997 A JPH0245997 A JP H0245997A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- section
- printed circuit
- printed board
- drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 45
- 230000004907 flux Effects 0.000 title claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 10
- 238000005476 soldering Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 5
- 239000007921 spray Substances 0.000 abstract 4
- 238000005406 washing Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 3
- 239000003595 mist Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 239000007900 aqueous suspension Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000013505 freshwater Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半田付は済のプリント基板の７ラツクスを洗浄
するフラックス洗浄装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a flux cleaning device for cleaning seven fluxes of soldered printed circuit boards.
従来、この種のフラックス洗浄装置は、フロン及びトリ
クロロエタンなどの化学薬品を洗浄液として用い、単浴
槽内でプリント基板に付着したフラックスを超音波又は
、プリント基板の７ラツクス付着面をローラブラシでこ
すり洗浄していた。Conventionally, this type of flux cleaning equipment uses chemicals such as chlorofluorocarbons and trichloroethane as the cleaning liquid, and uses ultrasonic waves to remove the flux attached to the printed circuit board in a single bath, or scrubs the surface of the printed circuit board to which 7lux is attached with a roller brush. Was.
気化性の強い洗浄液を使用するために空気中へ放出され
るのを防ぐ機構が必要であった。又、プリント基板へ一
部実装された部品が洗浄液により化学的な損傷受けるた
め、洗浄時損傷を受けやすい部品は、デイツプソルダリ
ングでなく手作業によるプリント基板への半田付が必要
であった。Since a highly volatile cleaning solution is used, a mechanism was needed to prevent it from being released into the air. In addition, some parts mounted on the printed circuit board were chemically damaged by the cleaning solution, so parts that were easily damaged during cleaning had to be manually soldered to the printed circuit board instead of dip soldering. .
（発明が解決しようとする課題〕
上述した従来のフラックス洗浄装置は、洗浄液の蒸発を
防ぐために、内部に蒸発している洗浄液を溶液に変換す
る装置が必要となるため、フラックス洗浄装置の製造コ
ストが高くなる欠点があり、特定の電気部品は洗浄液に
より化学的に損傷する場合があるため、それらは洗浄後
に手作業による半田付を必要とし、プリント基板の製造
コストが高くなるという欠点もある。(Problems to be Solved by the Invention) The conventional flux cleaning device described above requires a device that converts the evaporated cleaning fluid into a solution in order to prevent the cleaning fluid from evaporating, so the manufacturing cost of the flux cleaning device is low. They also have the disadvantages of high cost, certain electrical components may be chemically damaged by the cleaning fluid, they require manual soldering after cleaning, and the manufacturing cost of the printed circuit board is high.
本発明のフラックス洗浄装置は、
半田付は後のプリント基板を搬送するコンベアと、
コンベアにより搬送されているプリント基板を温めた水
で洗浄する洗浄部と、
洗浄部で洗浄されたプリント基板を乾燥させる乾燥部と
から成る。The flux cleaning device of the present invention includes a conveyor that conveys printed circuit boards after soldering, a cleaning section that cleans the printed circuit boards being conveyed by the conveyor with warm water, and a drying section that dries the cleaned printed circuit boards. It consists of a drying section.
水溶性フラックスで半田付されたプリント基板を洗浄部
で水で洗浄させ、乾燥部で乾燥させるので、プリント基
板に半田付けされた電気部品に化学的変化による損傷を
与えることなくプリント基板を安価に洗浄できる。Printed circuit boards soldered with water-soluble flux are washed with water in the cleaning section and dried in the drying section, making printed circuit boards cheaper without damaging the electrical components soldered to the printed circuit boards due to chemical changes. Can be washed.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明のフラックス洗浄装置の一実施例を示す
構造説明図である。FIG. 1 is a structural explanatory diagram showing one embodiment of the flux cleaning device of the present invention.
水溶性のフラックスを用いて半田付けした後のプリント
基板はキャリアにセットされて、コンベア１１に矢印Ａ
の向きに投入され矢印Ｂの向きに搬出される。洗浄部は
第１洗浄部２、第２洗浄部４、第３洗浄部５に分かれて
いる。第１洗浄部２は温めた水を霧状にして、ベルトコ
ンベア上のプリント基板に上下から吹きつけて洗浄を行
う。第１の洗浄部２においては温められた水は、連速し
て使用されている。After soldering using water-soluble flux, the printed circuit board is set in a carrier and moved to the arrow A on the conveyor 11.
It is put in in the direction of arrow B and taken out in the direction of arrow B. The cleaning section is divided into a first cleaning section 2, a second cleaning section 4, and a third cleaning section 5. The first cleaning section 2 cleans the printed circuit board on the belt conveyor by spraying the heated water in the form of a mist from above and below. In the first washing section 2, the heated water is used continuously.
第２洗浄部４は第３洗浄部５で用いられた熱水を６５℃
程度に再加熱し、霧状にしてプリント基板の上下から吹
きつけて洗浄を行う。第３洗浄部５は新しい水を６５℃
程度に加熱し、霧状にしてプリント基板の上下から吹き
つけて洗浄を行う。The second washing section 4 uses the hot water used in the third washing section 5 at 65°C.
Clean the printed circuit board by reheating it to a moderate temperature, making it into a mist, and spraying it from above and below the printed circuit board. The third washing section 5 uses fresh water at 65°C.
Clean the printed circuit board by heating it to a moderate level, turning it into a mist, and spraying it from above and below the printed circuit board.
ヒーティング部７は、熱線Ｅ、Ｆをプリント基板の上下
から照射し乾燥する。ドライ１７部８は、８５℃の温風
をプリント基板の上下から吹きつけ乾燥をする。緩衝部
３は、第１洗浄部と第２洗浄部とが互いに１１９１しな
いように送風を矢印Ｇのように行っている。緩衝部６は
、第３洗浄部５とヒーティング部７とが互いに影響しな
いように送風を矢印Ｈ，Ｉのように行っている。制御部
１２は、上述の各部の送風母、水吊、温度、ｍ送を制御
している。矢印Ｊ、におよび矢印り、Ｍに向けての送風
はエヤーカーテンとしてプリント基板洗浄装置１の内部
を外部から遮断している。The heating section 7 irradiates the printed circuit board with heat rays E and F from above and below to dry it. The dryer section 8 blows warm air at 85° C. from above and below the printed circuit board to dry it. The buffer section 3 blows air in the direction of arrow G so that the first cleaning section and the second cleaning section do not touch each other. The buffer section 6 blows air as shown by arrows H and I so that the third cleaning section 5 and the heating section 7 do not affect each other. The control unit 12 controls the air blower, water suspension, temperature, and m-feed of each of the above-mentioned parts. The air blown in the directions of arrows J and M acts as an air curtain to isolate the inside of the printed circuit board cleaning apparatus 1 from the outside.
以上説明したように本発明は、水溶性フラックスで半田
付されたプリント基板を洗浄部で水で洗浄させ、乾燥部
で乾燥させることにより、プリント基板に半田付けされ
た電気部品に化学的変化による損傷を与えることなくプ
リント基板を安価に洗浄できる効果がある。As explained above, the present invention allows electrical components soldered to the printed circuit board to undergo chemical changes by washing the printed circuit board soldered with water-soluble flux with water in the cleaning section and drying it in the drying section. This has the effect of allowing printed circuit boards to be cleaned at low cost without causing damage.
第１図は本発明の７ラツクス洗浄装置の一実施例を示す
構造説明図である。
１・・・プリント基板洗浄装置、
２・・・第１洗浄部、 ３・・・ｍ新郎、４・・・第
２洗浄部、 ５・・・第３洗浄部、６・・・緩衝部、
７・・・ヒーティング部、８・・・ドライヤ一
部、 ９・・・緩衝部、１０・・・ｍｗ部、 １
１・・・コンベア、１２・・・制御部。FIG. 1 is a structural explanatory diagram showing one embodiment of the 7-lux cleaning device of the present invention. DESCRIPTION OF SYMBOLS 1... Printed circuit board cleaning device, 2... First cleaning section, 3... M groom, 4... Second cleaning section, 5... Third cleaning section, 6... Buffer section,
7...Heating part, 8...Dryer part, 9...Buffer part, 10...mw part, 1
1... Conveyor, 12... Control section.
Claims (1)
で洗浄する洗浄部と、 洗浄部で洗浄されたプリント基板を乾燥させる乾燥部と
から成るフラックス洗浄装置。[Scope of Claims] A conveyor that conveys printed circuit boards after soldering, a cleaning section that cleans the printed circuit boards being conveyed by the conveyor with warm water, and a drying section that dries the printed circuit boards that have been cleaned in the cleaning section. A flux cleaning device consisting of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19673188A JPH0245997A (en) | 1988-08-05 | 1988-08-05 | Flux cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19673188A JPH0245997A (en) | 1988-08-05 | 1988-08-05 | Flux cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245997A true JPH0245997A (en) | 1990-02-15 |
Family
ID=16362653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19673188A Pending JPH0245997A (en) | 1988-08-05 | 1988-08-05 | Flux cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245997A (en) |
-
1988
- 1988-08-05 JP JP19673188A patent/JPH0245997A/en active Pending
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