JPH01130590A - Cleaning of circuit board mounted with component - Google Patents
Cleaning of circuit board mounted with componentInfo
- Publication number
- JPH01130590A JPH01130590A JP28854587A JP28854587A JPH01130590A JP H01130590 A JPH01130590 A JP H01130590A JP 28854587 A JP28854587 A JP 28854587A JP 28854587 A JP28854587 A JP 28854587A JP H01130590 A JPH01130590 A JP H01130590A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flux
- component
- water vapor
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims description 14
- 230000004907 flux Effects 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 6
- 238000007664 blowing Methods 0.000 claims abstract 6
- 238000005476 soldering Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 7
- 239000002699 waste material Substances 0.000 abstract description 5
- 238000005406 washing Methods 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 description 8
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 4
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は、回路基板に電子部品を半田付けにより実装し
た後の部品実装回路基板の洗浄方法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for cleaning a component-mounted circuit board after electronic components are mounted on the circuit board by soldering.
回路基板に電子部品を半田付けにより実装した後の部品
実装回路基板には、フラックスや半田ボール等が付着し
ているため、これを洗浄して除去する必要がある。従来
、部品実装回路基板の洗浄は、フロン溶剤あるいは塩化
炭化水素系溶剤を用いて、二槽式で行われている。この
方法は、部品実装回路基板を洗浄能に入れ、第一槽ない
し第三槽を通過させて洗浄を行うのであるが、第一槽で
は、フロン溶剤または塩化炭化水素系溶剤の液浴中で超
音波洗浄を行ってフラックスや汚れを溶解し、第二槽で
は同様の液浴ですすぎを行い、第三槽では蒸気で仕上げ
洗浄を行う、というものである。After electronic components are mounted on a circuit board by soldering, the component-mounted circuit board has flux, solder balls, and the like attached to it, so it is necessary to clean and remove this. Conventionally, component-mounted circuit boards have been cleaned using a two-bath system using a fluorocarbon solvent or a chlorinated hydrocarbon solvent. In this method, the component-mounted circuit board is placed in a cleaning chamber and passed through the first to third tanks for cleaning. Ultrasonic cleaning is performed to dissolve flux and dirt, followed by rinsing in a similar liquid bath in the second tank, and final cleaning with steam in the third tank.
しかし従来の方法は、フロン溶剤または塩化炭化水素系
溶剤を用いているため環境汚染および人体への害のおそ
れがある。特にフロンについてはオゾン層を破壊するお
それがあるとして現在社会問題にもなっている。また超
音波洗浄を行うと、■Ｃなどの部品が破壊されるおそれ
もある。さらに二槽式であるため洗浄装置が大型になり
、高価になるという欠点がある。However, since conventional methods use fluorocarbon solvents or chlorinated hydrocarbon solvents, there is a risk of environmental pollution and harm to the human body. In particular, fluorocarbons are currently becoming a social issue as they threaten to destroy the ozone layer. Furthermore, if ultrasonic cleaning is performed, parts such as ■C may be destroyed. Furthermore, since it is a two-tank type cleaning device, it has the disadvantage that it is large and expensive.
本発明の目的は、上記の、ような従来技術の問題点を解
決する部品実装回路基板の洗浄方法を提供することにあ
る。An object of the present invention is to provide a method for cleaning a component-mounted circuit board that solves the problems of the prior art as described above.
この目的を達成するため本発明は、回路基板に電子部品
を半田付けにより実装した後の部品実装回路基板を洗浄
するに際し、加熱加圧水蒸気を部品実装回路基板に吹き
付け、水蒸気の熱でフラックスを軟化させると共に、水
蒸気の吹き付け力でフラックスおよび半田ボール等を吹
き飛ばして除去することを特徴とするものである。In order to achieve this object, the present invention sprays heated and pressurized steam onto the component-mounted circuit board when cleaning the component-mounted circuit board after electronic components are mounted on the circuit board by soldering, and the heat of the steam softens the flux. At the same time, flux, solder balls, etc. are blown off and removed by the spraying force of water vapor.
このようにすれば、フロン溶剤や塩化炭化水素系溶剤を
使用しないで済み、また洗浄装置も簡素化することがで
きる。In this way, there is no need to use fluorocarbon solvents or chlorinated hydrocarbon solvents, and the cleaning equipment can also be simplified.
以下、本発明の実施例を図面を参照して詳細に説明する
。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は本発明の一実施例を示す。この方法は、洗浄す
べき部品実装回路基板１を搬送ベルト２に載せて矢印六
方向に送り、走行する部品実装回路基板１にノズル３か
ら加熱加圧水蒸気４を吹き付けて洗浄を行うものである
。加熱加圧水蒸気４を吹き付けると、部品実装回路基板
１に付着しているフラックスは水蒸気の熱で軟化し、さ
らに軟化したフラックスや半田ボール等は水蒸気の吹き
付け力で吹き飛ばされて除去されることになる。洗浄さ
れた部品実装回路基板１は、その後、ヒーター５に通し
て加熱乾燥する。また洗浄により発生する凝縮廃液は廃
液受け６で回収する。FIG. 1 shows an embodiment of the invention. In this method, a component-mounted circuit board 1 to be cleaned is placed on a conveyor belt 2 and conveyed in six directions of arrows, and heated and pressurized steam 4 is sprayed from a nozzle 3 onto the traveling component-mounted circuit board 1 for cleaning. When the heated and pressurized steam 4 is sprayed, the flux adhering to the component mounting circuit board 1 is softened by the heat of the steam, and the softened flux, solder balls, etc. are blown off and removed by the spraying force of the steam. . The cleaned component-mounted circuit board 1 is then passed through a heater 5 to be heated and dried. Further, condensed waste liquid generated by washing is collected in a waste liquid receiver 6.
水蒸気の吹き付けは、図示のように搬送ベルトの走行方
向と逆方向に行うことが好ましく、また１段だけでなく
複数段に行ってもよい。もちろん部品実装回路基板を静
止させておいて、パンチ処理て行うこともできる。The spraying of water vapor is preferably performed in the opposite direction to the running direction of the conveyor belt as shown in the figure, and may be performed not only in one stage but also in multiple stages. Of course, punching can also be performed while the component-mounted circuit board is kept stationary.
以上説明したように本発明によれば、加熱加圧水蒸気で
部品実装回路基板を洗浄するようにしたので、フロン溶
剤や塩化炭化水素系溶剤を使用しなくて済み、環境汚染
や人体への害をなくすことができる。また超音波を使用
しないので電子部品の破損のおそれがない。さらに洗浄
方法が簡単であるから装置を小型化でき、コストダウン
を図ることができる。As explained above, according to the present invention, the component-mounted circuit board is cleaned with heated and pressurized steam, which eliminates the need to use fluorocarbon solvents or chlorinated hydrocarbon solvents, thereby reducing environmental pollution and harm to the human body. It can be eliminated. Furthermore, since ultrasonic waves are not used, there is no risk of damage to electronic components. Furthermore, since the cleaning method is simple, the device can be downsized and costs can be reduced.
第１図は本発明の一実施例に係る部品実装回路基板洗浄
方法の説明図である。
１〜部品実装回路基板、２〜搬送ベルト、３〜ノズル、
４〜水蒸気、５〜ヒーター、６〜廃液受け。
第１図FIG. 1 is an explanatory diagram of a method for cleaning a component-mounted circuit board according to an embodiment of the present invention. 1 - component mounting circuit board, 2 - conveyor belt, 3 - nozzle,
4 - steam, 5 - heater, 6 - waste liquid receiver. Figure 1
Claims (1)
品実装回路基板の洗浄方法であって、加熱加圧水蒸気を
部品実装回路基板に吹き付け、水蒸気の熱でフラックス
を軟化させると共に、水蒸気の吹き付け力でフラックス
および半田ボール等を吹き飛ばして除去することを特徴
とする部品実装回路基板の洗浄方法。A method of cleaning a component-mounted circuit board after electronic components are mounted on the circuit board by soldering, in which heated and pressurized steam is sprayed onto the component-mounted circuit board, the heat of the steam softens the flux, and the spraying force of the steam softens the flux. A method for cleaning a component-mounted circuit board, characterized by blowing away flux, solder balls, etc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28854587A JPH01130590A (en) | 1987-11-17 | 1987-11-17 | Cleaning of circuit board mounted with component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28854587A JPH01130590A (en) | 1987-11-17 | 1987-11-17 | Cleaning of circuit board mounted with component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01130590A true JPH01130590A (en) | 1989-05-23 |
Family
ID=17731628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28854587A Pending JPH01130590A (en) | 1987-11-17 | 1987-11-17 | Cleaning of circuit board mounted with component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01130590A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH059463U (en) * | 1991-07-24 | 1993-02-09 | 積水化学工業株式会社 | Bath cleaning equipment |
| JPH0539465U (en) * | 1991-11-06 | 1993-05-28 | 積水化学工業株式会社 | Bath cleaning equipment |
| JPH06256984A (en) * | 1993-12-21 | 1994-09-13 | Mitsubishi Kasei Corp | Washing device for object stained with oil |
| JPH06326444A (en) * | 1993-05-17 | 1994-11-25 | Nec Corp | Removing method of residual opaque flux |
| JPH0770780A (en) * | 1992-07-29 | 1995-03-14 | Mitsubishi Chem Corp | Washing device for oil deposits |
| JP2002143786A (en) * | 2000-11-15 | 2002-05-21 | Tlv Co Ltd | Steam cleaning apparatus |
| JP2002143787A (en) * | 2000-11-15 | 2002-05-21 | Tlv Co Ltd | Steam cleaning apparatus |
| US7342749B2 (en) | 2004-07-16 | 2008-03-11 | Hitachi Global Storage Technologies Netherlands B.V. | Method of removing lead-free solder from slider pad and magnetic disk drive |
| US7486480B2 (en) | 2005-02-25 | 2009-02-03 | Hitachi Global Storage Technolgies Netherlands B.V. | Head gimbal assembly method with solder fillet formed by laser irradiating a shaped solder mass |
| JP2009164431A (en) * | 2008-01-08 | 2009-07-23 | Fujitsu Microelectronics Ltd | Manufacturing method of semiconductor device, cleaning method of semiconductor device, and cleaning device |
-
1987
- 1987-11-17 JP JP28854587A patent/JPH01130590A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH059463U (en) * | 1991-07-24 | 1993-02-09 | 積水化学工業株式会社 | Bath cleaning equipment |
| JPH0539465U (en) * | 1991-11-06 | 1993-05-28 | 積水化学工業株式会社 | Bath cleaning equipment |
| JPH0770780A (en) * | 1992-07-29 | 1995-03-14 | Mitsubishi Chem Corp | Washing device for oil deposits |
| JPH06326444A (en) * | 1993-05-17 | 1994-11-25 | Nec Corp | Removing method of residual opaque flux |
| JPH06256984A (en) * | 1993-12-21 | 1994-09-13 | Mitsubishi Kasei Corp | Washing device for object stained with oil |
| JP2002143786A (en) * | 2000-11-15 | 2002-05-21 | Tlv Co Ltd | Steam cleaning apparatus |
| JP2002143787A (en) * | 2000-11-15 | 2002-05-21 | Tlv Co Ltd | Steam cleaning apparatus |
| US7342749B2 (en) | 2004-07-16 | 2008-03-11 | Hitachi Global Storage Technologies Netherlands B.V. | Method of removing lead-free solder from slider pad and magnetic disk drive |
| US7486480B2 (en) | 2005-02-25 | 2009-02-03 | Hitachi Global Storage Technolgies Netherlands B.V. | Head gimbal assembly method with solder fillet formed by laser irradiating a shaped solder mass |
| JP2009164431A (en) * | 2008-01-08 | 2009-07-23 | Fujitsu Microelectronics Ltd | Manufacturing method of semiconductor device, cleaning method of semiconductor device, and cleaning device |
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