JPH0244902A - Antenna system - Google Patents
Antenna systemInfo
- Publication number
- JPH0244902A JPH0244902A JP19590988A JP19590988A JPH0244902A JP H0244902 A JPH0244902 A JP H0244902A JP 19590988 A JP19590988 A JP 19590988A JP 19590988 A JP19590988 A JP 19590988A JP H0244902 A JPH0244902 A JP H0244902A
- Authority
- JP
- Japan
- Prior art keywords
- antenna
- antenna element
- microwave
- amplifier circuit
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はアンテナ装置に係り、特にいわゆる平面アンテ
ナの如き多素子アンテナに関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an antenna device, and particularly to a multi-element antenna such as a so-called planar antenna.
（従来の技術）
例えは衛星放送の受信アンテナには、パラボラアンテナ
の他に平面アンテナと称される多素子アンテナが用いら
れる。この種の多素子アンテナは、例えば第８図に示す
如く複数のアンテナ素子８１、同８１を平面上に配置し
たもので、各アンテナ素子８１の受信出力を合成器８２
にて合成し、その合成出力を増幅回路８３にて増幅する
構成となっている。(Prior Art) For example, as a receiving antenna for satellite broadcasting, a multi-element antenna called a planar antenna is used in addition to a parabolic antenna. This type of multi-element antenna is one in which a plurality of antenna elements 81 are arranged on a plane as shown in FIG.
, and the combined output is amplified by an amplifier circuit 83 .
（発明が解決しようとする課題）
ところて、上述した如き多素子アンテナては、アンテナ
素子と増幅回路間の結合線路における伝搬損失と合成器
における合成損失とは当該アンテナ系の雑音指数を劣化
させる要因である。ところか、上述したように、従来の
多素子アンテナでは、各アンテナ素子と増幅回路間に合
成器が介在するので、結合線路長は増大傾向にあり、伝
搬損失が大きく、これを低減させることは困難である。(Problem to be Solved by the Invention) However, in the multi-element antenna as described above, the propagation loss in the coupling line between the antenna element and the amplifier circuit and the combined loss in the combiner degrade the noise figure of the antenna system. It is a factor. However, as mentioned above, in conventional multi-element antennas, a combiner is interposed between each antenna element and the amplifier circuit, so the coupled line length tends to increase, resulting in large propagation loss, and it is difficult to reduce this. Have difficulty.
故に、従来の多素子アンテナの構成では良好な雑音指数
を有するアンテナ系を実現することが困難であるという
問題点がある。Therefore, with the conventional multi-element antenna configuration, there is a problem in that it is difficult to realize an antenna system with a good noise figure.
本発明は、このような従来の問題点に鑑みなされたもの
で、その目的は、伝搬損失の低減を図り得る新規構成の
多素子アンテナたるアンテナ装置を提供することにある
。The present invention has been made in view of these conventional problems, and an object thereof is to provide an antenna device that is a multi-element antenna with a novel configuration that can reduce propagation loss.
（課題を解決するための手段）
前記目的を達成するために、本発明のアンテナ装置は次
の如き構成を有する。(Means for Solving the Problems) In order to achieve the above object, the antenna device of the present invention has the following configuration.
即ち、本発明のアンテナ装置は、少なくとも１つのアン
テナ素子とこのアンテナ素子の出力を増幅する斌たはこ
のアンテナ素子を励振する増＠回路とを集積化してなる
マイクロ波ＩＣを複数個配列したことを特徴とするもの
である。That is, the antenna device of the present invention has a plurality of microwave ICs arranged in which are integrated at least one antenna element and a booster circuit that amplifies the output of the antenna element or excites the antenna element. It is characterized by:
（作 用）
次に、前記の如く構成される本発明のアンテナ装置の作
用を説明する。(Function) Next, the function of the antenna device of the present invention configured as described above will be explained.
受信アンテナとして用いる場合には、マイクロ波ＩＣは
、少なくとも１つのアンテナ素子とこのアンテナ素子の
出力を増幅する増幅回路とを集積化したもので、このマ
イクロ波ＩＣの複数個の出力（即ち各増幅回路の出力）
が合成されることになる。When used as a receiving antenna, a microwave IC integrates at least one antenna element and an amplifier circuit that amplifies the output of this antenna element, and a plurality of outputs of this microwave IC (i.e., each amplifier circuit output)
will be synthesized.
ここに、アンテナ素子と増幅回路は近接配置されるのて
、両者間の結合線路長は従来よりも大幅に短縮化てき、
伝搬損失を大幅に低減し得ることとなる。Since the antenna element and the amplifier circuit are placed close to each other, the length of the coupling line between them has become much shorter than before.
This makes it possible to significantly reduce propagation loss.
（実 施 例） 以下、本発明の実施例を図面を参照して説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明の第１実施例に係るアンテナ装置（多素
子アンテナ）を示す。このアンテナ装置は、アンテナ素
子２と増幅凹Ｆｌ＠３とを集積化してなる複数個のマイ
クロ波ＴＣＩ ２と合成器８とからなっている。空間を
伝搬してくる受信電波１はそれぞれのマイクロ波ＩＣＩ
。２内のアンテナ素子２て電気信号に変換され、増＠回
路３により増幅される。増幅回路３の出力、つまりマイ
クロ波■Ｃ１，２それぞれの出力は合成器８により合成
され、出力端子１１に導かれ、出力される。FIG. 1 shows an antenna device (multi-element antenna) according to a first embodiment of the present invention. This antenna device consists of a plurality of microwave TCIs 2 and a combiner 8, which are formed by integrating an antenna element 2 and an amplification concave Fl@3. Received radio waves 1 propagating in space are each microwave ICI
. The antenna element 2 in the antenna element 2 converts the signal into an electrical signal, which is amplified by an amplifier circuit 3. The outputs of the amplifier circuit 3, that is, the outputs of microwaves C1 and C2, are combined by a combiner 8, guided to an output terminal 11, and output.
マイクロ波ＩＣは、例えば第２図に示すように、複数の
端子２３を有する密閉容器２４内にアンテナ素子２１が
形成された基板２９とモノリシックマイクロ波ＩＣチッ
プからなる増幅回路２２を配置し、アンテナ素子２１と
増幅回路２２問および増幅回路２２と端子２３間をボン
デインクワイヤ２７、同２８にて接続したものである。For example, as shown in FIG. 2, a microwave IC includes a substrate 29 on which an antenna element 21 is formed and an amplifier circuit 22 made of a monolithic microwave IC chip, which are placed inside a sealed container 24 having a plurality of terminals 23. The element 21 and the amplifier circuit 22 and the amplifier circuit 22 and the terminal 23 are connected by bonding wires 27 and 28.
なお、密閉容器２４のアンテナ素子２１の直上位置には
輻射開口部２５が設けられる。この輻射開口部２５は例
えはカラス、セラミックスまたはプラスチック等、電波
に対して透過性があり、かつ気密性を保持し得る物で構
成される。また、２６はメタライズ等によって形成した
金属膜（または金属薄板）であり、この金属膜２６は密
閉容器２４の内周面であって輻射開口部２５と端子２３
を避けた部位に紫外線保護と電磁シールドの目的で配設
される。Note that a radiation opening 25 is provided in the airtight container 24 at a position directly above the antenna element 21 . The radiation opening 25 is made of a material that is transparent to radio waves and can maintain airtightness, such as glass, ceramics, or plastic. Further, 26 is a metal film (or thin metal plate) formed by metallization or the like, and this metal film 26 is formed on the inner peripheral surface of the closed container 24 and covers the radiation opening 25 and the terminal 23.
It is installed for the purpose of ultraviolet ray protection and electromagnetic shielding in areas where it is avoided.
また、基板２つは、例えはアルミナセラミックス等の絶
縁性基板からなり、アンテナ素子２１はこの基板２つの
上面に厚膜技術または薄膜技術によって形成される。こ
のアンテナ素子２１は、例えば第３図（ａ）〜同（ｄ）
に示すように各種の形態を採ることかできる。扱う電波
が円偏波か直線偏波か等によって最適な形態を選定する
ことになる。なお、基板２９としてシリコンやカリウム
ひ素等の半導体基板を採用し、アンテナ素子２１と増幅
回路２２を同一基板に形成すれば、ホンディングワイヤ
２７を省略できる。Further, the two substrates are made of insulating substrates such as alumina ceramics, and the antenna element 21 is formed on the upper surfaces of these two substrates by thick film technology or thin film technology. This antenna element 21 is, for example, shown in FIGS. 3(a) to 3(d).
It can take various forms as shown in the figure below. The optimal form will be selected depending on whether the radio waves to be handled are circularly polarized or linearly polarized. Incidentally, if a semiconductor substrate such as silicon or potassium arsenide is used as the substrate 29 and the antenna element 21 and the amplifier circuit 22 are formed on the same substrate, the bonding wire 27 can be omitted.
このマイクロ波ＩＣ１２は、通常の半導体素子（半導体
メモリや電荷結合型（ＣＣＤ）撮像素子等）の製法と類
似の製法で組み立てることができるので、生産性が高く
自動組立によって安価でかつ大量に供給できる。また、
第２図（ａ）に示すように、増幅回路２２はアンテナ素
子２１の極く近傍に配置されるから、結合線路（ポンデ
ィングワイヤ２７）は極めて短いものとなり、伝搬損失
は大幅に減少する。加えて、前述したように、ボンデイ
ンクワイヤ２７を省略する構成とすれば、組立作業の一
層の容易化か図れるたけでなく、接続箇所の存在に依る
特性劣化を削除てきるのて、更に特性の良いマイクロ波
ＩＣを実現できることになる。This microwave IC 12 can be assembled using a manufacturing method similar to that of ordinary semiconductor devices (semiconductor memories, charge-coupled (CCD) image pickup devices, etc.), so it is highly productive and can be supplied in large quantities at low cost through automatic assembly. can. Also,
As shown in FIG. 2(a), since the amplifier circuit 22 is placed very close to the antenna element 21, the coupling line (bonding wire 27) is extremely short, and propagation loss is significantly reduced. In addition, as mentioned above, if the bonding wire 27 is omitted, the assembly work will not only be made easier, but also the deterioration of characteristics due to the presence of the connection point will be eliminated, and the characteristics will be further improved. This means that a microwave IC with good quality can be realized.
次に、第４図は本発明の第２実施例を示す。Next, FIG. 4 shows a second embodiment of the present invention.
この第２実施例に係るマイクロ波ＩＣｌ３は、混合回路
４および局部発振信号形成回路５を前述したアンテナ素
子１および増幅回路３と共に集積化したものからなり、
増幅回路３の出力（高周波信号）を混合回ｉ￥８４にて
中間周波帯の信号へ変換してから合成器８に出力するよ
うにしたものである。The microwave ICl 3 according to the second embodiment is composed of a mixing circuit 4 and a local oscillation signal forming circuit 5 integrated together with the above-described antenna element 1 and amplifier circuit 3.
The output (high frequency signal) of the amplifier circuit 3 is converted into an intermediate frequency band signal by a mixing circuit i\84 and then output to the synthesizer 8.
このような構成とする場合、各マイクロ波ＩＣの出力間
の同期をとる必要がある。そこで、局部発振信号基準信
号発生回路１７を設（）、その出力（基準信号）を分配
器１０を介して各マイクロ波ＩＣ１Ｂの局部発振信号形
成回路５へ供給し、各局部発振信号形成回路５は入力さ
れた基準信号に従って相互に同期かとれた所定周波数の
局部発振信号を発生し、それを対応する混合回路４へ出
力するようにしである。In such a configuration, it is necessary to synchronize the outputs of each microwave IC. Therefore, a local oscillation signal reference signal generation circuit 17 is provided (), and its output (reference signal) is supplied to the local oscillation signal formation circuit 5 of each microwave IC 1B via the distributor 10. generates local oscillation signals of a predetermined frequency that are synchronized with each other in accordance with the input reference signal and outputs them to the corresponding mixing circuit 4.
なお、局部発振信号基準信号発生回路１７にて発生され
る信号は、それぞれのマイクロ波ＩＣＩＢ内の局部発振
信号形成回路５の出力信号の同期を取るのが目的である
ので、局部発振信号基準信号発生回路１７にて発生され
る信号は必ずしも局部発振信号の周波数に一致している
必要はなく、例えは局部発振信号の周波数の１／２．１
／３２倍、３倍等でも良い。又、局部発振信号形成回路
５は局部発振信号基準信号発生回路１７の出力周波数と
局部発振周波数との関係に応し、逓倍回路、分周回路を
含み、増幅回路もしくは弛張発振回路等により構成され
る。Note that the purpose of the signal generated by the local oscillation signal reference signal generation circuit 17 is to synchronize the output signal of the local oscillation signal forming circuit 5 in each microwave ICIB, so the signal is generated by the local oscillation signal reference signal. The signal generated by the generation circuit 17 does not necessarily have to match the frequency of the local oscillation signal; for example, it may be 1/2.1 of the frequency of the local oscillation signal.
/32 times, 3 times, etc. may be used. Further, the local oscillation signal forming circuit 5 includes a multiplier circuit, a frequency dividing circuit, and is constituted by an amplifier circuit or a relaxation oscillation circuit, depending on the relationship between the output frequency of the local oscillation signal reference signal generation circuit 17 and the local oscillation frequency. Ru.
また、分配器１０は削除可能であって、その場合の構成
例を第５図乃至第７図に示す。Furthermore, the distributor 10 can be removed, and configuration examples in that case are shown in FIGS. 5 to 7.
第５図に示す第３実施例では、第１および第２実施例に
おける合成器８に代えて合成／分配器９を設け、かつマ
イクロ波ＩＣ１４内の結線を変更して混合回路４の出力
信号線（中間周波信号線）６が局部発振信号形成回路５
の前記基準信号入力端に繋がるようにし、局部発振信号
基準信号発生回路１７の出力（基準信号）が合成／分配
器９および中間周波信号線６を介して局部発振信号形成
回路５へ供給される。In the third embodiment shown in FIG. 5, a combiner/distributor 9 is provided in place of the combiner 8 in the first and second embodiments, and the wiring within the microwave IC 14 is changed to provide the output signal of the mixing circuit 4. The line (intermediate frequency signal line) 6 is the local oscillation signal forming circuit 5
The output (reference signal) of the local oscillation signal reference signal generation circuit 17 is supplied to the local oscillation signal forming circuit 5 via the combiner/distributor 9 and the intermediate frequency signal line 6. .
第６図に示す第４実施例では、第２実施例の構成から分
配器１０を削除するとともに、局部発振信号基準信号発
生回路１７に基準信号送信アンテナ１８を設け、かつマ
イクロ波ＩＣｌ３内にも局部発振信号形成回路５に接続
される基準信号受信アンテナ７を設り、基準信号の供給
を空間伝搬路を介して行うようにしである。In the fourth embodiment shown in FIG. 6, the distributor 10 is removed from the configuration of the second embodiment, a reference signal transmission antenna 18 is provided in the local oscillation signal reference signal generation circuit 17, and a reference signal transmitting antenna 18 is also provided in the microwave ICl 3. A reference signal receiving antenna 7 connected to the local oscillation signal forming circuit 5 is provided, and the reference signal is supplied via a spatial propagation path.
第７図に示す第５実施例では、基準信号受信アンテナ１
９をマイクロ波Ｉ Ｃ］、 ６の外部に設げた点が異な
るのみで、他は前記第４実施例と同様である。In the fifth embodiment shown in FIG.
The only difference is that 9 is provided outside the microwave IC] and 6, and the rest is the same as the fourth embodiment.
以上のように、第２実施例以降の各実施例では、マイク
ロ波ＩＣ内で中間周波数へ変換するので、高周波帯での
損失が低減され、より一層の伝搬損失低減効果か期待さ
れる。As described above, in each of the embodiments after the second embodiment, since the conversion to the intermediate frequency is performed within the microwave IC, the loss in the high frequency band is reduced, and a further effect of reducing propagation loss is expected.
なお、以上説明した各実施例は受信用のアンテナ装置の
構成を示したが、合成器を電力分配器とし、マイクロ波
ＩＣをアンテナ素子とこれを励振する電力増幅器を含む
ものとし、さらに移相器等を適宜設けるごとによって送
信用のアンテナ装置（多素子アンテナ）を構成できるこ
とは明らかである。要するに、アンテナ素子と増幅回路
を含むマイクロ波ＩＣの複数個を配列することによって
、受信用のアンテナ装置も送信用のアンテナ装置も構成
できるのである。Each of the embodiments described above shows the configuration of a reception antenna device, but the combiner is a power divider, the microwave IC includes an antenna element and a power amplifier that excites it, and a phase shifter is also used. It is clear that a transmitting antenna device (multi-element antenna) can be constructed by appropriately providing the following elements. In short, by arranging a plurality of microwave ICs including antenna elements and amplifier circuits, both a receiving antenna device and a transmitting antenna device can be configured.
（発明の効果）
以上説明したように、本発明のアンテナ装置によれは、
少なくともアンテナ素子と増幅回路を含むマイクロ波Ｉ
Ｃを形成し、それを複数個配列しｆＳ構成としなので、
アンテナ素子と増幅回路は近接配置されることとなり、
両者間の結合線路長は従来よりも大幅に短縮化でき、伝
搬損失を大幅に低減し得ることとなる。つまり、本発明
によれば、アンテナ系の雑音指数の劣化を大幅に抑制で
きる効果がある。(Effects of the Invention) As explained above, the antenna device of the present invention has the following advantages:
Microwave I including at least an antenna element and an amplifier circuit
Form C, arrange multiple pieces of it, and make fS configuration,
The antenna element and amplifier circuit will be placed close together,
The length of the coupling line between the two can be significantly shortened compared to the conventional method, and propagation loss can be significantly reduced. In other words, according to the present invention, it is possible to significantly suppress deterioration of the noise figure of the antenna system.
第１図は本発明の第１実施例に係るアンテナ装置の構成
ブロック図、第２図はマイクロ波ＩＣの構成例を示す断
面図（同（ａ））および斜視図く同（ｂ））、第３図は
アンテナ素子の構成例を示す図、第４図は本発明の第２
実施例に係るアンテナ装置の構成ブロック図、第５図は
本発明の第３実施例に係るアンテナ装置の構成ブロック
図、第６図は本発明の第４実施例に係るアンテナ装置の
構成フロック図、第７図は本発明の第５実施例に係るア
ンテナ装置の構成ブロック図、第８図は従来のアンテナ
装置（多素子アンテナ）の構成ブロック図である。
１・・・・・・受信電波、 ２・・・・・・アンテナ素
子、３・・・・・増幅回路、 ４ ・ 混合回路、 ５
・・・・局部発振信号形成回路、 ６・・・・中間周波
信号線、７・・・・・・基準信号受信アンテナ、 ８・
・・・・合成器、９・・・・・合成／分配器、 １０
・・・・・分配器、 １１・・・・・・出力端子、
１２．１３，１４，１５．１６・・・・・・マイクロ
波ＩＣ１１７・・・・局部発振信号基準信号発生回路、
１８・・基準信号送信アンテナ、 １つ・・・・・基
準信号受信アンテナ、 ２１・・・・アンテナ素子、
２２・・・・・・増幅回路、 ２３・・端子、 ２４・
・・・・密閉容器、 ２５ ・・輻射開口部、 ２６・
・・・・金属膜、 ２７．２８・・・・・・ホンディン
グワイヤ、 ２９・・・・基板。
代理人 弁理士 八 幡 義 博
へｂ
〜〜FIG. 1 is a configuration block diagram of an antenna device according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view ((a)) and a perspective view ((b)) showing a configuration example of a microwave IC. FIG. 3 is a diagram showing an example of the configuration of an antenna element, and FIG. 4 is a diagram showing an example of the configuration of an antenna element.
FIG. 5 is a block diagram of the configuration of the antenna device according to the third embodiment of the present invention. FIG. 6 is a block diagram of the configuration of the antenna device according to the fourth embodiment of the present invention. , FIG. 7 is a configuration block diagram of an antenna device according to a fifth embodiment of the present invention, and FIG. 8 is a configuration block diagram of a conventional antenna device (multi-element antenna). 1...Received radio wave, 2...Antenna element, 3...Amplification circuit, 4. Mixing circuit, 5
...Local oscillation signal forming circuit, 6..Intermediate frequency signal line, 7..Reference signal receiving antenna, 8.
...Synthesizer, 9...Synthesizer/distributor, 10
...Distributor, 11...Output terminal,
12.13, 14, 15.16...Microwave IC117...Local oscillation signal reference signal generation circuit,
18...Reference signal transmitting antenna, one...Reference signal receiving antenna, 21...Antenna element,
22...Amplification circuit, 23...Terminal, 24...
... airtight container, 25 ... radiation opening, 26.
...metal film, 27.28...honding wire, 29...substrate. To agent Yoshihiro Yahata, patent attorney b 〜〜
Claims (1)
力を増幅するまたはこのアンテナ素子を励振する増幅回
路とを集積化してなるマイクロ波ＩＣを複数個配列した
ことを特徴とするアンテナ装置。An antenna device characterized in that a plurality of microwave ICs are arranged in which at least one antenna element and an amplifier circuit that amplifies the output of the antenna element or excites the antenna element are integrated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19590988A JPH0244902A (en) | 1988-08-05 | 1988-08-05 | Antenna system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19590988A JPH0244902A (en) | 1988-08-05 | 1988-08-05 | Antenna system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0244902A true JPH0244902A (en) | 1990-02-14 |
Family
ID=16349003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19590988A Pending JPH0244902A (en) | 1988-08-05 | 1988-08-05 | Antenna system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0244902A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5400039A (en) * | 1991-12-27 | 1995-03-21 | Hitachi, Ltd. | Integrated multilayered microwave circuit |
| US6263193B1 (en) | 1997-03-28 | 2001-07-17 | Kabushiki Kaisha Toshiba | Microwave transmitter/receiver module |
| WO2003084093A1 (en) * | 2002-03-29 | 2003-10-09 | Communications Research Laboratory, Independent Administrative Institution | Radio communicate method and system |
-
1988
- 1988-08-05 JP JP19590988A patent/JPH0244902A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5400039A (en) * | 1991-12-27 | 1995-03-21 | Hitachi, Ltd. | Integrated multilayered microwave circuit |
| US6263193B1 (en) | 1997-03-28 | 2001-07-17 | Kabushiki Kaisha Toshiba | Microwave transmitter/receiver module |
| WO2003084093A1 (en) * | 2002-03-29 | 2003-10-09 | Communications Research Laboratory, Independent Administrative Institution | Radio communicate method and system |
| US7292831B2 (en) | 2002-03-29 | 2007-11-06 | National Institute Of Information And Communications Technology | Radio communicate method and system |
| CN100367687C (en) * | 2002-03-29 | 2008-02-06 | 独立行政法人情报通信研究机构 | Wireless communication method and system |
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