JPH0242433U - - Google Patents
Info
- Publication number
- JPH0242433U JPH0242433U JP1988121251U JP12125188U JPH0242433U JP H0242433 U JPH0242433 U JP H0242433U JP 1988121251 U JP1988121251 U JP 1988121251U JP 12125188 U JP12125188 U JP 12125188U JP H0242433 U JPH0242433 U JP H0242433U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- solder bump
- solder
- bump
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000010953 base metal Substances 0.000 claims 1
- 238000005536 corrosion prevention Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Wire Bonding (AREA)
Description
第１図ａ〜ｆは本考案のハンダバンプの製造工
程を示す説明図、第２図、第３図および第４図は
それぞれ従来のハンダバンプの構造を示す説明図
である。 １……ハンダバンプ、２……Ｎｉ又はＣｕメツ
キ層、３……Ａｕ／Ｃｕ層、４……Ｃｒ層、５…
…Ａｌパツド、６……パツシベーシヨン膜、７…
…第１次レジスト、８……第２次レジスト、９…
…ハンダメツキ部。
程を示す説明図、第２図、第３図および第４図は
それぞれ従来のハンダバンプの構造を示す説明図
である。 １……ハンダバンプ、２……Ｎｉ又はＣｕメツ
キ層、３……Ａｕ／Ｃｕ層、４……Ｃｒ層、５…
…Ａｌパツド、６……パツシベーシヨン膜、７…
…第１次レジスト、８……第２次レジスト、９…
…ハンダメツキ部。
Claims (1)
- 【実用新案登録請求の範囲】 (1) バンプの下地金属として蒸着Ａｕ／Ｃｕ／
Ｃｒを有し、ハンダ溶食防止層としてＮｉまたは
Ｃｕメツキ層を有することを特徴とするハンダバ
ンプ。 (2) ハンダバンプの形成が、Ａｕ／Ｃｕのエツ
チングによる除去とＣｒ層のリフトオフ法による
除去により行われたことを特徴とする実用新案登
録請求の第１項記載のハンダバンプ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121251U JPH0242433U (ja) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988121251U JPH0242433U (ja) | 1988-09-16 | 1988-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242433U true JPH0242433U (ja) | 1990-03-23 |
Family
ID=31368089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988121251U Pending JPH0242433U (ja) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242433U (ja) |
-
1988
- 1988-09-16 JP JP1988121251U patent/JPH0242433U/ja active Pending