JPH0242429U - - Google Patents
Info
- Publication number
- JPH0242429U JPH0242429U JP1988122287U JP12228788U JPH0242429U JP H0242429 U JPH0242429 U JP H0242429U JP 1988122287 U JP1988122287 U JP 1988122287U JP 12228788 U JP12228788 U JP 12228788U JP H0242429 U JPH0242429 U JP H0242429U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- application
- die bonding
- chip
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0113—
-
- H10W72/0711—
-
- H10W72/073—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122287U JPH0242429U (enExample) | 1988-09-19 | 1988-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988122287U JPH0242429U (enExample) | 1988-09-19 | 1988-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242429U true JPH0242429U (enExample) | 1990-03-23 |
Family
ID=31370078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988122287U Pending JPH0242429U (enExample) | 1988-09-19 | 1988-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242429U (enExample) |
-
1988
- 1988-09-19 JP JP1988122287U patent/JPH0242429U/ja active Pending
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