JPH0241489U - - Google Patents

Info

Publication number
JPH0241489U
JPH0241489U JP12031488U JP12031488U JPH0241489U JP H0241489 U JPH0241489 U JP H0241489U JP 12031488 U JP12031488 U JP 12031488U JP 12031488 U JP12031488 U JP 12031488U JP H0241489 U JPH0241489 U JP H0241489U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
component
mounting surface
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12031488U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12031488U priority Critical patent/JPH0241489U/ja
Publication of JPH0241489U publication Critical patent/JPH0241489U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案に係るプリント基板搭載用ラジ
エータの一実施例の斜視図、第2図は本考案に係
るプリント基板搭載用ラジエータの他の実施例を
示す斜視図である。 1,5:部品実装面、2:部品、3:空隙、4
:ビス、6:溝、7:放熱フイン、10,20:
プリント基板搭載用ラジエータ、11,21:底
面。
FIG. 1 is a perspective view of one embodiment of a radiator for mounting a printed circuit board according to the present invention, and FIG. 2 is a perspective view showing another embodiment of the radiator for mounting a printed circuit board according to the present invention. 1, 5: Component mounting surface, 2: Component, 3: Gap, 4
: Screw, 6: Groove, 7: Heat dissipation fin, 10, 20:
Radiator for mounting printed circuit board, 11, 21: Bottom.

Claims (1)

【実用新案登録請求の範囲】 底面をプリント基板上に取付け、他のいずれか
の面を部品実装面とし、該部品実装面に放熱対象
となる部品を取付け、該部品が発生する熱を放熱
させるプリント基板搭載用ラジエータにおいて、 上記部品実装面を上記プリント基板に対して斜
めに設けたことを特徴とするプリント基板搭載用
ラジエータ。
[Claims for Utility Model Registration] The bottom surface is mounted on a printed circuit board, any other surface is used as a component mounting surface, a component to be heat radiated is mounted on the component mounting surface, and the heat generated by the component is radiated. A radiator for mounting on a printed circuit board, characterized in that the component mounting surface is provided diagonally with respect to the printed circuit board.
JP12031488U 1988-09-13 1988-09-13 Pending JPH0241489U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12031488U JPH0241489U (en) 1988-09-13 1988-09-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12031488U JPH0241489U (en) 1988-09-13 1988-09-13

Publications (1)

Publication Number Publication Date
JPH0241489U true JPH0241489U (en) 1990-03-22

Family

ID=31366311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12031488U Pending JPH0241489U (en) 1988-09-13 1988-09-13

Country Status (1)

Country Link
JP (1) JPH0241489U (en)

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