JPH0241431U - - Google Patents

Info

Publication number
JPH0241431U
JPH0241431U JP1988119030U JP11903088U JPH0241431U JP H0241431 U JPH0241431 U JP H0241431U JP 1988119030 U JP1988119030 U JP 1988119030U JP 11903088 U JP11903088 U JP 11903088U JP H0241431 U JPH0241431 U JP H0241431U
Authority
JP
Japan
Prior art keywords
loop
power supply
metallized
substrate
square
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988119030U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0625007Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988119030U priority Critical patent/JPH0625007Y2/ja
Publication of JPH0241431U publication Critical patent/JPH0241431U/ja
Application granted granted Critical
Publication of JPH0625007Y2 publication Critical patent/JPH0625007Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A40/00—Adaptation technologies in agriculture, forestry, livestock or agroalimentary production
    • Y02A40/10—Adaptation technologies in agriculture, forestry, livestock or agroalimentary production in agriculture
    • Y02A40/25—Greenhouse technology, e.g. cooling systems therefor

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988119030U 1988-09-09 1988-09-09 多電源素子用パツケージ Expired - Lifetime JPH0625007Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988119030U JPH0625007Y2 (ja) 1988-09-09 1988-09-09 多電源素子用パツケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988119030U JPH0625007Y2 (ja) 1988-09-09 1988-09-09 多電源素子用パツケージ

Publications (2)

Publication Number Publication Date
JPH0241431U true JPH0241431U (2) 1990-03-22
JPH0625007Y2 JPH0625007Y2 (ja) 1994-06-29

Family

ID=31363905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988119030U Expired - Lifetime JPH0625007Y2 (ja) 1988-09-09 1988-09-09 多電源素子用パツケージ

Country Status (1)

Country Link
JP (1) JPH0625007Y2 (2)

Also Published As

Publication number Publication date
JPH0625007Y2 (ja) 1994-06-29

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