JPH0239955A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH0239955A JPH0239955A JP19137288A JP19137288A JPH0239955A JP H0239955 A JPH0239955 A JP H0239955A JP 19137288 A JP19137288 A JP 19137288A JP 19137288 A JP19137288 A JP 19137288A JP H0239955 A JPH0239955 A JP H0239955A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- common electrode
- individual electrodes
- lead electrode
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000011521 glass Substances 0.000 abstract description 9
- 239000000919 ceramic Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(IV) oxide Inorganic materials O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、ファクシミリやプリンター等の記録装置に
使用するサーマルヘッドに係るもので、特に絶縁基板上
に直線状に発熱抵抗体を配列し、この上面に感熱記録紙
を接触させ、発熱抵抗体の選択的加熱により記録するサ
ーマルヘッドの発熱基板に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a thermal head used in recording devices such as facsimiles and printers, and particularly relates to a thermal head in which heating resistors are linearly arranged on an insulating substrate, This invention relates to a heat-generating substrate of a thermal head, which records by selectively heating a heat-generating resistor by bringing a heat-sensitive recording paper into contact with the upper surface of the heat-sensitive recording paper.
第4図、第5図は例えば特開昭54−110848号公
報にある従来のサーマルヘッドの発熱基板−を示す図で
、第4図は断面図、第5図は部分平面図を示す。4 and 5 are diagrams showing a heat generating substrate of a conventional thermal head disclosed in, for example, Japanese Patent Application Laid-Open No. 54-110848, with FIG. 4 showing a sectional view and FIG. 5 showing a partial plan view.
図において、(1]はセラミックなどの絶縁基板、(2
1はグレーズ層、(3)はリード電極でくし歯状をなす
共通電極(3a)と、直線状の個別電極(3b)とを交
互に複数個対向配置することにより構成されている。(
4)は発熱抵抗体、(5)は保護膜ガラスである。In the figure, (1) is an insulating substrate such as ceramic, (2
1 is a glaze layer, and (3) is a lead electrode, which is constructed by alternately arranging a plurality of comb-like common electrodes (3a) and linear individual electrodes (3b) facing each other. (
4) is a heating resistor, and (5) is a protective film glass.
次にこの発熱基板−の製作法および動作を説明する。第
4図、第5図において、絶縁基板(1)の上に、ガラス
材料等で構成されたグレーズ層(2)を印刷し、このブ
レースm(21の上に、Au (金)等の導体ペースト
を印刷、焼成しリード電極(3)を形成する。Next, the manufacturing method and operation of this heat generating board will be explained. 4 and 5, a glaze layer (2) made of a glass material or the like is printed on an insulating substrate (1), and a conductor such as Au (gold) is printed on this brace m (21). The paste is printed and fired to form lead electrodes (3).
次にRu02(酸化ルテニウム)等を主成分とする抵抗
ペーストを印刷、焼成し、発熱抵抗体(4)を形成する
。次にhp20.、 Sin、等を主成分とするガラス
ペーストを発熱抵抗体(41を覆うように印刷、焼成し
、保護膜ガラス(5)を形成する。Next, a resistance paste mainly composed of Ru02 (ruthenium oxide) or the like is printed and fired to form a heating resistor (4). Next hp20. , Sin, etc. is printed and fired to cover the heating resistor (41) to form a protective film glass (5).
以上のようにして製作されたサーマルヘッドの感熱基板
−は、共通電極(3a)に電圧を印加し、個別電極(3
b)を選択的に0N−OFFすることにより、発熱抵抗
体(4)は例えば第5図の斜線部に示す発熱素子(4a
)が発熱する。この発熱素子(4a)の発熱は上部の保
護膜ガラス(5]に伝熱し部分加熱される。The heat-sensitive substrate of the thermal head manufactured as described above is prepared by applying a voltage to the common electrode (3a) and applying a voltage to the individual electrodes (3a).
b) is selectively turned ON and OFF, the heat generating resistor (4) is turned on, for example, by turning off the heat generating element (4a) shown in the shaded area in FIG.
) generates heat. The heat generated by the heating element (4a) is transferred to the upper protective film glass (5) and is partially heated.
この熱により図示しないプラテンローラと保護膜ガラス
(5)との間の感熱紙(図示せず)が発色し、ドツトを
形成する。Due to this heat, the thermal paper (not shown) between the platen roller (not shown) and the protective film glass (5) develops color, forming dots.
第6図は、上記により感熱紙に印字させた時のドツト(
6)を例示したものであり、第1ラインの印字が完了後
感熱紙が1ラインステツプして第2ラインの印字が行わ
れる。Figure 6 shows the dots (
This is an example of 6), in which after the printing of the first line is completed, the thermal paper steps one line and printing of the second line is performed.
従来のサーマルヘッドは以上のように構成されているの
で、次のような問題があった。Since the conventional thermal head is configured as described above, it has the following problems.
すなわち、くし歯状の共通電極(3a)と直線状の個別
電極(3b)とを交互に複数個対向配置され構成されて
いるが、これらの電極(3m)(3b)に電圧を印加し
たとき、リード電極間間隙、すなわち相対向する電極(
3a)(3b)面の直交距離が一定でないため第7図に
示すように電気力線■の分布が均等でなく、そのため第
5図に示す発熱抵抗体(4)の発熱素子(41)内にお
いて温度むらが発生する。これはドツトの副走査方向に
対して著しい。従って、感熱紙の印字ドツトが不鮮明と
なるという問題点があった。In other words, it is composed of a plurality of interdigitated common electrodes (3a) and linear individual electrodes (3b) that are alternately arranged facing each other, but when a voltage is applied to these electrodes (3m) (3b), , the gap between the lead electrodes, that is, the electrodes facing each other (
Since the perpendicular distance between the planes 3a and 3b is not constant, the distribution of electric lines of force ■ is not uniform as shown in Fig. Temperature unevenness occurs. This is remarkable in the sub-scanning direction of the dots. Therefore, there is a problem that the printed dots on the thermal paper become unclear.
この発明は、上記のような問題点を解消するためになさ
れたもので、リード電極を形成する共通電極と個別電極
の間隙を一定値に配置して電気力線分布を均等化し発熱
抵抗体の発熱を均一化して印字ドツトを鮮明とするもの
である。This invention was made in order to solve the above-mentioned problems, and the gap between the common electrode and the individual electrodes forming the lead electrodes is arranged at a constant value to equalize the distribution of electric lines of force. It equalizes heat generation and makes printed dots clearer.
この発明に係るサーマルヘッドは、絶縁基板と、この絶
縁基板上に形成された発熱抵抗体と、上記発熱抵抗体に
電圧を印加する共通電極と個別電極よりなるリード電極
を備えて、上記リード電極の対向スる間隙が一定値に配
置されたものである。The thermal head according to the present invention includes an insulating substrate, a heating resistor formed on the insulating substrate, and a lead electrode made of a common electrode and individual electrodes for applying a voltage to the heating resistor, and the lead electrode The gap between the opposing sides is set to a constant value.
この発明におけるサーマルヘッドは、共通電極と個別電
極とで構成されるリード電極の対向間隙が一定値に配置
されたので、電極間の電気力線分布が均等化され、発熱
抵抗体の発熱が均一化して印字ドツトが鮮明となる。In the thermal head of this invention, the facing gap between the lead electrodes, which are composed of a common electrode and individual electrodes, is arranged at a constant value, so that the distribution of electric lines of force between the electrodes is equalized, and the heat generated by the heating resistor is uniform. The printed dots become clearer.
以下、この発明の一実施例を第1図、第2図、第3図に
ついて説明する。第1図は発熱基板−の一部を示す平面
図、第2図はリード電極(2)の詳細図である。An embodiment of the present invention will be described below with reference to FIGS. 1, 2, and 3. FIG. 1 is a plan view showing a part of the heat generating substrate, and FIG. 2 is a detailed view of the lead electrode (2).
第1図において、(1)はセラミック等よりなる絶縁基
板、(2)はガラス材料で構成されたグレーズ層、01
)はリード電極でくし歯状の共通電極(31a)と複数
の個別電極(31b)とによって構成していて、第2図
に示されたリード電sonの間隙(g)を一定値とする
よう馬蹄形状に構成配置されている。(ロ)は発熱抵抗
体、(5)はk1203. SiO□等を主成分とする
保護膜ガラスである。In FIG. 1, (1) is an insulating substrate made of ceramic or the like, (2) is a glaze layer made of glass material, 01
) is a lead electrode composed of a comb-like common electrode (31a) and a plurality of individual electrodes (31b), and the gap (g) between the lead electrodes shown in FIG. 2 is kept at a constant value. It is arranged in a horseshoe shape. (b) is a heating resistor, (5) is k1203. It is a protective film glass whose main component is SiO□.
以上の第1図、第2図に示すように、この発明の絶縁基
板(1)、グレーズ層(2)、発熱抵抗体(2)、保護
膜ガラス(6)の基本構成は従来例と同じであるが、リ
ードswanの形状、配置が従来例と異る。As shown in FIGS. 1 and 2 above, the basic configurations of the insulating substrate (1), glaze layer (2), heating resistor (2), and protective film glass (6) of the present invention are the same as those of the conventional example. However, the shape and arrangement of the lead swan are different from the conventional example.
すなわち、従来例第5図に示した如<<シ歯状共通電極
(3&)に直線状個別電極(3b)を組み合せてなるリ
ードfit % (31とは異り、この発明の一実施例
は第2図に示すように、共通電極(31a)の個別電極
(31b)との間隙(g)すなわち相対向する電極(3
1a)(31b)面の直交する距離を一定値となるよう
形状を定めて配置したので、これらの電極(31m)(
31b)間に電圧を印加したとき、第3図に示すように
電気力線の分布が均等となり、仁のリード電極6旧こ接
する発熱抵抗体(6)を均等に発熱させている。That is, unlike the conventional example shown in FIG. As shown in FIG. 2, the gap (g) between the common electrode (31a) and the individual electrode (31b), that is, the opposing electrode (3
These electrodes (31m) (1a) (31m) (
31b), the distribution of the lines of electric force becomes uniform as shown in FIG. 3, and the heating resistor (6) in contact with the lead electrode 6 is heated evenly.
なお、上記実施例ではリード電8iiC3υの形状を馬
蹄形のものを示したが、必ずしも馬蹄形であることは必
要でなくリード電極間隙(g)を一定とする形状であれ
ばよい。In the above embodiment, the shape of the lead electrode 8iiC3υ is shown as a horseshoe shape, but it is not necessarily necessary to be a horseshoe shape, and any shape that allows the lead electrode gap (g) to be constant may be used.
以上のように、この発明によれば、抵抗体と、上記発熱
抵抗体に電圧を印加するリード電極とを備え、上記リー
ド電極の対向する間隙、すなわち相対向するリード電極
面の直交する距離が一定値に配置されているので、リー
ド電極に電圧を印加したとき電気力線の分布が均等とな
り、リード電極に接する発熱抵抗体の発熱が均一となる
。As described above, the present invention includes a resistor and a lead electrode for applying a voltage to the heating resistor, and the gap between the opposing lead electrodes, that is, the perpendicular distance between the opposing lead electrode surfaces is Since they are arranged at a constant value, when a voltage is applied to the lead electrode, the distribution of electric lines of force becomes uniform, and the heat generation of the heating resistor in contact with the lead electrode becomes uniform.
第1図〜第3図はこの発明の一実施例によるサーマルヘ
ッド装置の図で、第1図は発熱基板の一部を示す平面図
、第2図はリード電極図、第3図は電気力線分布を示す
説明図、第4図は従来のサーマルヘッド発熱基板断面図
、第5図は発熱抵抗体の発熱状態を示す例示図、第6図
は印字ドツトの説明図、第7図は従来のものの電気力線
分布を示す説明図である。
(1)は絶縁基板、C11lはリード電極、(31a)
は共通電極、(31b)は個別電極、曲は発熱抵抗体、
句は発熱基板、(g)は間隙である。
なお、図中同一符号は同−又は相当部分を示す。1 to 3 are diagrams of a thermal head device according to an embodiment of the present invention, in which FIG. 1 is a plan view showing a part of a heat generating board, FIG. 2 is a diagram of lead electrodes, and FIG. 3 is a diagram showing electric power. An explanatory diagram showing the line distribution, Fig. 4 is a cross-sectional view of a conventional thermal head heating board, Fig. 5 is an exemplary diagram showing the heating state of the heating resistor, Fig. 6 is an explanatory diagram of printed dots, and Fig. 7 is a conventional diagram. FIG. 2 is an explanatory diagram showing the electric force line distribution of (1) is an insulating substrate, C11l is a lead electrode, (31a)
is a common electrode, (31b) is an individual electrode, and the curve is a heating resistor.
The phrase is the heat generating substrate, and (g) is the gap. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
、上記発熱抵抗体に電圧を印加する共通電極と個別電極
とを備え、上記共通電極と個別電極の対向する間隙が一
定値に配置されたことを特徴とするサーマルヘッド。An insulating substrate, a heating resistor formed on the insulating substrate, a common electrode and individual electrodes for applying a voltage to the heating resistor, and the opposing gaps between the common electrode and the individual electrodes are arranged at a constant value. A thermal head characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63191372A JPH0751362B2 (en) | 1988-07-29 | 1988-07-29 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63191372A JPH0751362B2 (en) | 1988-07-29 | 1988-07-29 | Thermal head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0239955A true JPH0239955A (en) | 1990-02-08 |
JPH0751362B2 JPH0751362B2 (en) | 1995-06-05 |
Family
ID=16273492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63191372A Expired - Fee Related JPH0751362B2 (en) | 1988-07-29 | 1988-07-29 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0751362B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0433552U (en) * | 1990-07-14 | 1992-03-18 | ||
JPH05123555A (en) * | 1991-11-05 | 1993-05-21 | Idec Izumi Corp | Method for generating fine air bubbles and apparatus therefor |
US6886921B2 (en) | 2003-04-02 | 2005-05-03 | Lexmark International, Inc. | Thin film heater resistor for an ink jet printer |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61211058A (en) * | 1985-03-15 | 1986-09-19 | Rohm Co Ltd | Thermal printing head |
JPH01232069A (en) * | 1988-03-11 | 1989-09-18 | Matsushita Electric Ind Co Ltd | Thermal head |
-
1988
- 1988-07-29 JP JP63191372A patent/JPH0751362B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61211058A (en) * | 1985-03-15 | 1986-09-19 | Rohm Co Ltd | Thermal printing head |
JPH01232069A (en) * | 1988-03-11 | 1989-09-18 | Matsushita Electric Ind Co Ltd | Thermal head |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0433552U (en) * | 1990-07-14 | 1992-03-18 | ||
JPH05123555A (en) * | 1991-11-05 | 1993-05-21 | Idec Izumi Corp | Method for generating fine air bubbles and apparatus therefor |
US6886921B2 (en) | 2003-04-02 | 2005-05-03 | Lexmark International, Inc. | Thin film heater resistor for an ink jet printer |
Also Published As
Publication number | Publication date |
---|---|
JPH0751362B2 (en) | 1995-06-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |