JPH0238742U - - Google Patents
Info
- Publication number
- JPH0238742U JPH0238742U JP11811588U JP11811588U JPH0238742U JP H0238742 U JPH0238742 U JP H0238742U JP 11811588 U JP11811588 U JP 11811588U JP 11811588 U JP11811588 U JP 11811588U JP H0238742 U JPH0238742 U JP H0238742U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- recess
- board
- connection pads
- glass epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11811588U JPH0238742U (sr) | 1988-09-07 | 1988-09-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11811588U JPH0238742U (sr) | 1988-09-07 | 1988-09-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0238742U true JPH0238742U (sr) | 1990-03-15 |
Family
ID=31362187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11811588U Pending JPH0238742U (sr) | 1988-09-07 | 1988-09-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0238742U (sr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0459621U (sr) * | 1990-09-29 | 1992-05-21 | ||
JPH05275561A (ja) * | 1992-03-25 | 1993-10-22 | Nec Corp | リードレスチップキャリア基板 |
-
1988
- 1988-09-07 JP JP11811588U patent/JPH0238742U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0459621U (sr) * | 1990-09-29 | 1992-05-21 | ||
JPH05275561A (ja) * | 1992-03-25 | 1993-10-22 | Nec Corp | リードレスチップキャリア基板 |