JPH0238465U - - Google Patents
Info
- Publication number
- JPH0238465U JPH0238465U JP11635288U JP11635288U JPH0238465U JP H0238465 U JPH0238465 U JP H0238465U JP 11635288 U JP11635288 U JP 11635288U JP 11635288 U JP11635288 U JP 11635288U JP H0238465 U JPH0238465 U JP H0238465U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- base body
- attracted
- annular base
- holding mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000000696 magnetic material Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 2
Description
第１図〜第５図は第１考案を示し、第１図は第
１実施例を示す断面図、第２図は基体の正面図、
第３図は第２実施例を示す断面図、第４図は基体
の正面図、第５図は第３実施例の断面図であり、
第６図は磁束関係を示す図、第７図〜第９図は第
２考案を示し、第７図はスパツタリング装置の概
略図、第８図は基板保持機構の第１実施例を示す
断面図、第９図は本考案に係る磁石対の磁束を示
す図で、第１０図は他の実施例を示す断面図であ
る。
３，３ａ，３ｂ，２６……基体、７，７ａ，７
ｂ，３２……被吸着体、５……永久磁石対、２２
……回転パレツト、２３……開口部、２４……基
板。
1 to 5 show the first invention, FIG. 1 is a sectional view showing the first embodiment, FIG. 2 is a front view of the base,
FIG. 3 is a sectional view showing the second embodiment, FIG. 4 is a front view of the base, and FIG. 5 is a sectional view of the third embodiment.
Fig. 6 is a diagram showing the magnetic flux relationship, Figs. 7 to 9 show the second invention, Fig. 7 is a schematic diagram of the sputtering device, and Fig. 8 is a sectional view showing the first embodiment of the substrate holding mechanism. 9 is a diagram showing the magnetic flux of the magnet pair according to the present invention, and FIG. 10 is a sectional view showing another embodiment. 3, 3a, 3b, 26...Base, 7, 7a, 7
b, 32...Adsorbed object, 5...Permanent magnet pair, 22
... Rotating pallet, 23 ... Opening, 24 ... Substrate.
Claims (1)
永久磁石式吸着固定機構において、前記被吸着体
を磁性材とするとともに、前記基体に所定間隔を
もつて並設され、磁極が互いに逆となつた永久磁
石対を少なくとも一対設けたことを特徴とする永
久磁石式吸着固定機構。 (2) 垂直状態の回転パレツトに設けた円形開口
部に基板を保持して、この基板を自転・公転させ
ながら処理するスパツタリング装置の基板保持機
構において、前記基板保持機構を、前記円形開口
部に回転自在な遊嵌状態に設けた環状基体と、該
環状基体に吸着固定され、前記基板を保持する磁
性材からなる環状の被吸着体とで構成するととも
に、前記環状基体に、所定間隔をもつて並設され
、互いに磁極が逆となつた永久磁石対を少なくと
も一対設けたことを特徴をするスパツタリング装
置の基板保持機構。[Claims for Utility Model Registration] (1) In a permanent magnet attracting and fixing mechanism that attracts and fixes an object to be attracted to a base by magnetic force, the object to be attracted is made of a magnetic material, and the objects are arranged on the base at a predetermined interval. 1. A permanent magnet attracting and fixing mechanism, characterized in that at least one pair of permanent magnets having opposite magnetic poles are provided. (2) In a substrate holding mechanism of a sputtering apparatus that holds a substrate in a circular opening provided in a rotating pallet in a vertical state and processes the substrate while rotating and revolving, the substrate holding mechanism is placed in the circular opening. An annular base body provided in a freely rotatable and loosely fitted state, and an annular attracted body made of a magnetic material that is fixed to the annular base body by attraction and holds the substrate, and has a predetermined spacing between the annular base body and the annular base body. 1. A substrate holding mechanism for a sputtering apparatus, characterized in that at least one pair of permanent magnets are arranged in parallel and have opposite magnetic poles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988116352U JPH0453Y2 (en) | 1988-09-02 | 1988-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988116352U JPH0453Y2 (en) | 1988-09-02 | 1988-09-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0238465U true JPH0238465U (en) | 1990-03-14 |
| JPH0453Y2 JPH0453Y2 (en) | 1992-01-06 |
Family
ID=31358811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988116352U Expired JPH0453Y2 (en) | 1988-09-02 | 1988-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0453Y2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52110538U (en) * | 1976-02-16 | 1977-08-23 | ||
| JPS5349667A (en) * | 1976-10-16 | 1978-05-06 | Spodig Heinrich | Adhesive plate with permanent magnet |
| JPS58126978A (en) * | 1982-01-22 | 1983-07-28 | Hitachi Ltd | Base plate holding device |
-
1988
- 1988-09-02 JP JP1988116352U patent/JPH0453Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52110538U (en) * | 1976-02-16 | 1977-08-23 | ||
| JPS5349667A (en) * | 1976-10-16 | 1978-05-06 | Spodig Heinrich | Adhesive plate with permanent magnet |
| JPS58126978A (en) * | 1982-01-22 | 1983-07-28 | Hitachi Ltd | Base plate holding device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0453Y2 (en) | 1992-01-06 |
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