JPH023835U

JPH023835U -

Info

Publication number: JPH023835U
Application number: JP9608988U
Authority: JP
Priority date: 1987-11-14
Filing date: 1988-07-19
Publication date: 1990-01-11

Description

[Brief explanation of drawings]

第１図は一実施例を示す断面図、第２図は同実
施例の平面図であり、第１図は第２図のＡ−Ａ線
位置での断面図である。第３図から第５図はそれ
ぞれ保温層のガラスグレーズの断面形状を示す図
、第６図から第９図はそれぞれ基板と保温層の端
面形状を示す断面図、第１０図Ａは発熱抵抗体の
他の形状の一例を示す平面図、同図ＢはそのＢ−
Ｂ線位置での断面図、第１１図及び第１２図はそ
れぞれ発熱抵抗体のさらに他の形状を示す平面図
、第１３図及び第１４図は好ましい実施例を示す
断面図、第１５図は一実施例に駆動用ＩＣを搭載
した状態を示す斜視図である。第１６図は他の実
施例を示す断面図、第１７図はさらに他の実施例
を示す断面図、第１８図Ａはさらに他実施例を示
す平面図、同図ＢはそのＣ−Ｃ線位置での断面図
である。第１９図から第２３図は製造プロセスを
示す図であり、第１９図Ａは複数のサーマルヘツ
ドの発熱部を形成した大判基板を示す平面図、同
図ＢはそのＤ−Ｄ線位置での断面図、第２０図は
基板をカツテイングした状態を示す断面図、第２
１図は端面を研磨した状態を示す断面図、第２２
図はベースプレートに固定して組み立てた状態を
示す断面図、第２３図はさらに上部ベースプレー
トを取りつけた完成図を示す斜視断面図である。
第２４図は割れが発生したサーマルヘツドを示す
部分平面図、第２５図は割れ目などに樹脂を含浸
して硬化させた実施例を示す断面図である。第２
６図は従来の端面型サーマルヘツドを示す断面図
である。６……基板、７，７ａ，７ｂ，７ｃ……ガラス
グレーズ、８，８ａ，８ｂ，８ｃ，８′，１５…
…発熱抵抗体、９，１０……電極、７′，１１…
…上部保温層、４２，４４，４６……割れ目など
に含浸され硬化された樹脂。 FIG. 1 is a sectional view showing one embodiment, FIG. 2 is a plan view of the same embodiment, and FIG. 1 is a sectional view taken along line A--A in FIG. 2. Figures 3 to 5 are views showing the cross-sectional shape of the glass glaze of the heat insulating layer, Figures 6 to 9 are cross-sectional views showing the end faces of the substrate and the heat insulating layer, respectively, and Figure 10A is the heating resistor. A plan view showing an example of another shape, B-
11 and 12 are respectively plan views showing still other shapes of the heating resistor, FIGS. 13 and 14 are sectional views showing preferred embodiments, and FIG. 15 is a sectional view taken at line B. FIG. 2 is a perspective view showing a state in which a driving IC is mounted in one embodiment. FIG. 16 is a sectional view showing another embodiment, FIG. 17 is a sectional view showing another embodiment, FIG. 18A is a plan view showing still another embodiment, and FIG. It is a sectional view at the position. 19 to 23 are diagrams showing the manufacturing process. FIG. 19A is a plan view showing a large substrate on which the heat generating parts of a plurality of thermal heads are formed, and FIG. 20 is a sectional view showing the state in which the substrate is cut;
Figure 1 is a sectional view showing the polished end face, Figure 22
The figure is a cross-sectional view showing the assembled state fixed to the base plate, and FIG. 23 is a perspective cross-sectional view showing the completed view with the upper base plate further attached.
FIG. 24 is a partial plan view showing a thermal head in which a crack has occurred, and FIG. 25 is a sectional view showing an example in which the crack etc. are impregnated with resin and cured. Second
FIG. 6 is a sectional view showing a conventional end face type thermal head. 6... Substrate, 7, 7a, 7b, 7c... Glass glaze, 8, 8a, 8b, 8c, 8', 15...
...Heating resistor, 9, 10... Electrode, 7', 11...
...Top heat insulation layer, 42, 44, 46...Resin impregnated into cracks and hardened.

Claims

[Claims for Utility Model Registration] (1) A heating element is formed at one end of one main surface of the substrate, a heat insulating layer is formed at least under the heating element, and the recording object is located at the end of the substrate. An edge-type thermal head that prints by sliding along the side edge. (2) The end face type thermal head according to claim 1, wherein cracks and chipped portions of the end face on which the recording medium slides are impregnated with resin and cured.