JPH0238058A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH0238058A JPH0238058A JP19043688A JP19043688A JPH0238058A JP H0238058 A JPH0238058 A JP H0238058A JP 19043688 A JP19043688 A JP 19043688A JP 19043688 A JP19043688 A JP 19043688A JP H0238058 A JPH0238058 A JP H0238058A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- elasticity
- curing
- thermal head
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 35
- 230000001070 adhesive effect Effects 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 239000007787 solid Substances 0.000 claims abstract 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000013043 chemical agent Substances 0.000 claims 1
- 229920006332 epoxy adhesive Polymers 0.000 abstract description 2
- 229920002379 silicone rubber Polymers 0.000 abstract description 2
- 239000004945 silicone rubber Substances 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract 4
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はサーマルヘッドに関し、特に発熱部分を有する
基板と放熱板とを接着してなるサーマルヘッドに関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermal head, and more particularly to a thermal head formed by bonding a substrate having a heat generating portion and a heat sink.
従来、この種の基板と放熱板とを接着してなるサーマル
ヘッドは放熱板と基板とを接着する際硬化後弾力性のな
い接着剤を接着面全面に塗布し接着するか、硬化後も弾
力性を有する接着剤を同じく接着面全面に塗布して接着
していた。Conventionally, when bonding a heat sink and a heat sink, this type of thermal head is made by applying an adhesive that does not have elasticity after curing to the entire surface of the bonding surface. Similarly, adhesive having the same properties was applied to the entire surface to be bonded.
弾力性のない接着剤を用いた場合は、放熱板と基板との
熱膨張率の違いから、接着剤硬化後及び印字中にソリを
生じ印字の際の濃度ムラの原因となる。すなわち高温硬
化型の接着剤を用いた場合は、硬化後常温に復した際凸
形状のソリを生じ、常温硬化型の接着剤を用いた場合は
、常温時には平坦であるが印字中熱をもった状態にて凹
形状のソリを生じる。If an adhesive with no elasticity is used, warping may occur after the adhesive hardens and during printing due to the difference in thermal expansion coefficient between the heat sink and the substrate, causing density unevenness during printing. In other words, when a high-temperature curing adhesive is used, a convex warp occurs when the temperature returns to room temperature after curing, and when a room-temperature curing adhesive is used, the surface is flat at room temperature, but heat builds up during printing. A concave warpage occurs in this state.
また弾力性を有する接着剤を用いた場合は、接着力が弱
く接着剤の剥離、われ等が生じたり、印字中に印字紙の
走行方向に基板すなわち発熱抵抗体の位置がズレ、濃度
ムラ、全体的な発色濃度の低下の原因となる。In addition, when using an adhesive with elasticity, the adhesive force is weak and peeling or cracking of the adhesive may occur, and the position of the substrate, that is, the heating resistor, may shift in the running direction of the printing paper during printing, uneven density, etc. This causes a decrease in the overall color density.
上述した従来のサーマルヘッドに対し、本発明は弾力性
のない接着剤及び弾力性を有する接着剤の２種の接着剤
をサーマルヘッド長手方向に併用するという相違点を有
する。The present invention differs from the conventional thermal head described above in that two types of adhesives, a non-elastic adhesive and an elastic adhesive, are used together in the longitudinal direction of the thermal head.
本発明のサーマルヘッドは放熱板と基板を接着する際、
弾力性のない接着剤と弾力性を有する接着剤をサーマル
ヘッド長手方向に併用している。When the thermal head of the present invention adheres the heat sink and the substrate,
A non-elastic adhesive and an elastic adhesive are used together in the longitudinal direction of the thermal head.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of one embodiment of the present invention.
第２図はその斜視図である。放熱板１と基板２は弾力性
のない接着剤３及び弾力性を有する接着剤４により接着
されている。本実施例では、Ａ４基板、放熱板の厚さ７
ｍｍにて硬化後弾力性を有しないエポキシ系接着剤（硬
度１００ロツクウエル程度）を放熱板長手方向の中央に
５０ｍｍの巾に塗布し、他の部分に弾力性を有するシリ
コンゴム系接着剤（硬度３０ＪＩＳＡ程度）を塗布し、
１８０℃１５分程度キュアーにて硬化している。この場
合常温時での基板のソリは凸に５０〜１００μｍ程度で
あり、濃度ムラの発生はない。FIG. 2 is a perspective view thereof. The heat dissipation plate 1 and the substrate 2 are bonded together using an adhesive 3 that has no elasticity and an adhesive 4 that has elasticity. In this example, the thickness of the A4 board and heat sink is 7.
After curing at 50 mm, apply a non-elastic epoxy adhesive (hardness of about 100 rockwells) to a width of 50 mm in the longitudinal center of the heat sink, and apply elastic silicone rubber adhesive (hardness of about 100 mm) to the other parts. Approx. 30 JISA) is applied,
It is cured at 180°C for about 15 minutes. In this case, the warp of the substrate at room temperature is about 50 to 100 μm in convexity, and no density unevenness occurs.
第４図は従来の一実施例の縦断面図である。放熱板ｌと
基板２は全面弾力性のない接着剤にて接着されている。FIG. 4 is a longitudinal sectional view of a conventional embodiment. The heat dissipation plate 1 and the substrate 2 are bonded together with an adhesive having no elasticity over the entire surface.
この際、接着剤として高温硬化型のものを使用し、例え
ば１８０℃程度にてキュアーすると常温に復した際ソリ
は凸に３００μｍ以上となり印字の際濃度ムラとなる。At this time, if a high-temperature curing type adhesive is used as the adhesive and cured at, for example, about 180° C., when the temperature returns to room temperature, the warpage will be 300 μm or more in convexity, resulting in density unevenness during printing.
対策としてキュアー温度を下げたり、あらかじめ凹形状
に貼りつける等あげられるが、温度を下げると接着剤の
未硬化や、ソリの大きさの再現性が得られない等問題が
ある。Countermeasures include lowering the curing temperature and pasting it in a concave shape in advance, but lowering the temperature causes problems such as the adhesive not curing and the reproducibility of the warp size not being achieved.
第３図は本発明の他の実施例の縦断面図である。FIG. 3 is a longitudinal sectional view of another embodiment of the invention.
本実施例では、長手方向中央に弾力性を有する接着剤を
巾３０ｍｍにて配置しその両脇に弾力性のない接着剤を
巾３０ｍｍにて配置しそれ以外の領域に弾力性を有する
接着剤を配置している。本実施例にても、そりは１００
μｍ以下に抑えることができる。また基板の放熱板に対
する印字中の位置ズレは、長手方向端部にて実施例１↑
こ比べ支点との距離が短い為減少できるという利点があ
る。In this example, an elastic adhesive with a width of 30 mm is placed in the center in the longitudinal direction, a non-elastic adhesive is placed on both sides with a width of 30 mm, and an elastic adhesive is placed in the other areas. are placed. Also in this example, the warpage is 100
It can be suppressed to less than μm. Also, the positional deviation during printing with respect to the heat sink of the board was confirmed at the longitudinal end in Example 1↑
Compared to this, the distance to the fulcrum is shorter, so it has the advantage of being able to be reduced.
以上説明したように本発明は放熱板と基板を接着する際
、弾力性のない接着剤と弾力性を有する接着剤とを併用
することにより、ソリや抵抗位置ズレに起因する濃度ム
ラ及び全体的な発色濃度の低下を防止できる効果がある
。As explained above, the present invention uses a non-elastic adhesive and an elastic adhesive together when bonding a heat dissipation plate and a substrate, thereby eliminating density unevenness caused by warping and resistor misalignment, and reducing the overall This has the effect of preventing a decrease in color density.
第１図は本発明の一実施例のサーマルヘッドの縦断面図
、第２図は本発明の一実施例のサーマルヘッドで放熱板
に基板を接着した斜視図、第３図は本発明の他の実施例
のサーマルヘッドの縦断面図、第４図は従来のサーマル
ヘッドの縦断面図である。
１・・・・・・放熱板、２・・・・・・基板、３・・・
・・・弾力性を有する接着剤、４・・・・・・弾力性の
ない接着剤、５・・・・・・発熱抵抗体。
代理人 弁理士 内 原 晋FIG. 1 is a longitudinal sectional view of a thermal head according to an embodiment of the present invention, FIG. 2 is a perspective view of a thermal head according to an embodiment of the present invention with a substrate bonded to a heat sink, and FIG. 3 is a diagram showing a thermal head according to an embodiment of the present invention. FIG. 4 is a longitudinal sectional view of a conventional thermal head. 1... Heat sink, 2... Board, 3...
. . . Adhesive with elasticity, 4 . . . Adhesive without elasticity, 5 . . . Heat generating resistor. Agent Patent Attorney Susumu Uchihara
Claims (1)
てなるサーマルヘッドにおいて、硬化後弾力性を有しな
いゲル状又はソリッド状の接着剤と硬化後も弾力性を有
するゴム状の接着剤をサーマルヘッド長手方向に併用し
ていることを特徴とするサーマルヘッド。In a thermal head made by bonding an insulating substrate on which a heating resistor is formed and a heat sink, a gel-like or solid adhesive that has no elasticity after curing and a rubber-like adhesive that has elasticity even after curing are used. A thermal head characterized in that a chemical agent is used in combination in the longitudinal direction of the thermal head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19043688A JPH0238058A (en) | 1988-07-28 | 1988-07-28 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19043688A JPH0238058A (en) | 1988-07-28 | 1988-07-28 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0238058A true JPH0238058A (en) | 1990-02-07 |
Family
ID=16258103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19043688A Pending JPH0238058A (en) | 1988-07-28 | 1988-07-28 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0238058A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006021434A (en) * | 2004-07-08 | 2006-01-26 | Toshiba Tec Corp | Ink jet head unit and its manufacturing process |
| US20100054812A1 (en) * | 2008-08-26 | 2010-03-04 | Brother Kogyo Kabushiki Kaisha | Exposing Device, Method of Manufacturing the Same, and Image Forming Apparatus |
-
1988
- 1988-07-28 JP JP19043688A patent/JPH0238058A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006021434A (en) * | 2004-07-08 | 2006-01-26 | Toshiba Tec Corp | Ink jet head unit and its manufacturing process |
| JP4630592B2 (en) * | 2004-07-08 | 2011-02-09 | 東芝テック株式会社 | Manufacturing method of inkjet head unit |
| US20100054812A1 (en) * | 2008-08-26 | 2010-03-04 | Brother Kogyo Kabushiki Kaisha | Exposing Device, Method of Manufacturing the Same, and Image Forming Apparatus |
| US8687030B2 (en) * | 2008-08-26 | 2014-04-01 | Brother Kogyo Kabushiki Kaisha | Exposing device, method of manufacturing the same, and image forming apparatus |
| US9671713B2 (en) | 2008-08-26 | 2017-06-06 | Brother Kogyo Kabushiki Kaisha | Exposing device, method of manufacturing the same, and image forming apparatus |
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