JPH0237760B2 - - Google Patents

Info

Publication number
JPH0237760B2
JPH0237760B2 JP56169091A JP16909181A JPH0237760B2 JP H0237760 B2 JPH0237760 B2 JP H0237760B2 JP 56169091 A JP56169091 A JP 56169091A JP 16909181 A JP16909181 A JP 16909181A JP H0237760 B2 JPH0237760 B2 JP H0237760B2
Authority
JP
Japan
Prior art keywords
diaphragm
film
mold
molding
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56169091A
Other languages
Japanese (ja)
Other versions
JPS5869198A (en
Inventor
Michizo Saeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Onkyo Corp
Original Assignee
Onkyo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Onkyo Corp filed Critical Onkyo Corp
Priority to JP16909181A priority Critical patent/JPS5869198A/en
Publication of JPS5869198A publication Critical patent/JPS5869198A/en
Publication of JPH0237760B2 publication Critical patent/JPH0237760B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00Diaphragms for electromechanical transducers; Cones
    • H04R7/02Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/12Non-planar diaphragms or cones

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Description

【発明の詳細な説明】 この発明は熱可塑性樹脂又はこれらの発泡体よ
りコーン形振動板を得るための成形方法に関す
る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a molding method for obtaining a cone-shaped diaphragm from a thermoplastic resin or a foam thereof.

従来、熱可塑性樹脂、たとえばポリエチレン、
ポリプロピレン、ポリスチレン等又はこれらの発
泡体よりコーン形振動板を成形するには、前記熱
可塑性樹脂又はこれらの発泡体をフイルム状に成
形した後、真空、圧空又は金型プレスで振動板形
状に成形する方法が、大量生産が可能である事、
成形装置の価格が比較的低い事から多用されてい
る。
Conventionally, thermoplastic resins such as polyethylene,
In order to mold a cone-shaped diaphragm from polypropylene, polystyrene, etc. or foamed materials thereof, the thermoplastic resin or foamed materials thereof are molded into a film shape, and then molded into a diaphragm shape using vacuum, compressed air, or mold press. The method is capable of mass production,
It is widely used because the price of the molding equipment is relatively low.

これを、熱可塑性樹脂にポリプロピレン、成形
方法として真空成形を採用した場合について更に
詳しく説明する。
This will be explained in more detail in the case where polypropylene is used as the thermoplastic resin and vacuum forming is used as the molding method.

第1−a図において、ポリプロピレンフイルム
1はクランプされた状態でヒーター2により、真
空成形時において充分なる伸びが得られるように
均一に予熱される。
In FIG. 1-a, a polypropylene film 1 is uniformly preheated by a heater 2 in a clamped state so that sufficient elongation can be obtained during vacuum forming.

この予熱温度はガラス転移点より約50℃高いゴ
ム状温度域まで上げる。
The preheating temperature is raised to a rubbery temperature range approximately 50° C. above the glass transition point.

次に第1−b図のごとく、真空ポンプ(図示せ
ず)により成形型3内の空気を排出すると、軟化
したポリプロピレンフイルム1は大気圧により押
圧され、コーン形状の前記凹型3の面に密着す
る。
Next, as shown in Fig. 1-b, when the air inside the mold 3 is exhausted by a vacuum pump (not shown), the softened polypropylene film 1 is pressed by atmospheric pressure and tightly adheres to the surface of the cone-shaped concave mold 3. do.

そして第1−c図のごとく、成形型3内に空気
を送り込む等して、振動板形状に成形されたポリ
プロピレンフイルム1を型から剥離し、不要部分
を截断してて、振動板を得る。
Then, as shown in FIG. 1-c, the polypropylene film 1 formed into the shape of a diaphragm is peeled from the mold by blowing air into the mold 3, and unnecessary portions are cut off to obtain a diaphragm.

このようにして得られた振動板の厚さは、成形
型3の底部分、すなわち、振動板の頂部に相当す
る部分(第1−c図A)が最も薄く、振動板の外
周(第1−c図B)に近づく程厚くなる傾向にあ
る。
The thickness of the diaphragm obtained in this way is the thinnest at the bottom part of the mold 3, that is, the part corresponding to the top of the diaphragm (Fig. -c The closer it gets to Figure B), the thicker it tends to be.

これは、成形時において当該部分が変位量が大
きく、その結果伸びが最も多い事によるものであ
る。
This is because the amount of displacement in this part is large during molding, and as a result, the elongation is the largest.

しかるに、スピーカー用振動板では振動板の頂
部の剛性が最も大きく、外周に近づくほど小さく
なることが、高能率及び周波数特性の優れたスピ
ーカーを提供する上で重要であることが知られて
いる。
However, in a diaphragm for a speaker, it is known that the stiffness is greatest at the top of the diaphragm and decreases toward the outer periphery, which is important in providing a speaker with high efficiency and excellent frequency characteristics.

即ち、ボイスコイルの振動を損失なく振動板に
伝達するにはコイルボビンとの接合部となる前記
頂部の剛性が大きいことが望ましく、又振動エネ
ルギー短絡を目的としコンプライアンスの大きい
エツジとのマツチングを取るためには外周程剛性
が小さく(コンプライアンス大)なる事が望まし
い。
That is, in order to transmit the vibration of the voice coil to the diaphragm without loss, it is desirable that the rigidity of the top part, which is the joint part with the coil bobbin, be large, and also to match with the edge with high compliance for the purpose of short-circuiting the vibration energy. It is desirable for the rigidity to be smaller (higher compliance) toward the outer periphery.

したがつて、前記成形方法によつて得られる振
動板は頂部程剛性が小さく(厚さが小)、それに
比べて外周程剛性が小さくならない事となり、前
述の要求に相反するものである。
Therefore, the diaphragm obtained by the above-mentioned molding method has a lower rigidity (smaller thickness) at the top, and a lower rigidity at the outer periphery, which is contrary to the above-mentioned requirements.

更に発泡体よりなるフイルムを前述で成形方法
で成形した振動板は厚さの変化が上記傾向を示す
うえに、頂部部分における空孔部が最も押しつぶ
される結果、前記空孔部に起因する内部ロスが著
しく減少し、このような振動板を組みこんだスピ
ーカーは振動板の付根部分が主として振動する高
音再生域において共振が発生し、これが周波数特
性に有害なピーク、デイツプの発生する原因とな
る。
Furthermore, a diaphragm made of a foam film molded using the above-mentioned molding method not only exhibits the above-mentioned tendency in thickness change, but also has internal loss caused by the pores as a result of the pores being crushed the most in the top portion. In a speaker incorporating such a diaphragm, resonance occurs in the high-frequency reproduction range where the root of the diaphragm mainly vibrates, and this causes harmful peaks and dips in the frequency characteristics.

そこで、この発明では前記熱可塑性樹脂又はこ
れらの発泡体フイルムを真空、圧空又は金型プレ
ス成形する際、予熱工程において、フイルムの中
部程温度が低くなるように加熱し、成形工程にお
ける中心部の伸びを抑制するごとにより、頂部に
近づく程厚い振動板を得る成形方法であつて、以
下、熱可塑性樹脂フイルムとしてポリプロピレン
フイルム、成形方法として真空成形を採用した場
合について詳細に説明する。
Therefore, in the present invention, when the thermoplastic resin or foamed film thereof is subjected to vacuum, pressure air or mold press molding, the film is heated in the preheating step so that the temperature is lower in the middle part of the film, and This is a molding method that obtains a diaphragm that is thicker toward the top by suppressing elongation, and a case in which a polypropylene film is used as the thermoplastic resin film and vacuum forming is used as the molding method will be described in detail below.

第2図において1はクランプされたポリプロピ
レンフイルム、2はヒーター、3は成形型であり
従来のものと同一である。
In FIG. 2, 1 is a clamped polypropylene film, 2 is a heater, and 3 is a mold, which is the same as the conventional one.

21は前記ヒーター2とクランプされたポリプ
ロピレンフイルムとの間において、当該ポリプロ
ピレンフイルムの中心部、すなわち振動板の頂部
部分となるべき部分に配置した熱遮蔽プレートで
ある。
Reference numeral 21 denotes a heat shielding plate disposed between the heater 2 and the clamped polypropylene film at the center of the polypropylene film, that is, at the portion that is to become the top portion of the diaphragm.

この熱遮蔽プレート21はヒーター2から放射
される熱をある程度遮蔽し、遮蔽されたフイルム
の中心部分がその外周部分より低く熱せられるよ
うにするものである。
This heat shielding plate 21 shields the heat radiated from the heater 2 to some extent, so that the shielded central portion of the film is heated at a lower temperature than the outer peripheral portion.

このような予熱をした後、従来の成形工程(第
1−b図)を行なうと、振動板の付根部分に相当
する前記フイルム1の中心部分ののびは温度が低
いためにその外周部分に比べて小さい。
After such preheating, when the conventional molding process (Fig. 1-b) is performed, the center part of the film 1, which corresponds to the root part of the diaphragm, has a lower elongation than the outer peripheral part due to the lower temperature. It's small.

したがつて、このようにした成形して得られた
振動板はその頂部部分はのびが少ないため厚く、
外周部分はのびが大きい為薄い。
Therefore, the diaphragm obtained by molding in this way is thick at the top part because it has little stretch.
The outer periphery is thin because it stretches a lot.

又発泡体フイルムも同様な厚さ分布を有すると
ともに、頂部部分の空孔がつぶれる率が従来の成
形方法よりも極めて小さいので、空孔の存在に起
因する内部ロスの減少が極めて小さい。
The foamed film also has a similar thickness distribution, and the collapse rate of the pores in the top portion is much smaller than in conventional molding methods, so the reduction in internal loss due to the presence of pores is extremely small.

第3図はこの成形方法に使用する他の遮蔽プレ
ート22であり、プレート22に外周程遮蔽割合
が小さくなるように小孔22a,22b,22c
を穿設したものであり、これによればフイルム1
の温度勾配が更に滑めらかになるので、頂部部分
から外部部分に向つてその厚さが滑めらかに減少
した振動板を得ることができる。
FIG. 3 shows another shielding plate 22 used in this molding method, in which small holes 22a, 22b, 22c are formed in the plate 22 so that the shielding ratio decreases toward the outer periphery.
According to this, film 1
Since the temperature gradient becomes smoother, it is possible to obtain a diaphragm whose thickness decreases smoothly from the top portion toward the outer portion.

上記遮蔽プレート21,22は従来の装置を何
ら改変することなく単に付加するのみで目的を達
成できる利点を有するが、前記ヒーター2の加熱
温度分布を変えることによつても達成することが
できる。
The shielding plates 21 and 22 have the advantage that the purpose can be achieved by simply adding them without any modification to the conventional device, but the purpose can also be achieved by changing the heating temperature distribution of the heater 2.

上記実施例をポリプロピレンフイルムについて
述べたが、その他の熱可塑性樹脂又はこれらの発
泡体フイルムに適用できることは明白であり、又
成形方法も真空成形のみでなく、大気圧以上の圧
力を押圧する圧空成形、金型で押圧する金型プレ
ス成形においても同様に採用できる。
Although the above embodiment has been described with respect to polypropylene film, it is obvious that it can be applied to other thermoplastic resins or foamed films of these resins, and the forming method is not limited to vacuum forming, but also pressure forming using pressure higher than atmospheric pressure. , it can be similarly adopted in mold press molding in which pressing is performed using a mold.

以上に説明したごとく、この発明は熱可塑性樹
脂又はれらの発泡体樹脂フイルムを真空成形、圧
空成形又は金型プレス成形するにおいて、当該フ
イルムの振動板に形成した場合振動板の付根付近
に相当する部分よりもその外周部分の温度が高く
なるように加熱する予熱工程を得た後、真空、圧
空又は金型プレス成形することにより、外周部分
に比べて前記頂部部分に相当する部分の成形時に
おける伸びを抑制し、もつて頂部程厚く、外周程
薄く成形された振動板を得ることができるもので
ある。
As explained above, when a thermoplastic resin or a foamed resin film thereof is vacuum-formed, pressure-formed, or mold press-molded, when the film is formed on a diaphragm, the film corresponds to the area near the base of the diaphragm. After obtaining a preheating step in which the temperature of the outer circumferential portion is higher than that of the outer circumferential portion, vacuum, pressure or mold press molding is performed to form the portion corresponding to the top portion compared to the outer circumferential portion. This makes it possible to suppress the elongation of the diaphragm, thereby making it possible to obtain a diaphragm that is thicker toward the top and thinner toward the outer periphery.

又、発泡体フイルムの場合には特に振動板の付
根部分の空孔が押しつぶされる割合が著しく減少
するので剛性の高い、しかも内部ロスの大きい付
根部分を有する振動板を提供することができる。
Furthermore, in the case of a foam film, the proportion of pores in the root portion of the diaphragm being crushed is significantly reduced, making it possible to provide a diaphragm having a root portion with high rigidity and large internal loss.

又、従来の装置を何ら改変、又は少しの改善で
達成することができる等実用上も極めてすぐれた
発明である。
Furthermore, it is an extremely excellent invention in practical terms, as it can be achieved with no modification or slight improvement of conventional devices.

【図面の簡単な説明】[Brief explanation of drawings]

第1−a,1−b,1−c図は従来の真空成形
方法を示す断面図、第2図はこの発明の成形方法
を示す装置の断面図、第3図はこの成形方法に用
いる一実施例遮蔽板の斜視図。
1-a, 1-b, and 1-c are cross-sectional views showing a conventional vacuum forming method, FIG. 2 is a cross-sectional view of an apparatus showing a forming method of the present invention, and FIG. FIG. 3 is a perspective view of an embodiment shielding plate.

Claims (1)

【特許請求の範囲】[Claims] 1 熱可塑性樹脂又はこれらの発泡体フイルム
を、当該フイルムのコーン形振動板の頂部付近に
相当する部分よりその外周部分の予熱温度を高く
した後、真空、圧空又は金型プレス成形すること
を特徴とするコーン形振動板の成形方法。
1. A thermoplastic resin or a foamed film thereof is preheated to a higher temperature at the outer circumferential portion of the film than at a portion corresponding to the top of the cone-shaped diaphragm, and then subjected to vacuum, compressed air, or mold press molding. A method for forming a cone-shaped diaphragm.
JP16909181A 1981-10-21 1981-10-21 Forming method of cone type diaphragm Granted JPS5869198A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16909181A JPS5869198A (en) 1981-10-21 1981-10-21 Forming method of cone type diaphragm

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16909181A JPS5869198A (en) 1981-10-21 1981-10-21 Forming method of cone type diaphragm

Publications (2)

Publication Number Publication Date
JPS5869198A JPS5869198A (en) 1983-04-25
JPH0237760B2 true JPH0237760B2 (en) 1990-08-27

Family

ID=15880150

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16909181A Granted JPS5869198A (en) 1981-10-21 1981-10-21 Forming method of cone type diaphragm

Country Status (1)

Country Link
JP (1) JPS5869198A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4872376B2 (en) * 2006-02-22 2012-02-08 パナソニック電工株式会社 Thermoplastic resin sheet

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55162696A (en) * 1979-06-06 1980-12-18 Matsushita Electric Ind Co Ltd Manufacture for speaker diaphragm plate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55162696A (en) * 1979-06-06 1980-12-18 Matsushita Electric Ind Co Ltd Manufacture for speaker diaphragm plate

Also Published As

Publication number Publication date
JPS5869198A (en) 1983-04-25

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