JPH0236027U - - Google Patents
Info
- Publication number
- JPH0236027U JPH0236027U JP11573988U JP11573988U JPH0236027U JP H0236027 U JPH0236027 U JP H0236027U JP 11573988 U JP11573988 U JP 11573988U JP 11573988 U JP11573988 U JP 11573988U JP H0236027 U JPH0236027 U JP H0236027U
- Authority
- JP
- Japan
- Prior art keywords
- solid electrolytic
- lead terminal
- electrolytic capacitor
- chip type
- type solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の一実施例の樹脂モールドチツ
プ型固体電解コンデンサの断面図、第２図は従来
例の樹脂モールドチツプ型固体電解コンデンサの
断面図を用いてコンデンサ素子に加わる機械的ス
トレスを示した図、第３図は本考案実施例と従来
例のはんだ浴を通して実装した後の陰極部接続外
れ不良率を示した図である。
１……コンデンサ素子、２……陰極引出しリー
ド端子、３……陽極リード線、４……陽極引出し
リード端子、５Ａ……導電性接着剤、５Ｂ……接
着剤、６……絶縁性樹脂封止剤、７……陰極接続
面、Ｆ１〜Ｆ６……機械的ストレス。
Figure 1 is a cross-sectional view of a resin-molded chip type solid electrolytic capacitor according to an embodiment of the present invention, and Figure 2 is a cross-sectional view of a conventional resin-molded chip type solid electrolytic capacitor. The figure shown in FIG. 3 is a diagram showing the failure rate due to disconnection of the cathode portion after mounting through a solder bath in the embodiment of the present invention and the conventional example. DESCRIPTION OF SYMBOLS 1... Capacitor element, 2... Cathode lead terminal, 3... Anode lead wire, 4... Anode lead terminal, 5A... Conductive adhesive, 5B... Adhesive, 6... Insulating resin seal inhibitor, 7...cathode connection surface, F1 to F6 ...mechanical stress.
Claims (1)
端子及び陰極引出しリード端子を接続・引出し、
樹脂モールド成形された樹脂モールドチツプ型固
体電解コンデンサにおいて、陰極引出しリード端
子とコンデンサ素子とが導電性を有した導電性接
着剤と接着力の強い接着剤の別々の機能を有する
２種類の材料で接着されていることを特徴とする
樹脂モールドチツプ型固体電解コンデンサ。 Connect and draw out the anode lead terminal and cathode lead terminal from the solid electrolytic capacitor element,
In a resin molded chip type solid electrolytic capacitor, the cathode lead terminal and the capacitor element are made of two types of materials that have the separate functions of a conductive adhesive and a strong adhesive. A resin molded chip type solid electrolytic capacitor characterized by being bonded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11573988U JPH0236027U (en) | 1988-09-01 | 1988-09-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11573988U JPH0236027U (en) | 1988-09-01 | 1988-09-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236027U true JPH0236027U (en) | 1990-03-08 |
Family
ID=31357664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11573988U Pending JPH0236027U (en) | 1988-09-01 | 1988-09-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236027U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0722283A (en) * | 1993-06-22 | 1995-01-24 | Nec Corp | Solid electrolytic capacitor |
| JP2006186083A (en) * | 2004-12-27 | 2006-07-13 | Nichicon Corp | Chip-type solid electrolytic capacitor |
| JP2020167267A (en) * | 2019-03-29 | 2020-10-08 | パナソニックＩｐマネジメント株式会社 | Electrolytic capacitor and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS592129B2 (en) * | 1975-09-23 | 1984-01-17 | タナカキキンゾクコウギヨウ カブシキガイシヤ | Denkisetsutenyougin - Sankabutsu Wire - No Seizouhou |
| JPS6144420A (en) * | 1984-08-09 | 1986-03-04 | 関西日本電気株式会社 | Method of producing solid electrolytic condenser |
-
1988
- 1988-09-01 JP JP11573988U patent/JPH0236027U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS592129B2 (en) * | 1975-09-23 | 1984-01-17 | タナカキキンゾクコウギヨウ カブシキガイシヤ | Denkisetsutenyougin - Sankabutsu Wire - No Seizouhou |
| JPS6144420A (en) * | 1984-08-09 | 1986-03-04 | 関西日本電気株式会社 | Method of producing solid electrolytic condenser |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0722283A (en) * | 1993-06-22 | 1995-01-24 | Nec Corp | Solid electrolytic capacitor |
| JP2006186083A (en) * | 2004-12-27 | 2006-07-13 | Nichicon Corp | Chip-type solid electrolytic capacitor |
| JP2020167267A (en) * | 2019-03-29 | 2020-10-08 | パナソニックＩｐマネジメント株式会社 | Electrolytic capacitor and manufacturing method thereof |
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