JPH0234684B2 - - Google Patents

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Publication number
JPH0234684B2
JPH0234684B2 JP55043196A JP4319680A JPH0234684B2 JP H0234684 B2 JPH0234684 B2 JP H0234684B2 JP 55043196 A JP55043196 A JP 55043196A JP 4319680 A JP4319680 A JP 4319680A JP H0234684 B2 JPH0234684 B2 JP H0234684B2
Authority
JP
Japan
Prior art keywords
die
wire
cutting
cylindrical body
wire rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP55043196A
Other languages
Japanese (ja)
Other versions
JPS56141909A (en
Inventor
Michio Okuno
Toshio Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP4319680A priority Critical patent/JPS56141909A/en
Publication of JPS56141909A publication Critical patent/JPS56141909A/en
Publication of JPH0234684B2 publication Critical patent/JPH0234684B2/ja
Granted legal-status Critical Current

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Description

【発明の詳細な説明】[Detailed description of the invention]

〔産業上の利用分野〕 本発明は線材のカツピング(線材内部の空洞)
を検出するための検出方法及び検出装置に関する
ものである。 〔従来の技術及び発明が解決しようとする課題〕 一般に高強度合金線、例えばイ号アルミニウム
線などの伸線加工において、鋳造時の欠陥や異物
混入などに起因するカツピングを発生し、その部
分で断線することがある。カツピングは線材内部
の破壊現象で、第8図に模式的に示すように、線
材aの中心軸上に周期的に発生する矢尻状の空洞
fであり、まれに伸線加工における引抜力の作用
によつても断線することなく線材内部に空洞とし
て残ることがある。このような線材を例えば電線
などに用いると、撚線工程において素線切れを起
し、最悪の場合には素線切れを起すことなく電線
として出荷される。撚線工程における線材切れ
は、素線の熱処理や撚線に要した費用が損失とな
り、電線として出荷されると、架線の際或いは電
線として使用中の振動疲労などにより断線事故を
起す可能性があり、非常に危険である。 従来線材表面の欠陥検出方法として渦流探傷法
が知られており、実操業にも広く用いられている
が、この探傷法はカツピングのような線材内部の
欠陥を検出することはできない。金属内部の欠陥
を検出する方法としては、X線透過法や超音波探
傷法が知られているが、線材のように断面が円形
で細く、しかも横方向に振動するものでは透過距
離が不安定となり、更に透過物体(線材)が高速
で移動するものには適用できない。 〔課題を解決するための手段および作用〕 本発明はこれに鑑み種々検討の結果、線材を引
抜加工するときの引抜力を連続的に測定すること
により、カツピングを引抜力の低下として検知し
得ることを知見し、線材のカツピング検出方法及
び検出装置を開発したもので、線材を引抜加工す
るダイスとダイス受け間に、ダイス横振れ防止用
円筒体を取付け、該円筒体内にブリツジ回路を形
成する感歪抵抗体を張り付けた引抜力検出用リン
グを円筒体と同軸状に設けてダイスを支持し、ダ
イスを通して線材を引抜き、線材のカツピングに
よる引抜力低下をブリツジ回路の不平衡電流値の
低下として検出することを特徴とするものであ
る。 即ち本発明は、伸線機例えば連続伸線機内の1
〜数個のダイスとダイス受け間に、カツピング検
出装置を取付け、ダイスを通して線材を引抜き、
線材のカツピングによる引抜力低下を検出するも
のである。カツピング検出装置は、一端にダイス
装着部を形成し、他端に線材挿通孔を設けたダイ
ス横振れ防止用円筒体内に、ブリツジ回路を形成
する感歪抵抗体を張り付けた引張力検出用リング
を円筒体と同軸状に設けてダイス支持面を形成し
たもので、線材のカツピングによる引抜力低下を
ブリツジ回路の不平衡電流値の低下として検出す
るものである。 これを図面を用いて詳細に説明する。 第1図は本発明方法の一例を示すもので、線材
aは伸線機1によりダイス受け2に取付けたダイ
ス3を通して従来同様引抜加工される。ダイス3
とダイス受け2間には検出装置4を取付け該装置
4によつて検出された引抜力はストレンメーター
5により測定され、記録計6に記録される。均質
な線材を引抜加工するときの引抜力は一定である
が、内部にカツピングを有する線材の引抜力は低
下し、カツピングとして検出される。 第2図は上記検出装置4の一例を示すもので、
一端にダイス3を取付ける装着口8を有し、他端
に線材aを挿通する挿通孔9を設けたダイス横振
れ防止用円筒体7の内側に、ブリツジ回路を形成
する感歪抵抗体を張り付けた引抜力検出用リング
10を円筒体7と同軸状に設け、その先端にダイ
ス支持面11を形成したものである。 また第3図は上記検出装置4の他の一例を示す
もので、一端にダイス装着口8と他端に線材挿通
孔9を設けたダイス横振れ防止用円筒体7のダイ
ス装着口8より円筒体7の内側に、引抜力検出用
リング10を円筒体7と同軸状に設け、その下端
にダイス支持面11を形成したものである。 第1図に示すように上記検出装置4をダイス受
け2に取付け、該装置4のダイス装着口8にダイ
ス3を装着して引抜力検出リング10のダイス支
持面に支持せしめ線材aを引抜加工すると、線材
aの変形抵抗やダイス面との摩擦抵抗により引抜
力検出用リング10を圧縮変形させる。この引抜
力検出用リング10は第4図に示すように薄肉リ
ング状のもので、表面に相対して1対の縦方向の
感歪抵抗体bと相対して1対の横方向の感歪抵抗
体cを張り付け、第5図に示すブリツジ回路を形
成している。このような検出リング10に引抜力
pが作用し、該リング10が圧縮変形すると、感
圧抵抗体cは引張歪により、また感歪抵抗体bは
圧縮歪により、それぞれ抵抗変化を起し、その結
果ブリツジ回路に不平衡電流を生じる。即ち引抜
力pはブリツジ回路に生じた不平衡電流値に変換
されて記録される。 尚ダイス横振れ防止用円筒体は伸線ダイスの横
振を防止して検出用リングが片寄つた変形を防ぐ
と共に検出用リングに張り付けた感歪抵抗体及び
ブリツジ回路が外傷を受けるのを防止する役割を
担つているものである。また第5図において12
は定電圧電源13は電流計を示す。 〔実施例〕 次に本発明の実施例について説明する。 第2図に示す検出装置を第1図に示すダイスと
ダイス受け間に取付け、イ号アルニウム線材の引
抜加工を行なうと同時にカツピングの検出を行な
つた。なお、意識的に線材内部にカツピング発生
をもたらすに十分な大きさの異物を混入させた
り、巣やブローホールなどの鋳造欠陥を生じさせ
ることが困難なために、線材の強度特性を延性の
小さいものと大きいものの2種類として、また、
伸線の減面率も通常よりも小さくして検出実験を
行つた。これは、線材の延性が小さく、異物や欠
陥が存在し、低減面率の伸線を行う場合にカツピ
ングが発生しやすいという従来からよく知られた
知見に基づくものである。用いた線材はCu0.02
%、Fe0.17%、Si0.58%、Mg0.64%、残部Alか
らなるイ号アルミニウムの押出材(線径12mm)を
更に線径9.5mmまで伸線加工し、これを550℃の温
度で2時間加熱した後水焼入れを行なつて溶体化
処理したものと、溶体化処理した後180℃の温度
で6時間時効処理したものの2種類である。後者
が延性が低くカツピングの発生しやすいものとし
て作製した線材で、第1表にこれらの引張特性を
示す。
[Industrial field of application] The present invention is directed to cutting wire rods (cavities inside wire rods).
The present invention relates to a detection method and a detection device for detecting. [Problems to be solved by the prior art and the invention] Generally, in the wire drawing process of high-strength alloy wires, such as No. There may be a disconnection. Cutting is a destructive phenomenon inside the wire, and as schematically shown in Figure 8, it is an arrowhead-shaped cavity f that periodically occurs on the central axis of the wire a, and in rare cases, it is the effect of the drawing force during wire drawing. Even if the wire is broken, it may remain as a cavity inside the wire without breaking. If such a wire is used, for example, as an electric wire, the wire will break during the wire twisting process, and in the worst case, the wire will be shipped as an electric wire without any breakage. Wire breakage during the wire twisting process results in a loss in the cost of heat treatment and twisting of the strands, and if the wire is shipped as an electric wire, there is a possibility of wire breakage due to vibration fatigue during overhead wiring or during use as an electric wire. Yes, it is very dangerous. The eddy current flaw detection method is conventionally known as a method for detecting defects on the wire surface and is widely used in actual operations, but this flaw detection method cannot detect defects inside the wire such as cutting. X-ray transmission methods and ultrasonic flaw detection methods are known as methods for detecting defects inside metals, but the transmission distance is unstable for wires that have a thin, circular cross section and vibrate laterally. Furthermore, it cannot be applied to objects in which the transparent object (wire) moves at high speed. [Means and effects for solving the problem] In view of this, as a result of various studies, the present invention is capable of detecting cutting as a decrease in the drawing force by continuously measuring the drawing force when drawing the wire rod. Based on this knowledge, we have developed a wire rod cutting detection method and detection device.A cylindrical body is installed between the die for drawing the wire rod and the die receiver, and a bridge circuit is formed within the cylindrical body. A ring for detecting the pulling force with a strain-sensitive resistor pasted thereon is installed coaxially with the cylindrical body to support the die, and the wire is pulled through the die. It is characterized by detection. That is, the present invention provides a wire drawing machine, for example, a continuous wire drawing machine.
~ Install a cutting detection device between several dies and the die receiver, pull out the wire through the dies,
This detects the reduction in drawing force due to cutting of the wire rod. The cutting detection device includes a ring for tensile force detection in which a strain-sensitive resistor that forms a bridge circuit is pasted inside a cylindrical body for preventing lateral vibration of the die, which has a die mounting part at one end and a wire insertion hole at the other end. It is provided coaxially with the cylindrical body to form a die support surface, and detects a decrease in drawing force due to cutting of the wire as a decrease in the unbalanced current value of the bridge circuit. This will be explained in detail using the drawings. FIG. 1 shows an example of the method of the present invention, in which a wire rod a is drawn by a wire drawing machine 1 through a die 3 attached to a die receiver 2 in a conventional manner. Dice 3
A detection device 4 is installed between the die support 2 and the die receiver 2, and the pulling force detected by the device 4 is measured by a strain meter 5 and recorded in a recorder 6. The drawing force when drawing a homogeneous wire is constant, but the drawing force of a wire with internal cutting decreases and is detected as a cutting. FIG. 2 shows an example of the detection device 4.
A strain-sensitive resistor that forms a bridge circuit is attached to the inside of a cylindrical body 7 for preventing lateral vibration of the die, which has a mounting port 8 for attaching the die 3 at one end and an insertion hole 9 for inserting the wire a at the other end. A pull-out force detection ring 10 is provided coaxially with the cylindrical body 7, and a die support surface 11 is formed at the tip thereof. FIG. 3 shows another example of the above-mentioned detection device 4, in which a die mounting port 8 of a cylindrical body 7 for preventing lateral vibration of dice is provided with a die mounting port 8 at one end and a wire insertion hole 9 at the other end. A drawing force detection ring 10 is provided inside the body 7 coaxially with the cylindrical body 7, and a die support surface 11 is formed at the lower end thereof. As shown in FIG. 1, the detection device 4 is attached to the die receiver 2, the die 3 is attached to the die mounting port 8 of the device 4, and the die 3 is supported on the die support surface of the drawing force detection ring 10, and the wire material a is drawn. Then, the drawing force detection ring 10 is compressed and deformed due to the deformation resistance of the wire material a and the frictional resistance with the die surface. As shown in FIG. 4, this pull-out force detection ring 10 is in the form of a thin ring, with a pair of vertical strain-sensitive resistors b facing the surface and a pair of horizontal strain-sensitive resistors b facing the surface. A resistor c is attached to form a bridge circuit shown in FIG. When a pull-out force p acts on such a detection ring 10 and the ring 10 is compressively deformed, the pressure-sensitive resistor c changes its resistance due to tensile strain, and the strain-sensitive resistor b changes its resistance due to compressive strain, respectively. As a result, an unbalanced current is generated in the bridge circuit. That is, the pulling force p is converted into an unbalanced current value generated in the bridge circuit and recorded. The cylindrical body for preventing lateral vibration of the die prevents lateral vibration of the wire drawing die, prevents the detection ring from being deformed to one side, and prevents the strain-sensitive resistor and bridge circuit attached to the detection ring from being damaged. It is something that plays a role. Also, in Figure 5, 12
1 shows a constant voltage power supply 13 and an ammeter. [Example] Next, an example of the present invention will be described. The detection device shown in FIG. 2 was installed between the die shown in FIG. 1 and the die receiver, and cutting was detected at the same time as the No. 1 aluminum wire was drawn. It should be noted that it is difficult to intentionally introduce foreign matter large enough to cause cutting into the wire, or to create casting defects such as cavities or blowholes, so the strength characteristics of the wire are reduced to less ductile. As two types, small and large,
Detection experiments were conducted with the wire drawing area reduction rate smaller than usual. This is based on the conventionally well-known knowledge that wire rods have low ductility, foreign objects and defects are present, and cutting is likely to occur when wire drawing with a reduced area ratio is performed. The wire used is Cu0.02
%, Fe 0.17%, Si 0.58%, Mg 0.64%, and the balance Al (wire diameter 12 mm) was further drawn to a wire diameter of 9.5 mm, and this was heated to 550℃. There are two types: one is solution treated by heating for 2 hours and then water quenched, and the other is solution treated and then aged at 180°C for 6 hours. The latter is a wire rod manufactured with low ductility and a tendency to cause cutting, and Table 1 shows its tensile properties.

〔発明の効果〕〔Effect of the invention〕

このように本発明によれば従来検出が困難とさ
れていたカツピングの検出が容易となり、カツピ
ングが発生した線材を後工程に送られることを防
止することができる等工業上顕著な効果を奏す
る。
As described above, according to the present invention, it is possible to easily detect cutting, which has been difficult to detect in the past, and it is possible to prevent a wire rod in which cutting has occurred from being sent to a subsequent process, which brings about remarkable industrial effects.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明のカツピング検出方法の一例を
示す説明図、第2図は本発明検出装置の一例を示
す側断面図、第3図は同装置の他の一例を示す側
断面図、第4図は引抜力検出用リングの説明図、
第5図は同リングのブリツジ回路の説明図、第6
図はカツピング発生のない線材の引抜力変動図、
第7図はカツピング発生を起した線材の引抜力変
動図、第8図はカツピングの発生した線材のX線
透過写真の模式図である。 a…線材、b…縦方向の感歪抵抗体、c…横方
向の感歪抵抗体、p…引抜力、f…カツピング欠
陥、1…伸線機、2…ダイス受け、3…ダイス、
4…検出装置、5…ストレンメーター、6…記録
計、7…ダイス横振れ防止用円筒体、8…ダイス
装着口、9…線材挿通孔、10…検出リング、1
1…ダイス支持面。
FIG. 1 is an explanatory diagram showing an example of the cutting detection method of the present invention, FIG. 2 is a sectional side view showing an example of the detecting device of the present invention, and FIG. 3 is a side sectional view showing another example of the same device. Figure 4 is an explanatory diagram of the pull-out force detection ring.
Figure 5 is an explanatory diagram of the bridge circuit of the same ring, Figure 6
The figure shows a drawing force variation diagram of a wire rod that does not cause cutting.
FIG. 7 is a drawing force variation diagram of a wire rod in which cutting has occurred, and FIG. 8 is a schematic diagram of an X-ray photograph of the wire rod in which cutting has occurred. a... Wire rod, b... Vertical strain sensitive resistor, c... Horizontal strain sensitive resistor, p... Pulling force, f... Cutting defect, 1... Wire drawing machine, 2... Dice receiver, 3... Dice,
4...Detection device, 5...Strain meter, 6...Recorder, 7...Cylindrical body for preventing side vibration of dice, 8...Dice mounting port, 9...Wire insertion hole, 10...Detection ring, 1
1...Dice support surface.

Claims (1)

【特許請求の範囲】 1 線材を引抜加工するダイスとダイス受け間
に、ダイス横振れ防止用円筒体を取付け、該円筒
体内にブリツジ回路を形成する感歪抵抗体を張り
付けた引抜力検出用リングを円筒体と同軸状に設
けてダイスを支持しダイスを通して線材を引抜
き、線材のカツピングによる引抜力低下をブリツ
ジ回路の不平衡電流値の低下として検出すること
を特徴とする線材のカツピング検出方法。 2 一端にダイス装着部を形成し、他端に線材挿
通孔を設けたダイス横振れ防止用円筒体内に、ブ
リツジ回路を形成する感歪抵抗体を張り付けた引
抜力検出用リングを円筒体と同軸状に設けてダイ
ス支持面を形成した線材のカツピング検出装置。
[Scope of Claims] 1. A ring for detecting drawing force, in which a cylindrical body for preventing lateral vibration of the die is attached between a die for drawing a wire rod and a die receiver, and a strain-sensitive resistor forming a bridge circuit is pasted inside the cylindrical body. A method for detecting cutting of a wire rod, characterized in that a wire rod is provided coaxially with a cylindrical body to support a die, the wire rod is pulled out through the die, and a reduction in drawing force due to cutting of the wire rod is detected as a reduction in an unbalanced current value of a bridge circuit. 2. A pullout force detection ring with a strain-sensitive resistor that forms a bridge circuit pasted is placed coaxially with the cylindrical body, inside a cylindrical body for preventing lateral vibration of the die, which has a die attachment part formed at one end and a wire insertion hole at the other end. A cutting detection device for a wire rod formed in a shape to form a die support surface.
JP4319680A 1980-04-02 1980-04-02 Method and apparatus for detecting cupping of wire Granted JPS56141909A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4319680A JPS56141909A (en) 1980-04-02 1980-04-02 Method and apparatus for detecting cupping of wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4319680A JPS56141909A (en) 1980-04-02 1980-04-02 Method and apparatus for detecting cupping of wire

Publications (2)

Publication Number Publication Date
JPS56141909A JPS56141909A (en) 1981-11-05
JPH0234684B2 true JPH0234684B2 (en) 1990-08-06

Family

ID=12657163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4319680A Granted JPS56141909A (en) 1980-04-02 1980-04-02 Method and apparatus for detecting cupping of wire

Country Status (1)

Country Link
JP (1) JPS56141909A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4516620Y1 (en) * 1966-03-18 1970-07-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4516620Y1 (en) * 1966-03-18 1970-07-09

Also Published As

Publication number Publication date
JPS56141909A (en) 1981-11-05

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