JPH0232981B2 - - Google Patents
Info
- Publication number
- JPH0232981B2 JPH0232981B2 JP57047761A JP4776182A JPH0232981B2 JP H0232981 B2 JPH0232981 B2 JP H0232981B2 JP 57047761 A JP57047761 A JP 57047761A JP 4776182 A JP4776182 A JP 4776182A JP H0232981 B2 JPH0232981 B2 JP H0232981B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- nonwoven fabric
- fibers
- bag
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000835 fiber Substances 0.000 claims description 21
- 239000004745 nonwoven fabric Substances 0.000 claims description 20
- 238000004806 packaging method and process Methods 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 32
- 239000000428 dust Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 230000000703 anti-shock Effects 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
Landscapes
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Wrappers (AREA)
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、静電気防止性、ほこり防止性および
衝撃防止性を兼ね備えたIC包装用袋に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an IC packaging bag that has anti-static properties, anti-dust properties and anti-shock properties.
従来の技術
IC（集積回路）包装用の封筒は、静電気を帯び
ないこと、ほこりが出ないことが絶対条件となる
が、厳しくこの条件を満たす包装材料は未だ見当
らない状態にある。Prior Art Envelopes for packaging ICs (integrated circuits) must not be charged with static electricity or generate dust, but packaging materials that strictly meet these requirements have not yet been found.
発明が解決しようとする課題
本発明者らは、制電性繊維を含有する不織布で
作つた袋がこの目的に適当ではないかと考えて検
討したが、この不織布は帯電防止性すぐれている
ものの、繊維のほぐれに基く微細な繊維ぼこりの
発生を完全にはなくすことができないため、IC
包装用のように高度の静電気防止性とほこり防止
性を要求される用途には不満足であることが判明
した。Problems to be Solved by the Invention The present inventors considered that a bag made of a non-woven fabric containing anti-static fibers might be suitable for this purpose, and although this non-woven fabric has excellent anti-static properties, IC
It has been found that it is unsatisfactory for applications that require a high degree of antistatic and dustproof properties, such as packaging.
本発明は、このような状況に鑑み、制電性繊維
を含有する不織布を使用しながらも、上記のよう
な問題点を有しないIC包装用袋を提供すること
を目的になされたものである。 In view of this situation, the present invention was made for the purpose of providing an IC packaging bag that does not have the above-mentioned problems even though it uses a nonwoven fabric containing antistatic fibers. .
課題を解決するための手段
本発明のIC包装用袋は、制電性繊維を含有す
る不織布１の片面には金属薄層を含有する非繊維
系の内面層２を設け、他面にはプラスチツク層ま
たは紙層よりなる外面層３を設けた積層物の製袋
物からなることを特徴とするものである。Means for Solving the Problems In the IC packaging bag of the present invention, a non-woven fabric 1 containing antistatic fibers is provided with a non-fibrous inner layer 2 containing a thin metal layer on one side, and a plastic layer on the other side. It is characterized by being made of a laminate bag having an outer layer 3 made of a layer or a paper layer.
以下本発明を詳細に説明する。 The present invention will be explained in detail below.
不織布１は、制電性繊維単独または制電性繊維
と通常の繊維とを繊維材料として、常法の不織布
製造法により取得される。繊維材料中の制電性繊
維の割合は0.1〜100％まで変化しうるが、0.1％
未満というように極端に少なくなると、静電気防
止効果が現れないようになる。 The nonwoven fabric 1 is obtained by a conventional nonwoven fabric manufacturing method using antistatic fibers alone or antistatic fibers and normal fibers as fiber materials. The proportion of antistatic fibers in the textile material can vary from 0.1 to 100%, but 0.1%
If the amount is extremely low, such as less than 20%, the antistatic effect will not be exhibited.
ここで制電性繊維としては、銅吸着繊維、金属
メツキ繊維、炭素複合繊維、金属蒸着繊維および
金属細線があげられ、特に最初の三者が好まし
い。 Examples of antistatic fibers include copper adsorption fibers, metal-plated fibers, carbon composite fibers, metal-deposited fibers, and thin metal wires, with the first three being particularly preferred.
不織布１の片面に積層する金属薄層を含有する
非繊維系の内面層２としては、たとえば、アルミ
ニウム箔、アルミニウム蒸着プラスチツクフイル
ム、ポリオレフイン被覆アルミニウム箔などがあ
げられる。 Examples of the non-fibrous inner layer 2 containing a thin metal layer laminated on one side of the nonwoven fabric 1 include aluminum foil, aluminum vapor-deposited plastic film, and polyolefin-coated aluminum foil.
不織布１の他面に積層するプラスチツク層また
は紙層よりなる外面層３としては、ポリオレフイ
ン、ポリアミド、ポリエステル、ポリ塩化ビニ
ル、ポリ塩化ビニリデン、ポリビニルアルコー
ル、エチレン―ビニルアルコール共重合体、ポリ
スチレン、ABS樹脂、セロハンをはじめとする
種々のプラスチツクの層または／および紙の層が
あげられる。 The outer layer 3 made of a plastic layer or a paper layer laminated on the other side of the nonwoven fabric 1 includes polyolefin, polyamide, polyester, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, ethylene-vinyl alcohol copolymer, polystyrene, and ABS resin. , various plastic layers including cellophane, and/or paper layers.
不織布１に対する内面層２および外面層３の積
層は、接着剤あるいはヒートシールにより貼り合
わせ法、溶融押出法、溶液または分散液コーテイ
ング法などによりなされる。 The inner layer 2 and the outer layer 3 are laminated onto the nonwoven fabric 1 by a bonding method using an adhesive or heat sealing, a melt extrusion method, a solution or dispersion coating method, or the like.
本発明のIC包装用袋は、内面層２／不織布
１／外面層３の層構成を有する積層物を製袋する
ことにより作製される。袋とは封筒状の薄手の袋
を言う。この袋にIC（LSIを含む）チツプやそれ
を実装した基板を収容する。 The IC packaging bag of the present invention is produced by bag-making a laminate having a layered structure of inner layer 2/nonwoven fabric 1/outer layer 3. A bag is a thin, envelope-like bag. This bag accommodates IC (including LSI) chips and boards on which they are mounted.
第１図は、このようにして作製されたIC包装
用袋における層配列を示した斜視図であり、一部
を切り欠き表示してある。 FIG. 1 is a perspective view showing the layer arrangement of the IC packaging bag produced in this manner, with a portion thereof being cut away.
作用および発明の効果
本発明のIC包装用袋にあつては、制電性繊維
を含有する不織布１が積層物の中間層を形成して
いて表面には現れていないにもかかわらず、良好
な静電気防止効果を発揮する。これは不織布を構
成する制電性繊維が、伝導による静電気防止作用
を有するだけでなく、無数にある繊維先端から自
己放電により瞬間的に静電気を逃がす作用を有す
るためであると考えられ、その作用は不織布表面
が他の層で覆われていてもそれほどは妨げられな
いのであると思われる。Function and Effects of the Invention In the IC packaging bag of the present invention, although the nonwoven fabric 1 containing antistatic fibers forms the intermediate layer of the laminate and does not appear on the surface, it has good properties. Demonstrates static electricity prevention effect. This is thought to be because the antistatic fibers that make up the nonwoven fabric not only have an antistatic effect through conduction, but also have the ability to instantly release static electricity from the countless fiber tips through self-discharge. It seems that this is not hindered much even if the surface of the nonwoven fabric is covered with another layer.
また、本発明のIC包装用袋における静電気防
止効果は、周囲の雰囲気湿度が低い場合でもほと
んど低下しない。 Further, the antistatic effect of the IC packaging bag of the present invention hardly decreases even when the surrounding atmospheric humidity is low.
加えて本発明のIC包装用袋は、不織布の両面
が他の層で覆われているため、これらの層により
不織布１に起因する繊維ぼこりは完全に抑えられ
る。被覆層として紙層を用いた場合でも、外面層
３として使用したときは、繊維ぼこりの発生は問
題となるほどではない。 In addition, in the IC packaging bag of the present invention, since both sides of the nonwoven fabric are covered with other layers, fiber dust caused by the nonwoven fabric 1 can be completely suppressed by these layers. Even when a paper layer is used as the covering layer, when it is used as the outer surface layer 3, the generation of fiber dust does not become a problem.
さらに本発明のIC包装用袋は、不織布１を積
層単位として含んでいるためクツシヨン性を有
し、運搬時や貯蔵時の物理的衝激からも、収容物
であるICを有効に保護する。 Furthermore, since the IC packaging bag of the present invention includes the nonwoven fabric 1 as a laminated unit, it has cushioning properties and effectively protects the ICs contained therein from physical impact during transportation and storage.
このように本発明のIC包装用袋は、製造容易
な簡単な層構成を有しながらも、静電気防止性、
ほこり防止性および衝撃防止性を全て兼ね備えて
おり、IC保護の目的が効果的に達成できる。 As described above, the IC packaging bag of the present invention has a simple layer structure that is easy to manufacture, and has antistatic properties and
It has both anti-dust and anti-shock properties, effectively achieving the purpose of IC protection.
実施例 次に実施例をあげて本発明をさらに説明する。Example Next, the present invention will be further explained with reference to Examples.
実施例 １
ニツケルメツキ繊維５％、レイヨン50％、ポリ
エステル繊維45％よりなる繊維混合物から目付け
75ｇ／m2の不織布１を製造した。Example 1 Fabric weight from a fiber mixture consisting of 5% nickel fiber, 50% rayon, and 45% polyester fiber
A nonwoven fabric 1 of 75 g/m 2 was produced.
この不織布１の片面にアルミニウム箔を接着剤
を用いて貼合することにより内面層２を形成し、
他面には厚み20μのポリエチレンフイルムを接着
剤を用いて貼合することにより外面層３を形成し
た。 An inner layer 2 is formed by bonding aluminum foil to one side of the nonwoven fabric 1 using an adhesive,
On the other side, an outer layer 3 was formed by laminating a 20 μm thick polyethylene film using an adhesive.
このようにして得られた３層構成の積層物を裁
断、貼合して20cm×20cmの大きさの封筒を作成
し、この封筒を用いてMOS型IC製造ラインにお
ける半導体の包装に供したところ、静電気障害、
ほこりの付着および物理的衝撃によるICの不良
品率は１ケ月の平均で0.01％以下と極めて低かつ
た。この不良品率は、現行の通常の不良品率より
格段に小さいものである。 The thus obtained three-layered laminate was cut and pasted together to create an envelope measuring 20cm x 20cm, and this envelope was used to package semiconductors on a MOS IC manufacturing line. , static electricity hazard,
The rate of defective ICs due to dust adhesion and physical shock was extremely low, averaging less than 0.01% per month. This defective product rate is much smaller than the current normal defective product rate.
実施例 ２
外面層３としてポリエチレンフイルムに代えて
坪量60ｇ／m2の紙を用いたほかは実施例１と同様
にして３層構成の積層物を得、封筒を作成した。Example 2 A three-layer laminate was obtained and an envelope was made in the same manner as in Example 1, except that paper with a basis weight of 60 g/m 2 was used as the outer layer 3 instead of the polyethylene film.
この封筒を用いてMOS型IC製造ラインにおけ
る半導体の包装に供したが、ICの不良品率は１
ケ月の平均で約0.01％と小さいものであつた。 This envelope was used to package semiconductors on a MOS IC manufacturing line, but the defective rate of ICs was 1.
The monthly average rate was small at about 0.01%.
第１図は、本発明のIC包装用袋における層配
列を示した斜視図であり、一部を切り欠き表示し
てある。
１…不織布、２…内面層、３…外面層。
FIG. 1 is a perspective view showing the layer arrangement in the IC packaging bag of the present invention, with a portion thereof being cut away. 1... Nonwoven fabric, 2... Inner layer, 3... Outer layer.
Claims (1)
属薄層を含有する非繊維系の内面層２を設け、他
面にはプラスチツク層または紙層よりなる外面層
３を設けた積層物の製袋物からなるIC包装用袋。1. A laminate in which a non-woven fabric 1 containing antistatic fibers is provided with a non-fibrous inner layer 2 containing a thin metal layer on one side, and an outer layer 3 made of a plastic layer or paper layer on the other side. IC packaging bags made of bag-made products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57047761A JPS58163649A (en) | 1982-03-24 | 1982-03-24 | Laminated structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57047761A JPS58163649A (en) | 1982-03-24 | 1982-03-24 | Laminated structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58163649A JPS58163649A (en) | 1983-09-28 |
| JPH0232981B2 true JPH0232981B2 (en) | 1990-07-24 |
Family
ID=12784348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57047761A Granted JPS58163649A (en) | 1982-03-24 | 1982-03-24 | Laminated structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58163649A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58169706A (en) * | 1982-03-30 | 1983-10-06 | 鍛治 静枝 | Conductive structure |
| JP2014168609A (en) * | 2013-03-05 | 2014-09-18 | Hitachi Systems Ltd | Electronic equipment package |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5241084A (en) * | 1975-09-27 | 1977-03-30 | Toray Industries | Container of composite material |
| JPS5634449A (en) * | 1979-08-30 | 1981-04-06 | Mitsubishi Rayon Co | Electromagnetic shielding material |
-
1982
- 1982-03-24 JP JP57047761A patent/JPS58163649A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5241084A (en) * | 1975-09-27 | 1977-03-30 | Toray Industries | Container of composite material |
| JPS5634449A (en) * | 1979-08-30 | 1981-04-06 | Mitsubishi Rayon Co | Electromagnetic shielding material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58163649A (en) | 1983-09-28 |
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