JPH0232508A - Resin molded coil - Google Patents
Resin molded coilInfo
- Publication number
- JPH0232508A JPH0232508A JP63181908A JP18190888A JPH0232508A JP H0232508 A JPH0232508 A JP H0232508A JP 63181908 A JP63181908 A JP 63181908A JP 18190888 A JP18190888 A JP 18190888A JP H0232508 A JPH0232508 A JP H0232508A
- Authority
- JP
- Japan
- Prior art keywords
- winding
- resin
- insulating layer
- molded coil
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 283
- 239000011347 resin Substances 0.000 title claims abstract description 283
- 238000004804 winding Methods 0.000 claims abstract description 205
- 239000000945 filler Substances 0.000 claims abstract description 46
- 239000007822 coupling agent Substances 0.000 claims abstract description 31
- 239000012212 insulator Substances 0.000 claims abstract description 29
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 23
- 230000002093 peripheral effect Effects 0.000 claims abstract description 22
- 239000011342 resin composition Substances 0.000 claims abstract description 18
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 16
- 239000004593 Epoxy Substances 0.000 claims abstract description 10
- 150000001875 compounds Chemical class 0.000 claims abstract description 10
- 238000002156 mixing Methods 0.000 claims abstract description 3
- 239000007788 liquid Substances 0.000 claims description 71
- 238000004519 manufacturing process Methods 0.000 claims description 29
- 230000000903 blocking effect Effects 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 19
- 229920001187 thermosetting polymer Polymers 0.000 claims description 15
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 11
- 229910000077 silane Inorganic materials 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000001035 drying Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 95
- 125000006850 spacer group Chemical group 0.000 description 25
- 238000005266 casting Methods 0.000 description 15
- 230000007423 decrease Effects 0.000 description 12
- 239000004020 conductor Substances 0.000 description 11
- 239000011229 interlayer Substances 0.000 description 11
- 238000009413 insulation Methods 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000009826 distribution Methods 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000004323 axial length Effects 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- IEKHISJGRIEHRE-UHFFFAOYSA-N 16-methylheptadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O IEKHISJGRIEHRE-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 241001092070 Eriobotrya Species 0.000 description 1
- 235000009008 Eriobotrya japonica Nutrition 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000010125 resin casting Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
- H01F41/127—Encapsulating or impregnating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/327—Encapsulating or impregnating
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Insulating Of Coils (AREA)
- Manufacture Of Motors, Generators (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はコイル等をモールドする樹脂、およびそれを用
いてモールドされたコイルに係り、良好な耐クラツク性
と良好な耐熱性と低粘度を同時に満足するのに好適な熱
硬化性樹脂組成物およびそれを用いた樹脂モールドコイ
ルに関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a resin for molding coils, etc., and a coil molded using the resin, and relates to a resin that has good crack resistance, good heat resistance, and low viscosity. The present invention also relates to a thermosetting resin composition suitable for satisfying the above requirements and a resin molded coil using the same.
従来、コイル等のモールドに用いられている樹脂は1例
としては特開昭53−123457号公報において提案
されているように無機充填材の粒径分布、最大粒径や平
均粒径の最適化を主眼に検討されてきた。しかし、この
方法は有機マトリックスレジンと無機充填材との界面現
象について配慮がされておらず、粘度低下、耐熱性向上
、耐クラツク性向上を全て満足することは不可能であっ
た。Conventionally, resins used in molds for coils, etc., have been optimized by optimizing the particle size distribution, maximum particle size, and average particle size of inorganic fillers, as proposed in Japanese Patent Application Laid-open No. 53-123457. has been mainly considered. However, this method does not take into consideration the interfacial phenomenon between the organic matrix resin and the inorganic filler, and it has been impossible to satisfy all of the requirements of reducing viscosity, improving heat resistance, and improving crack resistance.
また、特開昭61−113642号公報はシラン系カッ
プリング剤又はチタネート系カップリング剤の少なくと
もいずれか一方を直接無機充填材に処理したのち、有機
マトリックスレジンに添加することを示唆しているが、
これは充填材の疎水化を目的としたものであり、充填材
と樹脂とのぬれ性を向上させて、粘度低下、耐熱性向上
、耐クラツク性向上の全てを満足する樹脂組成物を得る
といる思想は何ら開示されていない6
また、従来の樹脂は熱伝導率の向上や線膨張係数を低下
させることによる耐クラツク性の向上のために充填材を
添加することが行われているが、充填材を添加すること
により樹脂の粘度が上がり、注型時に樹脂が巻線内に入
り難しくなるので特開昭55−138828号に示され
るように真空注型を行ったり、あるいは特開昭57−1
21207号に示されるように巻線内に樹脂を含浸させ
ない構成となっていた。Furthermore, JP-A-61-113642 suggests that at least one of a silane coupling agent or a titanate coupling agent is directly treated with an inorganic filler and then added to an organic matrix resin. ,
This is aimed at making the filler hydrophobic, and by improving the wettability between the filler and the resin, it is possible to obtain a resin composition that satisfies all of the following: viscosity reduction, heat resistance improvement, and crack resistance improvement. There is no disclosure of the idea behind this. 6 In addition, fillers are added to conventional resins to improve crack resistance by improving thermal conductivity and lowering the coefficient of linear expansion. Adding a filler increases the viscosity of the resin, making it difficult for the resin to enter the winding during casting. -1
As shown in No. 21207, the winding wire was not impregnated with resin.
また、樹脂の充填量を増加させるために充填材の粒度分
布を調整し、シランカップリング剤を配合して樹脂の粘
度を低下させたものとしては例えば特開昭62−224
009号が挙げられる。Furthermore, in order to increase the filling amount of the resin, the particle size distribution of the filler is adjusted and a silane coupling agent is added to reduce the viscosity of the resin.
No. 009 is mentioned.
なお、他の関連するものとして特公昭37−15553
号公報、特公昭40−13814号公報等が挙げられる
が、これらには大気圧中で樹脂を充填する思想が開示さ
れていない。In addition, other related items include the Special Publication No. 37-15553.
No. 40-13814, etc., but these do not disclose the idea of filling the resin at atmospheric pressure.
上記従来技術は樹脂の耐クラツク性向上、耐熱性向上、
および粘度低下とを同時に満足する点については配慮さ
れておらず、(1)樹脂の耐クラツク性向上のために多
量の充填材を入れると樹脂の粘度が上がるので、コイル
内部に樹脂を含浸する場合には真空注型が必要となり、
大掛がすな真空注型設何が必要になるとともに注型時に
コイル内に発生したボイドが真空ボイドとなるためコイ
ル内にコロナが発生しやすくなる。The above conventional technology improves the crack resistance and heat resistance of the resin.
No consideration was given to simultaneously satisfying the following requirements: (1) Adding a large amount of filler to improve crack resistance of the resin increases the viscosity of the resin, so it is necessary to impregnate the inside of the coil with resin. In some cases, vacuum casting is required,
Large-scale casting requires vacuum casting equipment, and the voids that occur inside the coil during casting become vacuum voids, making it easier for corona to occur inside the coil.
(2)コロナ発生防止のためコイル内部に樹脂を含浸し
ない構成にするとコイルの熱伝導が悪くなりコイルの温
度上昇が大きくなるという問題があった。(2) If the coil is not impregnated with resin in order to prevent corona generation, there is a problem in that the heat conduction of the coil becomes poor and the temperature of the coil increases.
また、樹脂の粘度を下げるためには、従来、シラン系の
カップリング剤が、充填材に対し重量比で、0.5〜2
%添加されている。In addition, in order to lower the viscosity of the resin, conventionally, a silane-based coupling agent has been used at a weight ratio of 0.5 to 2 to the filler.
% added.
このように、シラン系のカップリング剤を添加すると、
粘度はかなり低下する。しかし、添加量を増してもその
効果は少なくなり、ある程度以下には粘度は低下しない
。例えば充填材を60%(Vol、%)配合すると粘度
は、30〜5゜(p)であるが、カップリング剤を3%
(樹脂全体に対する重量部、即ち、充填材の重量に対し
約0.45%)以上添加すると、粘度は20 (P)程
度にまで低下する。しかし、これでは、まだ粘度が高<
、10 (P)以下とはならない。従って、充填材を6
0%(Vol、%)程度配合した樹脂に於いては、レジ
ン粘度を20(P)以下に下げることは、従来技術では
不可能であった。In this way, when a silane-based coupling agent is added,
The viscosity is significantly reduced. However, even if the amount added is increased, the effect decreases, and the viscosity does not decrease below a certain level. For example, when 60% (Vol, %) of filler is added, the viscosity is 30-5° (p), but when 3% of coupling agent is added, the viscosity is 30-5° (p).
If more than (part by weight based on the entire resin, that is, about 0.45% based on the weight of the filler) is added, the viscosity decreases to about 20 (P). However, with this, the viscosity is still high.
, 10 (P) or less. Therefore, the filler is 6
In the case of a resin containing approximately 0% (Vol, %), it was impossible to lower the resin viscosity to 20 (P) or less using conventional techniques.
本発明の目的は上記問題点に鑑み、耐熱性、耐クラック
性に優れるとともに、粘度が低い熱硬化性樹脂組成物お
よびそれを用いて大気中での注型が可能であり生産性、
耐熱性およびコロナ特性に優れた樹脂モールドコイルを
提供することにある。In view of the above-mentioned problems, the object of the present invention is to provide a thermosetting resin composition that has excellent heat resistance, crack resistance, and low viscosity, and that enables casting in the air using the same, thereby improving productivity and improving productivity.
The purpose of the present invention is to provide a resin molded coil with excellent heat resistance and corona characteristics.
上記目的は多官能エポキシ化合物、充填剤およびカップ
リング剤とを含む熱硬化性樹脂組成物に於いて、前記カ
ップリング剤として、シラン系カップリング剤およびチ
タネート系カップリング剤をそれぞれ前記充填材に対し
て所定の割合で配合することにより達成される。The above object is to provide a thermosetting resin composition containing a polyfunctional epoxy compound, a filler, and a coupling agent, in which a silane coupling agent and a titanate coupling agent are added to the filler as the coupling agent, respectively. This is achieved by blending them in a predetermined ratio.
また1本発明の目的は1巻線と、該巻線の内外周に形成
された内外周絶縁層と、前記巻線の軸方向端面に形成さ
れた端部絶縁層とを備えてなる樹脂モールドコイルにお
いて、前記内外周絶縁層。Another object of the present invention is to provide a resin mold comprising a winding, inner and outer insulating layers formed on the inner and outer peripheries of the winding, and end insulating layers formed on the axial end surfaces of the winding. In the coil, the inner and outer peripheral insulating layers.
前記端部絶縁層、および前記巻線の内部の少なくともい
ずれか一方を前記樹脂組成物により形成することにより
達成される。This is achieved by forming at least one of the end insulating layer and the inside of the winding from the resin composition.
熱硬化性樹脂組成物に配合されたシラン系カップリング
剤およびチタネート系カップリング剤はそれぞれ相乗作
用により多量の充填材が添加された熱硬化性樹脂組成物
の粘度を大幅に低下させる。The silane coupling agent and the titanate coupling agent blended into the thermosetting resin composition each have a synergistic effect to significantly reduce the viscosity of the thermosetting resin composition to which a large amount of filler has been added.
粘度の低い熱硬化性樹脂組成物は樹脂モールドコイルへ
の充填が容易であり、大気中での樹脂の注型を可能とす
る。A thermosetting resin composition with a low viscosity can be easily filled into a resin mold coil, and the resin can be cast in the atmosphere.
これによって樹脂モールドコイルの巻線部分にも多量の
充填剤が添加された樹脂を大気中で充填することができ
るので、樹脂の線膨張係数を導体の線膨張係数に近い値
まで低下させる。これによって樹脂の耐クラツク性を向
上させることができる。As a result, the winding portion of the resin molded coil can also be filled in the atmosphere with resin to which a large amount of filler has been added, thereby reducing the linear expansion coefficient of the resin to a value close to that of the conductor. This can improve the crack resistance of the resin.
また、シラン系カップリング剤とチタネート系カップリ
ング剤とは、充填材に対しそれぞれ所定の割合で混合さ
れる。これにより樹脂のガラス転移温度の下降を防止し
、樹脂の耐熱性を向上させることができる。Further, the silane coupling agent and the titanate coupling agent are mixed with the filler at predetermined ratios, respectively. This can prevent the glass transition temperature of the resin from decreasing and improve the heat resistance of the resin.
以下、本発明の実施例を第1図〜第43図により説明す
る。本発明の第1実施例を第1図〜第11図により説明
する。Embodiments of the present invention will be described below with reference to FIGS. 1 to 43. A first embodiment of the present invention will be described with reference to FIGS. 1 to 11.
第1図は本実施例の樹脂モールドコイル1の構成を示す
一部を断面とした斜視図である。このモールドコイル1
は、内外周をそれぞれプリプレグ絶縁物5a、6aでモ
ールドして内周絶縁層5、外周絶縁層6を形成し、コイ
ル内部には液状レジン9を巻線4の内部にも含浸注入し
た後過熱硬化することにより作られる。FIG. 1 is a partially sectional perspective view showing the structure of a resin molded coil 1 of this embodiment. This mold coil 1
The inner and outer circumferences are molded with prepreg insulators 5a and 6a, respectively, to form an inner circumferential insulating layer 5 and an outer circumferential insulating layer 6, and a liquid resin 9 is impregnated into the inside of the winding 4 and then heated. Made by hardening.
法は、第5図の如く巻線機8に樹脂の漏れ止め用フラン
ジ7aに密着するようにして巻回し、その上に巻線4を
巻回する。巻線4は第3図に示すように導体4aと層間
絶縁物4bとが交互に巻回される。巻線4の巻回後、更
にその上面にプリプレグ絶縁物6aを一方の端部がフラ
ンジ7aに密着するようにして巻回し、その後、巻線4
の乾燥とプリプレグ絶縁物5a、6aの硬化を行う。そ
の後、多官能エポキシ化合物に充填材を充填し、この充
填材に対しシラン系カップリング剤およびチタネート系
カップリング剤をそれぞれ所定の割合で配合して得られ
る低粘度で耐熱性、耐クラツク性に優れたレジン9を、
第6図に示すように、フランジ7aを下にしてプリプレ
グ絶縁物5a、6aで囲まれた空間および巻線4内の空
間に大気圧中で注入し、硬化後、巻心7を外して第7図
に示すような断面を有するモールドコイル1が得られ豪
巨
る。巻心7の軸と直交する方向の断面を燈形にしツー
ておくことにより、第2図に示すような短形のコ本実施
例における樹脂モールドコイルの製造方イルを得ること
ができる。モールドコイル内部にレジンの含浸性を高め
るためには粘度を10(P)(注入時の粘度で、温度は
約100℃)粘度にまで下げる必要がある。レジンの粘
度を下げる方法としては、充填材の配合量を減らせば良
いが、減らすと。As shown in FIG. 5, the resin is wound on a winding machine 8 so as to be in close contact with the resin leak-proofing flange 7a, and the winding wire 4 is wound thereon. As shown in FIG. 3, the winding 4 has a conductor 4a and an interlayer insulator 4b wound alternately. After winding the winding 4, a prepreg insulator 6a is further wound on the upper surface of the winding 4 so that one end is in close contact with the flange 7a, and then the winding 4 is wound.
and curing the prepreg insulators 5a and 6a. After that, a filler is filled into the polyfunctional epoxy compound, and a silane coupling agent and a titanate coupling agent are added to the filler in predetermined proportions to obtain a low-viscosity, heat-resistant, and crack-resistant product. Excellent resin 9,
As shown in FIG. 6, it is injected into the space surrounded by the prepreg insulators 5a and 6a and the space inside the winding 4 with the flange 7a facing down, and after curing, the core 7 is removed and the A molded coil 1 having a cross section as shown in FIG. 7 is obtained and is very large. By making the cross section of the winding core 7 orthogonal to the axis into a lamp shape, it is possible to obtain a rectangular resin molded coil in this embodiment as shown in FIG. In order to improve the impregnation of the resin inside the molded coil, it is necessary to lower the viscosity to 10 (P) (the viscosity at the time of injection, the temperature is about 100° C.). One way to lower the viscosity of the resin is to reduce the amount of filler added.
a、熱伝導率が低下する。a. Thermal conductivity decreases.
b、線膨張係数が大きくなり、耐クラツク性が低下する
。b. The coefficient of linear expansion increases and the crack resistance decreases.
C,レジンのコストが高くなる 等の問題が発生する。C. The cost of resin increases. Problems such as this occur.
また、レジンの注入を高真空下で行えば、レジンの含浸
性は改善されるが、レジン中に真空ボイドが形成される
。そのため、第10図に示す如く。Furthermore, if the resin is injected under high vacuum, the impregnating properties of the resin will be improved, but vacuum voids will be formed in the resin. Therefore, as shown in FIG.
ボイド中でのコロナ開始電圧が低下してコロナ特性は低
下するため、大気圧でレジンを注入し、レジンを十分に
含浸させることが望ましい。Since the corona initiation voltage in the void decreases and the corona characteristics deteriorate, it is desirable to inject the resin at atmospheric pressure and sufficiently impregnate the resin.
そのためには、レジン粘度を下げることが絶対に必要で
ある。For this purpose, it is absolutely necessary to lower the resin viscosity.
レジンの粘度を下げるにはカップリング剤が用いられる
。Coupling agents are used to reduce the viscosity of the resin.
カップリング剤には、シラン系やチタネート系等があり
、一般にはシラン系が使用されている。Coupling agents include silane type, titanate type, etc., and silane type is generally used.
しかし、第8図に示す如くこれには限界がある。However, as shown in FIG. 8, there is a limit to this.
具体的に述へると、レジンの粘度を下げるためには、従
来、シラン系のカップリング剤が、充填材に対し重量比
で、0.5〜2%添加されている。Specifically, in order to lower the viscosity of the resin, a silane coupling agent has conventionally been added in an amount of 0.5 to 2% by weight relative to the filler.
このように、シラン系のカップリング剤を添加すると、
第8図に示すように、粘度はかなり低下する。しかし、
添加量を増していくとその効果は飽和し、ある程度以下
には粘度は低下しない0例えば充填材を60%(Vol
、%)配合した場合、カップリング剤を添加しないと粘
度は、30〜50(P)であるが、カップリング剤を3
%(レジン全体に対する重量部、即ち、充填材の重量に
対し約0.45%)以上添加すると、粘度は20(P)
程度にまで低下する。そのため、シラン系の添加量は充
填材に対し0.3〜1.5%程度とするのが望ましい、
しかし、それでは、まだ粘度が高く、10(P)以下と
はならない、従って、充填材を60%(Vol、%)程
度配合したレジンに於いては、レジン粘度を20(P)
以下に下げることは、シラン系のカップリング剤単独で
は不可能である。In this way, when a silane-based coupling agent is added,
As shown in Figure 8, the viscosity decreases considerably. but,
As the amount added increases, the effect becomes saturated, and the viscosity does not decrease below a certain level.For example, if the filler is added to 60% (Vol.
,%), the viscosity is 30 to 50 (P) without the addition of a coupling agent, but when the coupling agent is added
% (part by weight based on the entire resin, that is, about 0.45% based on the weight of the filler), the viscosity will be 20 (P).
decreases to a certain extent. Therefore, it is desirable that the amount of silane added is about 0.3 to 1.5% based on the filler.
However, the viscosity is still high and cannot be lower than 10 (P). Therefore, in a resin containing about 60% (Vol, %) of filler, the resin viscosity should be reduced to 20 (P).
It is impossible to lower the temperature below using a silane-based coupling agent alone.
また、カップリング剤を増量すると、レジンの耐熱性は
低Fし、その目安であるTG(ガラス転移温度)は低下
する傾向にある。特に、チタネート系の場合、第9図に
示す如く大幅にTGが低下することが確認されている。Furthermore, when the amount of the coupling agent is increased, the heat resistance of the resin decreases, and the TG (glass transition temperature), which is a measure of the heat resistance, tends to decrease. In particular, in the case of titanate-based materials, it has been confirmed that the TG is significantly reduced as shown in FIG.
例えば、充填材に対しシラン系を0.45%(重量比)
加えたレジンに、充填材に対しチタネート系を重量比で
それぞれ0.075.0.15.0.6%(レジン全体
に対する重量部はそれぞれ0.5.1,4%)加えたレ
ジンの粘度を第8図に示すが、チタネート系の添加が粘
度低下に顕著な影響を与えている。しかし、チタネート
系を0゜15%以上増量しても、粘度低下の効果は飽和
し、一方ではTOが低下し耐熱性が大幅に低下する。For example, 0.45% (weight ratio) of silane based on the filler.
The viscosity of the resin in which 0.075, 0.15, and 0.6% of titanate based on the filler is added to the resin (weight ratio of 0.5.1 and 4%, respectively, based on the entire resin) As shown in FIG. 8, the addition of titanates has a significant effect on viscosity reduction. However, even if the amount of titanate is increased by 0.15% or more, the effect of reducing viscosity is saturated, while TO is reduced and heat resistance is significantly reduced.
そのためチタネート系の添加量は充填材に対し0005
〜0.3%程度とすることが望ましい、これらの結果を
まとめたものが第11図である。レジンAは本発明レジ
ンの一実施例である。レジンBは従来技術のレジンでシ
ラン系のカップリング剤を混合した場合、粘度は20(
P)と高ぐまたTGも120℃と低い。一方、レジンC
は、チタネート系のみを添加した場合であるが、レジン
粘度は9(P)と低いが、TGも低くなる難点がある。Therefore, the amount of titanate added is 0,005 to the filler.
It is desirable to set the content to about 0.3%. FIG. 11 shows a summary of these results. Resin A is an example of the resin of the present invention. Resin B is a conventional resin with a viscosity of 20 (
P) is high and TG is also low at 120°C. On the other hand, resin C
This is the case where only the titanate type is added, and although the resin viscosity is as low as 9 (P), there is a drawback that the TG is also low.
そこで、本実施例ではシラン系に加えてチタネート系を
少量添加することによりTGの大幅な低下を防止すると
ともにレジン粘度の大幅な低下を図るようにしたもので
ある。これにより本実施例ではTOを135℃とするこ
とができ、F積結縁の絶縁物として用いることができる
。Therefore, in this embodiment, a small amount of titanate is added in addition to the silane to prevent a significant decrease in TG and to significantly reduce the resin viscosity. As a result, in this embodiment, TO can be set to 135° C., and it can be used as an insulator for F product connections.
本実施例の熱硬化性樹脂組成物は、具体的に。The thermosetting resin composition of this example is specifically as follows.
エポキシ化合物としてビスフェノールA及びビスフェノ
ールFとエピクロルヒドリンとの反応によって得られる
ジグリシジルエーテルが、充填材として結晶性シリカが
、硬化剤として無水へキサヒドロフタル酸が、硬化促進
剤として2−エチル−4メチルイミダゾールが、シラン
系カップリング剤ビ
としてγ−グリシドキシプ口チルトリメトキシシランが
、チタネート系カップリング剤としてイソプロピルトリ
イソステアロイルチタネートがそれぞれ用いられる。Diglycidyl ether obtained by the reaction of bisphenol A and bisphenol F with epichlorohydrin as the epoxy compound, crystalline silica as the filler, hexahydrophthalic anhydride as the curing agent, and 2-ethyl-4 methyl as the curing accelerator. Imidazole is used as the silane coupling agent, γ-glycidoxypyltrimethoxysilane is used as the silane coupling agent, and isopropyl triisostearoyl titanate is used as the titanate coupling agent.
また、充填材は充填量を増してレジンの線膨張係数を巻
線導体の線膨張係数に近づくよう低下させるために、特
開昭62−224009号に記載されているように最大
粒径を80μm以下として。In addition, in order to increase the filling amount of the filler and lower the linear expansion coefficient of the resin to approach that of the wire-wound conductor, the maximum particle size of the filler was set to 80 μm as described in JP-A No. 62-224009. As below.
かつ、RR5粒度分布線図の傾きnが0.9以下となる
分布を持ったものが用いられ、60体積%充填される。In addition, particles having a distribution such that the slope n of the RR5 particle size distribution diagram is 0.9 or less are used, and the particles are filled at 60% by volume.
これによりレジンの線膨張係数を2゜4 X 10”
(K−”)まで低下させることができ導体として用いら
れるアルミの線膨張係数2.3×1O−5(K−”)に
近づけることができる。This reduces the linear expansion coefficient of the resin to 2゜4 x 10"
(K-''), and can approach the linear expansion coefficient of aluminum used as a conductor, 2.3×1O-5 (K-'').
本実施例によれば、レジンの粘度が低いため真空注型を
行わなくても樹脂モールドコイルの巻線内に大気圧中で
注型でき、巻線内にレジンを充填することができてコイ
ルの放熱特性を大幅に向上させることができる。According to this example, since the viscosity of the resin is low, it can be cast into the windings of a resin-molded coil at atmospheric pressure without vacuum casting, and the resin can be filled into the windings to form a coil. can significantly improve the heat dissipation characteristics of
そのため、モールドコイルが小形となり、コストの安い
モールド変圧器の製作が可能となる。Therefore, the molded coil becomes small, and it becomes possible to manufacture a molded transformer at low cost.
また、本実施例では、大気圧中でレジン9を注型するた
め、第4図に示すように巻線内にボイド9aが形成され
てもボイド9a内の圧力は・、はぼ大気圧となるため第
10図に示すようにコロナ開始電圧が高く、ボイド9a
部分における電界集中があってもコロナの発生を抑制す
ることができる。Furthermore, in this embodiment, since the resin 9 is cast under atmospheric pressure, even if a void 9a is formed in the winding as shown in FIG. Therefore, as shown in FIG. 10, the corona starting voltage is high and void 9a
Even if there is electric field concentration in a part, the generation of corona can be suppressed.
本発明の第2実施例を第12図に示す。A second embodiment of the invention is shown in FIG.
このモールドコイル20は、内外周をそれぞれプリプレ
グ絶縁物5a、6aでモールドして内周絶縁層5、外周
絶縁層6を形成し、下部には、高粘度のパテ状レジン1
4を充填し、上部から、低粘度の液状レジン9を巻線内
部に含浸注入した後加熱硬化することにより作られる。This molded coil 20 has inner and outer circumferences molded with prepreg insulators 5a and 6a, respectively, to form an inner circumferential insulating layer 5 and an outer circumferential insulating layer 6, and a high viscosity putty-like resin 1 is formed on the lower part.
4, a low viscosity liquid resin 9 is impregnated and injected into the inside of the winding wire from above, and then heated and cured.
本実施例におけるモールドコイルの製造方法は、第5図
の如く巻線機8に巻心7をセットし、この上面にプリプ
レグ絶縁物5aを巻回し、その上に巻a4を巻回する。In the method of manufacturing the molded coil in this embodiment, as shown in FIG. 5, a winding core 7 is set in a winding machine 8, a prepreg insulator 5a is wound on the upper surface of the winding core 7, and a winding a4 is wound on top of the winding core 7.
本実施例においても巻線4は、導体4aと層間絶縁物4
bとが交互に巻回される6巻線4の巻回後、更にその上
面にプリプレグ絶縁物6aを巻回し、その後、その一方
の端部に高粘度のパテ状レジン14を充填し、加熱して
巻線4の乾燥とプリプレグ絶縁物5a、6aおよびパテ
状レシン14の硬化を行う。その後巻心7を外してパテ
状レジン14が充填された方の端部を下にしてコイルを
置き、シラン系のカップリング剤とチタネート系のカッ
プリング剤をそれぞれ充填剤に対し所定の割合で配合し
て成る低粘度で耐熱性、耐クラツク性に優れたレジン9
(以下低粘度液状レジン9)を巻線4内に上方から大
気圧中で注入し、加熱硬化してモールドコイル20を得
る。Also in this embodiment, the winding 4 consists of a conductor 4a and an interlayer insulator 4.
After the six windings 4 are wound alternately, a prepreg insulator 6a is further wound on its upper surface, and one end of the prepreg insulator 6a is then filled with a high viscosity putty-like resin 14 and heated. Then, the winding 4 is dried and the prepreg insulators 5a, 6a and putty-like resin 14 are cured. After that, the winding core 7 is removed, the coil is placed with the end filled with the putty-like resin 14 facing down, and a silane-based coupling agent and a titanate-based coupling agent are applied at predetermined ratios to the filler. Resin 9 with low viscosity, excellent heat resistance, and crack resistance
(hereinafter referred to as low viscosity liquid resin 9) is injected into the winding 4 from above at atmospheric pressure and cured by heating to obtain the molded coil 20.
本実施例によれば、巻心7はフランジが不要であるため
、構造は簡単で安く作ることができ、さらに巻線4の径
方向の厚さに関係なく使用できるため、少量多品種の生
産に適している。According to this embodiment, since the winding core 7 does not require a flange, the structure is simple and can be manufactured at low cost.Furthermore, since it can be used regardless of the radial thickness of the winding 4, it is possible to produce a large variety of products in small quantities. suitable for
本発明の第3実施例を第13図により説明する。A third embodiment of the present invention will be described with reference to FIG.
本実施例は、巻線4の内部にのみ低粘度液状レジン9を
硬化させた樹脂層を形成したものである。In this embodiment, a resin layer made of hardened low-viscosity liquid resin 9 is formed only inside the winding 4.
本実施例ではコイル3oの内周絶縁層5.外周絶縁層6
はそれぞれ硬化されたプリプレグ5a。In this embodiment, the inner insulating layer 5. of the coil 3o. Outer insulating layer 6
are respectively cured prepregs 5a.
6aにより形成され、巻線4の軸方向の両端部の端部絶
縁層10はいずれも硬化されたパテ状レジン14により
形成される6巻g4は交互に巻回された導体および層間
紙とより成り、内部には低粘度液状レジン9が含浸注入
され硬化された樹脂層9が形成される。本実施例の樹脂
モールドコイルの製造方法は、低粘度液状レジン9を巻
線4内に大気圧中で注入するまでは第2実施例と同様で
あるが、低粘度液状レジン9の注入量を巻線4の上端ま
でとして、上側の端部絶縁層10にパテ状レジン14を
充填した後加熱硬化させ、モールドコイル30を得る。6a, and the end insulating layers 10 at both axial ends of the winding 4 are both formed of hardened putty-like resin 14.The 6th winding g4 is made of alternately wound conductors and interlayer paper. Then, a resin layer 9 is formed by impregnating and injecting a low-viscosity liquid resin 9 and hardening the resin layer 9 inside. The method for manufacturing the resin molded coil of this embodiment is the same as that of the second embodiment until the low viscosity liquid resin 9 is injected into the winding 4 at atmospheric pressure, but the injection amount of the low viscosity liquid resin 9 is The upper end insulating layer 10 is filled with a putty-like resin 14 up to the upper end of the winding 4, and then heated and cured to obtain a molded coil 30.
本発明の第4実施例を第14図、第15図により説明す
る。A fourth embodiment of the present invention will be described with reference to FIGS. 14 and 15.
本実施例における樹脂モールドコイル32は巻線4の内
部に低粘度液状レジン9による樹脂層9が形成され、外
周絶縁層6はプリプレグ6aにより形成され、内周絶縁
層5はプリプレグ5aおよび低粘度液状レジン9による
樹脂層9により形成され、端部絶縁層10は両端共パテ
状レジン14により形成される。In the resin molded coil 32 in this embodiment, a resin layer 9 made of a low-viscosity liquid resin 9 is formed inside the winding 4, an outer circumferential insulating layer 6 is formed of a prepreg 6a, and an inner circumferential insulating layer 5 is made of a prepreg 5a and a low-viscosity liquid resin 9. It is formed of a resin layer 9 made of liquid resin 9, and both ends of the end insulating layer 10 are formed of putty-like resin 14.
本実施例では内周側のプリプレグ5aと巻線4との間に
スペーサ32aを介在させて、プリプレグ5aと巻線4
との空隙に低粘度液状レジン9を注入して巻1%4の内
周側に低粘度液状レジン9による樹脂層を形成する。ス
ペーサ32aは注入されるレジンと同材質のものが望ま
しく、本実施例では低粘度液状レジン9を硬化させてス
ペーサ32aを形成する。In this embodiment, a spacer 32a is interposed between the prepreg 5a on the inner circumferential side and the winding 4, and the prepreg 5a and the winding 4 are
A low viscosity liquid resin 9 is injected into the gap between the two to form a resin layer of the low viscosity liquid resin 9 on the inner peripheral side of the 1% volume 4. The spacer 32a is preferably made of the same material as the resin to be injected, and in this embodiment, the spacer 32a is formed by hardening the low viscosity liquid resin 9.
本実施例におけるモールドコイル32の製造方法は、巻
線機8(図示せず)に巻心7(図示せず)をセットし、
巻心7上に内周のプリプレグ5aを巻回してその上にス
ペーサ32aを介して巻線4を巻回する1巻線4は導体
4aと層間絶縁物4bとが交互に巻回される。スペーサ
32aの長さは、プリプレグ5aの軸方向の長さ以下で
1巻線4の軸方向の長さ以上であることが望ましい。第
15図はスペーサ32aの長さをプリプレグ5aの軸方
向の長さと等しくした場合を示す。The method for manufacturing the molded coil 32 in this embodiment includes setting the winding core 7 (not shown) in a winding machine 8 (not shown),
One winding 4, in which the inner prepreg 5a is wound around the winding core 7 and the winding 4 is wound thereon with a spacer 32a interposed therebetween, a conductor 4a and an interlayer insulator 4b are alternately wound. The length of the spacer 32a is desirably less than or equal to the axial length of the prepreg 5a and greater than or equal to the axial length of one winding 4. FIG. 15 shows a case where the length of the spacer 32a is made equal to the length of the prepreg 5a in the axial direction.
巻II&4の巻回後1巻線4の外周にプリプレグ6aを
巻回して外周絶、a層6を形成する0次に一方の端部に
パテ状レジン14を充填して巻心ごと加熱硬化して巻!
!4の乾燥とプリプレグ5a、6aおよびパテ状レジン
14の硬化を行う。その後巻心7を外してパテ状レジン
14が充填された方の端部を下にしてコイルを置き、低
粘度液状レジン9を巻線4内およびスペーサ32aによ
り形成されたプリプレグ5aと巻線4との空隙内に大気
圧中で注入する。次に上側の端面をパテ状レジン14で
塞ぎ、加熱硬化させることにより樹脂モールドコイル3
2を得る。After winding of windings II & 4, the prepreg 6a is wound around the outer periphery of the first winding 4 to separate the outer periphery and form the A layer 6.Next, one end is filled with a putty-like resin 14 and the core is heated and hardened. Temaki!
! Step 4 is dried and the prepregs 5a, 6a and putty-like resin 14 are cured. Thereafter, the winding core 7 is removed and the coil is placed with the end filled with the putty-like resin 14 facing down, and a low viscosity liquid resin 9 is applied inside the winding 4 and between the prepreg 5a formed by the spacer 32a and the winding 4. Inject at atmospheric pressure into the gap between the Next, the upper end face is covered with a putty-like resin 14, and the resin molded coil 3 is heated and hardened.
Get 2.
本実施例では樹脂モールドコイル32の内周側の絶縁層
の厚みが増加し1巻心7を抜いた後の空間に嵌挿される
鉄心との間の絶縁強度を高めることができる。In this embodiment, the thickness of the insulating layer on the inner peripheral side of the resin molded coil 32 is increased, so that the insulation strength between it and the iron core inserted into the space after the first turn core 7 is removed can be increased.
本発明の第5実施例を第16図、第17図により説明す
る。A fifth embodiment of the present invention will be explained with reference to FIGS. 16 and 17.
本実施例における樹脂モールドコイル34は巻線4の内
部に低粘度液状レジン9による樹脂層9が形成され、内
周絶縁層5はプリプレグ5aにより形成され、外周絶縁
層6はプリプレグ6aおよび低粘度液状レジン9による
樹脂層9により形成され、端部絶縁層10は両端共パテ
状レジン14により形成される。In the resin molded coil 34 in this embodiment, a resin layer 9 made of a low-viscosity liquid resin 9 is formed inside the winding 4, an inner circumferential insulating layer 5 is formed of a prepreg 5a, and an outer circumferential insulating layer 6 is made of a prepreg 6a and a low-viscosity liquid resin. It is formed of a resin layer 9 made of liquid resin 9, and both ends of the end insulating layer 10 are formed of putty-like resin 14.
本実施例では外周側のプリプレグ6aと巻$4との間に
スペーサ34aを介在させ、プリプレグ6aと巻線4と
の空隙に低粘度液状レジン9を注入して巻線4aの外周
側に低粘度液状レジン9による樹脂層を形成する。スペ
ーサ34aは注入されるレジンと同材質のものが望まし
く、本実施例では低粘度液状レジン9を硬化させてスペ
ーサ34aを形成する。In this embodiment, a spacer 34a is interposed between the prepreg 6a on the outer circumference side and the winding wire 4, and a low-viscosity liquid resin 9 is injected into the gap between the prepreg 6a and the winding wire 4 to create a low-viscosity liquid resin on the outer circumference side of the winding wire 4a. A resin layer of viscous liquid resin 9 is formed. The spacer 34a is preferably made of the same material as the resin to be injected, and in this embodiment, the spacer 34a is formed by hardening the low viscosity liquid resin 9.
本実施例におけるモールドコイル34の製造方法は、巻
線機8(図示せず)に巻心7(図示せず)をセットし、
巻心7上に内周のプリプレグ5aを巻回してその上に巻
線4を巻回する。巻線4は導体4aを層間絶縁物4bと
が交互に巻回される6巻線4の巻回後、巻線4の外周に
スペーサ34aを介してプリプレグ6aを巻回する。ス
ペーサ34aの長さは、プリプレグ6aの軸方向の長さ
以下で1巻線4の軸方向の長さ以上であることが望まし
い、第17図はスペーサ34aの長さを巻線4の軸方向
の長さと等しくした場合を示す。The method for manufacturing the molded coil 34 in this embodiment includes setting the winding core 7 (not shown) in a winding machine 8 (not shown),
The inner prepreg 5a is wound on the winding core 7, and the winding 4 is wound thereon. After six windings 4 are wound, in which a conductor 4a and an interlayer insulator 4b are alternately wound, a prepreg 6a is wound around the outer periphery of the winding 4 via a spacer 34a. It is desirable that the length of the spacer 34a is less than or equal to the length of the prepreg 6a in the axial direction and greater than or equal to the length of one winding 4 in the axial direction. The case where it is made equal to the length of is shown.
次に一方の端部にパテ状レジン14を充填して巻心ごと
加熱硬化して巻線4の乾燥とプリプレグ5a、6aおよ
びパテ状レジン14の硬化を行う。Next, one end is filled with a putty-like resin 14 and heated and cured together with the winding core to dry the winding 4 and harden the prepregs 5a, 6a and the putty-like resin 14.
その後巻心7を外してパテ状レジン14が充填された方
の端部を下にしてコイルを置き、低粘度液状レジン9を
巻線4内およびスペーサ34aにより形成されたプリプ
レグ6aと巻線4との空隙内に大気圧中で注入する1次
に上側の端面をパテ状レジン14で塞ぎ、加熱硬化させ
ることにより、樹脂モールドコイル34を得る。Thereafter, the winding core 7 is removed and the coil is placed with the end filled with the putty-like resin 14 facing down, and a low viscosity liquid resin 9 is applied inside the winding 4 and between the prepreg 6a formed by the spacer 34a and the winding 4. A resin-molded coil 34 is obtained by filling the upper end face of the primary resin 14 with a putty-like resin 14, which is injected into the gap between the primary coil and the resin under atmospheric pressure, and hardening it by heating.
本実施例では樹脂モールドコイル34の外周側の絶縁層
の厚みが増加し、コイル外周側の絶縁強度を向上させる
ことができて、絶縁性および安全性に優れた樹脂モール
ドコイルを得ることができる。In this embodiment, the thickness of the insulating layer on the outer circumferential side of the resin molded coil 34 is increased, and the insulation strength on the outer circumferential side of the coil can be improved, making it possible to obtain a resin molded coil with excellent insulation properties and safety. .
本発明の第6実施例を第18図により説明する。A sixth embodiment of the present invention will be described with reference to FIG.
本実施例は巻線4の内部に低粘度液状レジン9による樹
脂M9を形成し、内周絶縁層5をプリプレグ5aおよび
低粘度液状レジン9による樹脂層で形成するとともに外
周絶縁層6をプリプレグ6aおよび低粘度液状レジン9
による樹脂層で形成し、さらに端部絶縁層10を両方共
パテ状レジン14により形成して樹脂モールドコイル3
6を得るものである。In this embodiment, a resin M9 made of a low viscosity liquid resin 9 is formed inside the winding 4, an inner circumferential insulating layer 5 is formed of a prepreg 5a and a resin layer made of a low viscosity liquid resin 9, and an outer circumferential insulating layer 6 is made of a prepreg 6a. and low viscosity liquid resin 9
The resin molded coil 3
6.
本実施例では内周側のプリプレグ5と巻線4との間、お
よび外周側のプリプレグ6aと巻線4との間にスペーサ
(図示せず)を介在させることにより、巻線4とプリプ
レグ5a、6a間に低粘度液状レジン9を注入する空隙
を形成する。In this embodiment, by interposing spacers (not shown) between the inner prepreg 5 and the winding 4 and between the outer prepreg 6a and the winding 4, the winding 4 and the prepreg 5a , 6a to form a gap into which a low-viscosity liquid resin 9 is injected.
本実施例における樹脂モールドコイル36の製造方法は
第4実施例、第5実施例における樹脂モールドコイルの
製造方法を組合わせたものである。The method for manufacturing the resin molded coil 36 in this embodiment is a combination of the methods for manufacturing the resin molded coil in the fourth and fifth embodiments.
本実施例におけるモールドコイル36の製造方法は、巻
線機8(図示せず)に巻心7(図示せず)をセットし、
巻心7上に内周のプリプレグ5aを巻回してその上にス
ペーサ(図示せず)を介して巻線4を巻回する1巻線4
は導体4aと層間絶縁物4bとが交互に巻回される0巻
線4の巻回後、巻線4の外周にスペーサ(図示せず)を
介してプリプレグ6aを巻回する。The method for manufacturing the molded coil 36 in this embodiment includes setting the winding core 7 (not shown) in a winding machine 8 (not shown),
1 winding 4, in which an inner prepreg 5a is wound around the winding core 7, and the winding 4 is wound thereon through a spacer (not shown);
After winding a zero winding 4 in which a conductor 4a and an interlayer insulator 4b are alternately wound, a prepreg 6a is wound around the outer periphery of the winding 4 via a spacer (not shown).
次に一方の端部にパテ状レジン14を充填して巻心ごと
加熱硬化して巻線4の乾燥とプリプレグ5a、6a、お
よびパテ状レジン14の硬化を行う、その後巻心7を外
してパテ状レジン14が充填された方の端部を下にして
コイルを置き、低粘度液状レジン9を巻線4内およびス
ペーサにより形成されたプリプレグ5a、6aと巻!4
との空隙内に大気圧中で注入する。次に上側の端面をパ
テ状レジン14で塞ぎ、加熱硬化させることにより。Next, one end is filled with putty-like resin 14 and heated and cured together with the winding core to dry the winding 4 and harden the prepregs 5a, 6a and putty-like resin 14.Then, the winding core 7 is removed. Place the coil with the end filled with the putty-like resin 14 facing down, and wrap the low-viscosity liquid resin 9 inside the winding 4 and around the prepregs 5a and 6a formed by the spacer! 4
Inject at atmospheric pressure into the gap between the Next, the upper end surface is covered with putty-like resin 14 and heated to harden.
樹脂モールドコイル36を得る。A resin molded coil 36 is obtained.
本実施例によれば、コイル内外周の絶縁強度および機械
的強度を向上させることができ、絶縁性および信頼性に
優れた樹脂モールドコイルを得ることができる。According to this example, the insulation strength and mechanical strength of the inner and outer circumferences of the coil can be improved, and a resin molded coil with excellent insulation properties and reliability can be obtained.
本発明の第7実施例、第8実施例、第9実施例をそれぞ
れ第19図、第20図、第21図により説明する。A seventh embodiment, an eighth embodiment, and a ninth embodiment of the present invention will be explained with reference to FIGS. 19, 20, and 21, respectively.
これら実施例はそれぞれ第4実施例、第5実施例、第6
実施例の変形例で、上側の端部絶縁層をパテ状レジン1
4の代わりに低粘度液状レジン9としたものである。These embodiments are the fourth embodiment, the fifth embodiment, and the sixth embodiment, respectively.
In a modification of the embodiment, the upper end insulating layer is made of putty-like resin 1.
4 was replaced with low viscosity liquid resin 9.
これらの実施例の樹脂モールドコイルの製造方法はそれ
ぞれ第4実施例、第5実施例、第6実施例の工程から上
端面のパテ状樹脂充填工程を除いたものである。これら
の実施例ではパテ状樹脂14の代わりに大気圧中で低粘
度液状レジン9を巻線4内に注入した後、引続いて巻線
4の上端面を所定の厚さで覆うまで注入し、その後加熱
硬化してそれぞれ樹脂モールドコイル38.40.42
を得るものである。これらの実施例によれば、上端面の
パテ状レジン塗込作業を行わずに済み、作業工数が低減
される。The methods of manufacturing the resin molded coils of these Examples are the same as those of the fourth, fifth, and sixth examples except that the step of filling the upper end surface with a putty-like resin is removed. In these embodiments, instead of the putty-like resin 14, a low-viscosity liquid resin 9 is injected into the winding 4 at atmospheric pressure, and then injected until the upper end surface of the winding 4 is covered with a predetermined thickness. , then heated and cured to form resin molded coils 38, 40, 42 respectively.
This is what you get. According to these embodiments, it is not necessary to apply putty-like resin to the upper end surface, and the number of work steps is reduced.
本発明の第10実施例を第22図により説明する。A tenth embodiment of the present invention will be described with reference to FIG. 22.
本実施例は第9実施例の変形例で上下両端部を低粘度液
状レジン9としたものである1本実施例におけるモール
ドコイルの製造方法は第6実施例の製造方法と第1実施
例の製造方法とを組合わせたものである。すなわち、本
実施例におけるモールドコイル44の製造方法は1巻線
機8(図示せず)に樹脂の漏れ止め用フランジ7aを有
する巻心7(図示せず)をセットし、巻心7上に内周の
プリプレグ5aを一方の端部がフランジ7aに密着する
ようにして巻回して、その上にスペーサ(図示せず)を
介して巻線4を巻回する。巻線4は導体4aと層間絶縁
物4bとが交互に巻回される。巻線4の巻回後、巻線4
の外周にスペーサ(図示せず)を介してプリプレグ6a
を巻回する。This example is a modification of the ninth example, in which both the upper and lower ends are made of low-viscosity liquid resin 9.1 The method for manufacturing the molded coil in this example is the manufacturing method of the sixth example and the manufacturing method of the first example. This is a combination of manufacturing methods. That is, the method for manufacturing the molded coil 44 in this embodiment is to set a winding core 7 (not shown) having a resin leak-proofing flange 7a in a winding machine 8 (not shown), and then place the winding core 7 on the winding core 7. The inner prepreg 5a is wound so that one end is in close contact with the flange 7a, and the winding 4 is wound thereon with a spacer (not shown) interposed therebetween. In the winding 4, a conductor 4a and an interlayer insulator 4b are alternately wound. After winding of winding 4, winding 4
A prepreg 6a is attached to the outer periphery of the prepreg 6a via a spacer (not shown).
wind it.
プリプレグ6aは一方の端部がフランジ7aに密着する
ようにして巻回される。プリプレグ6aの巻回後1巻線
4の乾燥とプリプレグ5a、6aの硬化を行う、その後
、フランジ7aを下にしてプリプレグ5a、6aで囲ま
れた空間、巻線4とプリプレグ5a、6aとの間のスペ
ーサにより形成された空間、および巻線4内の空間に低
粘度液状レジン9を大気圧中で注入し、硬化後巻心7を
外してモールドコイル44を得る。本実施例では内周絶
縁層5はプリプレグ5aと樹脂層9とにより形成され、
外周絶aNJ6はプリプレグ6aと樹脂層9とにより形
成される。The prepreg 6a is wound so that one end is in close contact with the flange 7a. After winding the prepreg 6a, the first winding 4 is dried and the prepregs 5a and 6a are cured.Then, with the flange 7a facing down, the space surrounded by the prepregs 5a and 6a, and the space between the winding 4 and the prepregs 5a and 6a are A low viscosity liquid resin 9 is injected at atmospheric pressure into the space formed by the spacer between them and the space inside the winding 4, and after curing, the winding core 7 is removed to obtain a molded coil 44. In this embodiment, the inner peripheral insulating layer 5 is formed of a prepreg 5a and a resin layer 9,
The outer circumference aNJ6 is formed by the prepreg 6a and the resin layer 9.
以上の第7実施例から第10実施例によれば。According to the seventh to tenth embodiments described above.
モールドコイルの端面および巻線4の内外周の少なくと
もいずれか一方に低粘度液状レジン9の層が設けられて
いるので、気密性、防水性に優れた樹脂の層が巻線の表
面に設けられることになりモールドコイルの耐候性が向
上する。Since a layer of low viscosity liquid resin 9 is provided on the end face of the molded coil and at least one of the inner and outer circumferences of the winding 4, a resin layer with excellent airtightness and waterproof properties is provided on the surface of the winding. This improves the weather resistance of the molded coil.
また、第7実施例〜第9実施例は端部絶縁層の一方がパ
テ状レジン14であるが、第10実施例と同様に上下端
共低粘度液状レジン9としてもよい。これによれば、耐
候性をさらに増すことができる。Further, in the seventh to ninth embodiments, one of the end insulating layers is made of putty-like resin 14, but similarly to the tenth embodiment, both the upper and lower ends may be made of low-viscosity liquid resin 9. According to this, weather resistance can be further increased.
本発明の第11実施例を第23図により説明する。An eleventh embodiment of the present invention will be described with reference to FIG.
本実施例は巻線4の上下端面に低粘度液状レジン9の浸
入を阻止する阻止層16を設け1巻線4の内部を空気層
18としたものである。In this embodiment, a blocking layer 16 for preventing the low-viscosity liquid resin 9 from entering is provided on the upper and lower end surfaces of the winding 4, and an air layer 18 is formed inside each winding 4.
本実施例では、内周絶縁層5および外周絶縁層6がそれ
ぞれプリプレグ5a、6aで形成され、巻線4の両端部
にはパテ状レジン14により形成された阻止層16が形
成される。低粘度液状レジン9は阻止層16とプリプレ
グ5a、6aとで囲まれた空間に注入されて硬化される
。In this embodiment, the inner circumferential insulating layer 5 and the outer circumferential insulating layer 6 are formed of prepregs 5a and 6a, respectively, and blocking layers 16 made of putty-like resin 14 are formed at both ends of the winding 4. The low viscosity liquid resin 9 is injected into the space surrounded by the blocking layer 16 and the prepregs 5a, 6a and hardened.
本実施例におけるモールドコイル50の製造方法は、第
2実施例のモールドコイルの製造方法と外周絶B層のプ
リプレグ6aを巻回するまでは同じである。プリプレグ
6aの巻回後、巻線4の両端面にパテ状樹脂14を低粘
度液状レジンの浸透を阻止するのに充分な厚さだけ充填
する。この作業は大気圧中で行われ1巻線4内の空気層
18はその圧力が大気圧に保たれる。The method for manufacturing the molded coil 50 in this embodiment is the same as the method for manufacturing the molded coil in the second embodiment up to the winding of the prepreg 6a of the periphery B layer. After winding the prepreg 6a, both end faces of the winding 4 are filled with putty-like resin 14 to a thickness sufficient to prevent penetration of the low-viscosity liquid resin. This operation is performed at atmospheric pressure, and the pressure of the air layer 18 within one winding 4 is maintained at atmospheric pressure.
次に、プリプレグ5.6aおよびパテ状樹脂14を加熱
硬化させて内外周の絶縁層5.6および阻止層16を形
成する。その後巻心7を外してコイルの一方の端部を上
に向けて置き、プリプレグ5a、6aおよび阻止層16
とで囲まれた空間に低粘度液状レジン9を注入し硬化さ
せる0次に、コイルを上下反転し、他方の端部のプリプ
レグ5a、6aおよび阻止層16とで囲まれた空間に低
粘度液状レジン9を注入して硬化させる。これによりモ
ールドコイル50を得ることができ・る。Next, the prepreg 5.6a and the putty-like resin 14 are heated and cured to form the inner and outer peripheral insulating layers 5.6 and the blocking layer 16. After that, the winding core 7 is removed and the coil is placed with one end facing upward, and the prepregs 5a, 6a and the blocking layer 16
A low viscosity liquid resin 9 is injected into the space surrounded by and cured.Next, the coil is turned upside down and a low viscosity liquid resin 9 is injected into the space surrounded by the prepregs 5a, 6a at the other end and the blocking layer 16. The resin 9 is injected and hardened. As a result, a molded coil 50 can be obtained.
本実施例のモールドコイル50は巻線4内が空気層であ
るので1重量を計量化することができる。Since the molded coil 50 of this embodiment has an air layer inside the winding 4, one weight can be measured.
本発明の第12実施例〜第14実施例をそれぞれ第24
図〜第26図により説明する。これらの実施例は第4実
施例〜第6実施例のモールドコイルの巻線4の内部を樹
脂層9の代わりに空気層18としたものである。The twelfth to fourteenth embodiments of the present invention are respectively referred to as the 24th embodiment.
This will be explained with reference to FIGS. In these embodiments, an air layer 18 is used instead of the resin layer 9 inside the winding 4 of the molded coil of the fourth to sixth embodiments.
これらの実施例においては巻線内が空気層であるため、
モールドコイルを計量化することができる。また、内外
周に低粘度液状レジンの層が設けられるので内外周の絶
縁強度を向上させることができる。これらの実施例にお
いて巻線4の内外周または外周側に設けられる阻止M1
7は巻線4の層間絶縁物4bにより構成される6巻線4
の上下端面にはパテ状樹脂14が充填されるので、これ
らの面には阻止層を形成しなくてもよい、これらの実施
例におけるモールドコイルの製造方法は。In these examples, since there is an air layer inside the winding,
Molded coils can be quantified. Furthermore, since a layer of low-viscosity liquid resin is provided on the inner and outer peripheries, the insulation strength of the inner and outer peripheries can be improved. In these embodiments, the blocking M1 provided on the inner and outer peripheries or the outer periphery of the winding 4
7 is a 6-winding wire 4 composed of an interlayer insulator 4b of the winding wire 4;
Since the upper and lower end surfaces of the molded coil are filled with the putty-like resin 14, there is no need to form a blocking layer on these surfaces.
巻g4内に低粘度液状レジンを注入しないこと以外は、
それぞれ第4実施例〜第6実施例と同様である。Except for not injecting low viscosity liquid resin into volume g4,
They are the same as the fourth to sixth embodiments, respectively.
本発明の第15実施例〜第17実施例を第27図〜第2
9図により説明する。The 15th to 17th embodiments of the present invention are shown in Figures 27 to 2.
This will be explained with reference to FIG.
これらの実施例はそれぞれ第12実施例〜第14実施例
であり、上端面の端部絶縁層も低粘度液状レジン9によ
り形成するようにしたものである。These embodiments are the twelfth embodiment to the fourteenth embodiment, respectively, in which the end insulating layer on the upper end surface is also formed of a low-viscosity liquid resin 9.
これらの実施例においては1巻線4の上端面にパテ状レ
ジン14による阻止層16が設けられ、巻線4内への低
粘度液状レジン9の浸入を防止する。In these embodiments, a blocking layer 16 made of putty-like resin 14 is provided on the upper end surface of one winding 4 to prevent low-viscosity liquid resin 9 from penetrating into the winding 4 .
巻線4の内周または外周では1巻回された層間絶縁物4
bが阻止層17として機能する。これらの実施例により
それぞれ得られるモールドコイル58.60.62の製
造方法はそれぞれ第4実施例〜第6実施例の製造方法と
下側の端部絶縁層10にパテ状レジン14を充填し加熱
硬化させる工程までは同様である。第15実施例〜第1
7実施例では、いずれもこの後、巻[4の上端部にパテ
状レジン14が低粘度液状レジン9の浸入を阻止するの
に十分な厚さだけ充填され、阻止層16が形成される1
次に、巻wA4と内周のプリプレグ5aまたは外周のプ
リプレグ6aとの間のスペーサにより形成された空間に
低粘度液状レジン9を注入し、引続いて阻止層16の上
方のプリプレグ5a。One turn of interlayer insulator 4 on the inner or outer circumference of the winding 4
b functions as the blocking layer 17. The manufacturing methods of the molded coils 58, 60, and 62 obtained by these examples are the manufacturing methods of the fourth to sixth examples, respectively, and the lower end insulating layer 10 is filled with putty-like resin 14 and heated. The steps up to the curing step are the same. 15th example - 1st
In all of the 7 embodiments, after this, the putty-like resin 14 is filled at the upper end of the volume 4 to a thickness sufficient to prevent the low-viscosity liquid resin 9 from penetrating, forming a blocking layer 16.
Next, low viscosity liquid resin 9 is injected into the space formed by the spacer between the volume wA4 and the inner prepreg 5a or the outer prepreg 6a, and then the prepreg 5a above the blocking layer 16 is injected.
6aで囲まれた空間にも低粘度液状レジン9を注入する
。低粘度液状レジン9は、プリプレグ5a。Low viscosity liquid resin 9 is also injected into the space surrounded by 6a. The low viscosity liquid resin 9 is a prepreg 5a.
6a周縁部に達するまで注入される0巻線4の内外周面
には巻回された層間絶縁物4bが阻止層17として機能
するので巻線4内へは低粘度液状レジン9は浸入しない
、また、この作業は大気圧中で行われ、巻線4内部は大
気圧と等しい圧力の空気層となる0次に、低粘度液状レ
ジン9を加熱硬化させ、巻線4の上端面および、内周ま
たは外周に低粘度液状レジン9の樹脂層を形成し、それ
ぞれモールドコイル58.60.62を得る。これらの
実施例によれば、耐候性の向上および放熱性の向上を図
ることができる。Since the interlayer insulating material 4b wound on the inner and outer circumferential surfaces of the zero winding 4, which is injected until it reaches the peripheral edge 6a, functions as a blocking layer 17, the low viscosity liquid resin 9 does not penetrate into the winding 4. This work is carried out at atmospheric pressure, and the inside of the winding 4 has an air layer with a pressure equal to the atmospheric pressure. Next, the low viscosity liquid resin 9 is heated and hardened, and the upper end surface of the winding 4 and the inside of the winding 4 are A resin layer of low viscosity liquid resin 9 is formed on the periphery or outer periphery to obtain molded coils 58, 60, and 62, respectively. According to these examples, it is possible to improve weather resistance and heat dissipation.
本発明の第18実施例を第30図により説明する。An 18th embodiment of the present invention will be described with reference to FIG.
本実施例は第17実施例の変形例で巻、I!4の上下両
端面にパテ状レジン14により阻止層16を形成し、モ
ールドコイルの上下面端部に低粘度液状レジン9による
樹脂層を形成したものである。This embodiment is a modification of the 17th embodiment. A blocking layer 16 is formed on both the upper and lower end surfaces of the molded coil using a putty-like resin 14, and a resin layer using a low-viscosity liquid resin 9 is formed on the upper and lower ends of the molded coil.
本実施例におけるモールドコイル64の製造方法は巻線
4の外周にスペーサを介してプリプレグ6aを巻回する
までは第6実施例と同様である0本実施例では、次に巻
線4の上下両端部にパテ状レジン14を低粘度液状レジ
ンの浸入を防ぐのに十分な厚さだけ充填する。次に、モ
ールドコイル64の下端面を塞いで上側の端面から低粘
度液状レジン9を注入する。下端面を塞ぐには、1例と
して巻心7にフランジ7aを着脱自在に設けておき、低
粘度液状レジン9の注入前にフランジ7aを内外周のプ
リプレグ5a、6aの下端と密着するように取り付けて
もよい。注入された低粘度液状レジン9は巻線4の内周
とプリプレグ5aおよび巻線4の外周とプリプレグ6a
との間にスペーサにより形成された空隙を介して下方に
流れ、フランジ7aとプリプレグ5a、6aとで形成さ
れた空間、および、巻線4の内外周とプリプレグ5a。The manufacturing method of the molded coil 64 in this embodiment is the same as that in the sixth embodiment until the prepreg 6a is wound around the outer periphery of the winding 4 via a spacer. Both ends are filled with putty-like resin 14 to a thickness sufficient to prevent infiltration of the low-viscosity liquid resin. Next, the lower end surface of the molded coil 64 is closed, and low viscosity liquid resin 9 is injected from the upper end surface. In order to close the lower end surface, for example, a flange 7a is detachably provided on the winding core 7, and the flange 7a is brought into close contact with the lower ends of the prepregs 5a and 6a on the inner and outer peripheries before the low viscosity liquid resin 9 is injected. May be attached. The injected low-viscosity liquid resin 9 is applied to the inner periphery of the winding 4 and the prepreg 5a, and the outer periphery of the winding 4 and the prepreg 6a.
and the space formed by the flange 7a and the prepregs 5a, 6a, and the inner and outer peripheries of the winding 4 and the prepregs 5a.
6aとの間にそれぞれスペーサにより形成された空間に
充填され、引続いて巻線4の上端の阻止層16と内外周
のプリプレグ5 a H6aとで囲まれた空間に充填さ
れる。低粘度液状レジン9は内外周のプリプレグ5a、
6aの周縁部と同じ高さまで注入される0次に、低粘度
液状レジン9を加熱硬化させてモールドコイル64を得
る1本実施例によれば1巻a4の全周に低粘度液状レジ
ン9の樹脂層が形成されるので、さらに耐候性、放熱性
を向上させることができる。6a, and then filled in the space surrounded by the blocking layer 16 at the upper end of the winding 4 and the inner and outer prepregs 5a, H6a. The low viscosity liquid resin 9 is prepreg 5a on the inner and outer peripheries,
Next, the low viscosity liquid resin 9 is heated and hardened to obtain the molded coil 64. According to this embodiment, the low viscosity liquid resin 9 is poured around the entire circumference of the first roll a4. Since a resin layer is formed, weather resistance and heat dissipation properties can be further improved.
なお、以上の実施例において、口出線2.3が設けられ
た側の端面を上側としたが、これに限ることなく、口出
s2,3が設けられた側の端面と反対側の端面を上側と
してもよい。In the above embodiments, the end face on the side where the outlet lines 2.3 are provided is set as the upper side, but the end face on the opposite side to the end face on the side where the outlet lines s2 and 3 are provided is not limited to this. may be on the upper side.
本発明の第19実施例を第31図、第32図により説明
する。A nineteenth embodiment of the present invention will be described with reference to FIGS. 31 and 32.
本実施例は注型タイプの樹脂モールドコイル70に本発
明を適用した例である。本実施例においては、注型金型
(図示せず)内に巻線4が配置され、注型金型の樹脂注
入口(図示せず)がら端部絶縁層78、内周絶縁層74
.外周絶縁層76、および巻線4の内部に低粘度液状レ
ジン9が注入されて加熱硬化され、第32図に示す形状
の樹脂モールドコイル7oを得ることができる。71は
タップ切換用の端子である0本実施例においても、レジ
ン9が低粘度であるため大気圧中で注型作業を行うこと
ができ、真空設備を不用とすることができて設備費を大
幅に低減させることができる。This embodiment is an example in which the present invention is applied to a cast-type resin molded coil 70. In this embodiment, the winding 4 is arranged in a casting mold (not shown), and the end insulating layer 78 and the inner circumferential insulating layer 74 are arranged in a resin injection port (not shown) of the casting mold.
.. A low-viscosity liquid resin 9 is injected into the outer circumferential insulating layer 76 and the inside of the winding 4, and is heated and hardened to obtain a resin molded coil 7o having the shape shown in FIG. 32. 71 is a terminal for changing the tap. In this embodiment as well, since the resin 9 has a low viscosity, the casting operation can be carried out at atmospheric pressure, making it possible to eliminate the need for vacuum equipment and reduce equipment costs. It can be significantly reduced.
なお、第31図は第32図のAA’断面で、本実施例で
は同図に示すように巻線4内にもレジン9が充填される
。Note that FIG. 31 is a cross section taken along line AA' in FIG. 32, and in this embodiment, the resin 9 is also filled in the winding 4 as shown in the same figure.
本発明の第20実施例を第33図により説明する。A 20th embodiment of the present invention will be described with reference to FIG.
本実施例は、第19実施例のモールドコイルで巻線4内
にレジン9を充填しないようにしたものである1本実施
例によるモールドコイル72は、外形形状は第32図に
示す形状である。本実施例では巻線4の軸方向の上下端
部にはあらかじめパテ状樹脂14が充填されて阻止層が
形成され巻線4内にレジン9が浸入するのを防止する。This embodiment is the molded coil of the 19th embodiment in which the resin 9 is not filled into the winding 4.1 The molded coil 72 according to this embodiment has an external shape as shown in FIG. 32. . In this embodiment, the upper and lower ends of the winding 4 in the axial direction are filled with a putty-like resin 14 in advance to form a blocking layer to prevent the resin 9 from penetrating into the winding 4.
巻線4の内外周には巻回された層間絶縁物4により阻止
層17が形成される。巻線4の上下端部のパテ状樹脂1
4の充填、および注型金型(図示せず)内へのレジン9
の注入作業は大気圧中で行われ、巻線4の内部には大気
圧中の空気層18が形成される。本実施例では巻線4内
の空間にレジン9が注入されないためモールドコイル7
2の重量を軽くすることができる。本実施例は小容量で
発熱の少ない樹脂モールドコイルに好適である。A blocking layer 17 is formed on the inner and outer peripheries of the winding 4 by the wound interlayer insulator 4 . Putty-like resin 1 on the upper and lower ends of the winding 4
4 and filling the resin 9 into the casting mold (not shown)
The injection operation is performed at atmospheric pressure, and an air layer 18 at atmospheric pressure is formed inside the winding 4. In this embodiment, since the resin 9 is not injected into the space inside the winding 4, the molded coil 7
The weight of 2 can be reduced. This embodiment is suitable for a resin molded coil that has a small capacity and generates little heat.
本実施例の製造方法は1巻線4の両端にあらかじめ阻止
層16を形成してから注型金型内に巻線4を配置するこ
と以外は第19実施例と同様である。The manufacturing method of this embodiment is the same as that of the nineteenth embodiment except that the blocking layer 16 is formed in advance on both ends of one winding 4 and then the winding 4 is placed in the casting mold.
本発明の第21実施例を第34図〜第38図により説明
する。A twenty-first embodiment of the present invention will be described with reference to FIGS. 34 to 38.
本実施例は、低粘度液状レジン9の流動性が高いことを
利用して外周絶縁層の表面の端子の周囲にリブを形成し
て絶縁距離を得るようにしたものである。81は巻始め
側の端子、82は巻終わり側の端子、83はタップ切換
用端子であり、第35図〜第37図はそれぞれ第34図
のBB’断面、cc’断面、DD’断面を示す。端子8
1.82の周辺には、それぞれそれらを囲むようにリブ
84.85が設けられる。リブ84.85のモールドコ
イル80の表面からの突出高さは端子81.82の突出
高さより小さく設けられ、リード線接続時の障害となら
ないよう構成される。この関係はタップ切換用端子83
の突出高さとリブ86の突出高さについても同様である
。モールドコイル8oの内周絶縁層80a、外周絶縁層
80bおよび端部絶縁Ji180 cは低粘度液状レジ
ン9で形成される。低粘度液状レジン9は流動性が良好
なため、注型用金型に多少複雑な凹凸を形成してもそれ
に沿って注型できるため1本実施例のようなリブを形成
することができる9巻線4内部には低粘度液状レジン9
が注入されていても、されていなくてもよい6本実施例
のモールドコイル80の製造方法は、第19実施例また
は第20実施例と同様である。第38図は本実施例のモ
ールドコイル80を単相変圧器に用いた側を示す、モー
ルドコイル80は鉄心87に嵌挿され、端子81には1
次側電源接続用端子88が、端子82には接続バーが、
タップ端子83にはタップ接続バー90がそれぞれ接続
される。なお91は2次端子で単相3線式2次出力が得
られるよう結線されている。In this embodiment, the high fluidity of the low-viscosity liquid resin 9 is utilized to form ribs around the terminals on the surface of the outer peripheral insulating layer to obtain an insulation distance. 81 is a terminal on the winding start side, 82 is a terminal on the winding end side, and 83 is a tap switching terminal. Figures 35 to 37 show the BB' cross section, cc' cross section, and DD' cross section in Figure 34, respectively. show. terminal 8
1.82, ribs 84.85 are provided to surround them, respectively. The protrusion height of the ribs 84, 85 from the surface of the molded coil 80 is set smaller than the protrusion height of the terminals 81, 82, so that they do not become an obstacle when connecting the lead wires. This relationship is based on the tap switching terminal 83.
The same applies to the protruding height of the rib 86 and the protruding height of the rib 86 . The inner circumferential insulating layer 80a, the outer circumferential insulating layer 80b, and the end insulating layer 180c of the molded coil 8o are formed of a low-viscosity liquid resin 9. Since the low-viscosity liquid resin 9 has good fluidity, even if somewhat complicated irregularities are formed in the casting mold, it can be cast along them, making it possible to form ribs as in this embodiment 9 Inside the winding 4 is a low viscosity liquid resin 9.
The manufacturing method of the molded coil 80 of the six embodiments, which may or may not be injected, is the same as that of the nineteenth embodiment or the twentieth embodiment. FIG. 38 shows the molded coil 80 of this embodiment used in a single-phase transformer. The molded coil 80 is inserted into the iron core 87, and the terminal 81 has one
The next side power connection terminal 88 is connected to the terminal 82, and the connection bar is connected to the terminal 82.
Tap connection bars 90 are connected to the tap terminals 83, respectively. Note that 91 is a secondary terminal and is connected to obtain a single-phase three-wire secondary output.
本発明の第22実施例を第39図、第40図により説明
する。A twenty-second embodiment of the present invention will be described with reference to FIGS. 39 and 40.
本実施例は、低粘度液状レジン9の流動性および熱伝導
性が良好なことを利用して外周絶縁層92cの表面に放
熱用リブ92aを形成したものである。本実施例におい
てモールドコイ、ル92は内周絶縁層92b、外周絶縁
層92cおよび端部絶縁層92dはそれぞれ低粘度液状
レジン9で形成される。本実施例では注型金型(図示せ
ず)に放熱リブ92aを形成するための凹凸が形成され
、注入された低粘度液状レジン9がこの凹凸に沿って流
れ、硬化により放熱リブ92aが形成される。In this embodiment, heat dissipation ribs 92a are formed on the surface of the outer peripheral insulating layer 92c by utilizing the good fluidity and thermal conductivity of the low viscosity liquid resin 9. In this embodiment, the inner circumference insulating layer 92b, the outer circumferential insulating layer 92c, and the end insulating layer 92d of the molded coil 92 are each made of a low-viscosity liquid resin 9. In this embodiment, unevenness is formed in a casting mold (not shown) to form heat dissipating ribs 92a, and the injected low-viscosity liquid resin 9 flows along these unevenness and hardens to form heat dissipating ribs 92a. be done.
本実施例の製造方法も第19実施例または第20実施例
と同様である。The manufacturing method of this embodiment is also the same as that of the 19th embodiment or the 20th embodiment.
第40図は本実施例のモールドコイル92を単相3線式
変圧器に用いた例を示す1本実施例ではリブ92aが正
面側および背面側だけに設゛けられているので、複数個
のモールドコイルを並べて設けてもリブ同志の干渉を防
止できる。また、モールドコイル間の通風も妨げること
がない。Fig. 40 shows an example in which the molded coil 92 of this embodiment is used in a single-phase three-wire transformer.In this embodiment, the ribs 92a are provided only on the front side and the back side, Even if the molded coils are arranged side by side, interference between the ribs can be prevented. Furthermore, ventilation between the molded coils is not obstructed.
以上の実施例において、シラン系カップリング剤とチタ
ネート系のカップリング剤とが併用されているので、レ
ジンと充填材とのぬれ性が向上し、樹脂が密になって樹
子の分子間のすき間がなくなり、気密性、防水性が向上
する。そのため、以上の実施例においては、耐吸湿性に
優れた樹脂モールドコイルを得ることができ、これらの
樹脂モールドコイルを屋外用モールド変圧器等にも使用
することが可能となる。In the above examples, since a silane coupling agent and a titanate coupling agent are used together, the wettability between the resin and the filler is improved, and the resin becomes denser and the gaps between the molecules of the tree are reduced. airtightness and waterproofness are improved. Therefore, in the above embodiments, resin molded coils with excellent moisture absorption resistance can be obtained, and these resin molded coils can also be used in outdoor molded transformers and the like.
本発明の第23実施例を第41図〜第43図により説明
する。A twenty-third embodiment of the present invention will be described with reference to FIGS. 41 to 43.
本実施例は、リニアモータ等に用いられるモールドコイ
ルである。This example is a molded coil used for a linear motor or the like.
本実施例では2巻回された巻線102の周囲に低粘度液
状レジン9により内周絶縁層107、外周絶縁層108
および端部絶縁層110が形成され1巻線102の内部
にも低粘度液状レジン9が注入される。In this embodiment, an inner insulating layer 107 and an outer insulating layer 108 are made of low viscosity liquid resin 9 around the winding 102 which has two turns.
Then, an end insulating layer 110 is formed, and low viscosity liquid resin 9 is injected into the first winding 102 as well.
本実施例のモールドコイルの製造方法は、注入用型10
6の内部にスペーサ104を入れ、その上に巻線102
を載置し、低粘度液状レジン9を注入する。本実施例で
は注入用型106の底部に凹溝106aが形成されてお
り、低粘度液状レジン9が、この溝内にも流入してリブ
112が形成される。リブ112は放熱リブ、および補
強リブとして機能する。The method for manufacturing a molded coil according to this embodiment includes an injection mold 10
A spacer 104 is placed inside the spacer 6, and a winding 102 is placed on top of the spacer 104.
is placed, and low viscosity liquid resin 9 is injected. In this embodiment, a concave groove 106a is formed at the bottom of the injection mold 106, and the low viscosity liquid resin 9 flows into this groove to form ribs 112. The ribs 112 function as heat radiation ribs and reinforcing ribs.
本実施例によれば、耐候性、および放熱性に優れたモー
ルドコイルを得ることができる。According to this example, a molded coil with excellent weather resistance and heat dissipation properties can be obtained.
また、以上の実施例においては、充填材の量を従来のレ
ジンに比べて大幅に増すことができるので、レジンのコ
ストを低減することができるとともに、充填材の熱伝導
率が大きいので、モールドコイル内で発生した熱が高熱
伝導のレジン9を介して、コイル表面に伝達されるため
、放熱特性が大幅に改善される。In addition, in the above embodiments, the amount of filler can be significantly increased compared to conventional resins, so the cost of resin can be reduced, and since the filler has high thermal conductivity, mold Since the heat generated within the coil is transferred to the coil surface via the highly thermally conductive resin 9, the heat dissipation characteristics are significantly improved.
また、コイルの導体の電流密度を高めて発熱量が増加し
ても、放熱特性が優れているため、コイル内部の温度上
昇は低く抑えられるため、モールドコイルを従来に比べ
約20%小形化を図ることができる。また、これによる
軽量化も可能である。In addition, even if the current density of the coil conductor is increased and the amount of heat generated increases, the temperature rise inside the coil can be kept low due to its excellent heat dissipation characteristics, making it possible to make the molded coil approximately 20% smaller than before. can be achieved. Moreover, weight reduction is also possible by this.
さらには、材料費や設備費の低減を図れ安価なモールド
コイルを得ることができる。Furthermore, it is possible to reduce material and equipment costs and obtain an inexpensive molded coil.
本発明によれば、樹脂層が耐熱性および耐クラツク性に
優れ、巻線の電流密度を高めることができて、小形軽量
化を図ることが可能な樹脂モールドコイルを得ることが
できる。According to the present invention, it is possible to obtain a resin molded coil in which the resin layer has excellent heat resistance and crack resistance, the current density of the winding wire can be increased, and the coil can be made smaller and lighter.
また、本発明によれば、耐熱性および耐クラツク性に優
れ、かつ低粘度の熱硬化性樹脂組成物を得ることができ
る。Further, according to the present invention, a thermosetting resin composition having excellent heat resistance and crack resistance and low viscosity can be obtained.
さらに、本発明によれば、樹脂の粘度を大幅に低下させ
ることができるので、樹脂の注型作業を大気圧中で行う
ことができ1作業が容易になるとともに大掛りな真空注
型設備を不用とすることができ、設備量を大幅に低減可
能な樹脂モールドコイルの製造方法を得ることができる
。Furthermore, according to the present invention, since the viscosity of the resin can be significantly reduced, the resin casting operation can be performed at atmospheric pressure, making the operation easier and requiring no large-scale vacuum casting equipment. It is possible to obtain a method for manufacturing a resin molded coil that can be made unnecessary and that can significantly reduce the amount of equipment.
第1図、第2図はそれぞれ本発明の第1実施例における
モールドコイルの構成を示す一部を断面U巨
と下斜視図、および、外観を示す斜視図、第3図は本実
施例の巻線部分の断面を示す断面図、第4図は第3図の
一部を示す拡大図、第5図〜第7図は、それぞれ本発明
の第1実施例におけるモールドコイルの製造方法を示し
、第5図は巻線機にセットされた巻心に内外周絶縁物と
巻線とが巻回された状態を示す側面図、第6図は巻心を
巻線機から外して樹脂を充填した状態を示す側面図、第
7図は硬化が終了して巻心を外した状態を示す側面図、
第8図は本実施例におけるカップリング剤の配合量によ
る粘度の変化を示す図、第9図はチタネート系カップリ
ング剤の配合量によるガラス転移温度の変化を示す図、
第10図は真空度とコロナ開始電圧の関係を示す図、第
11図は本実施例のレジンと従来のレジンの特性を比較
する図、第12図は本発明の第2実施例におけるモール
ドコイルの一部を断面とした側面図、第13図は本発明
の第3実施例におけるモールドコイルの一部゛を断面と
した側面図、第14図、第15図はそれぞれ本発明の第
4実施例におけるモールドコイルの一部を断面とした側
面図、および一部を断面とした斜視図、第16図、第1
7図はそれぞれ本発明の第5実施例におけるモールドコ
イルの一部を断面とした側面図、および一部を断面とし
た斜視図、第18図〜第22図はそれぞれ本発明の第6
実施例〜第10実施例におけるモールドコイルの一部を
断面とした側面図、第23図〜第30図はそれぞれ本発
明の第11実施例〜第18実施例におけるモールドコイ
ルの一部を断面とした側面図、第31図、第32図はそ
れぞれ本発明の第19実施例におけるモールドコイルの
断面図および斜視図、第33図は本発明の第20実施例
におけるモールドコイルの断面図、第34図〜第38図
はそれぞれ本発明の第21実施例におけるモールドコイ
ルの外形形状を示す斜視図、BB’断面を示す断面図、
cC′断面を示す断面図、DD’断面を示す断面図、変
圧器として用いた状態を示す斜視図、第39図、第40
図はそれぞれ本発明の第22実施例におけるモールドコ
イルの外形形状を示す斜視図、および変圧器として用い
た状態を示す斜視図、第41図〜第43図はそれぞれ本
発明の第23実施例におけるモールドコイルの外形形状
を示す斜視図、注入型への組込状態を示す斜視図、低粘
度液状レジン注入終了状態を示す断面図である。
1.20.30.32.34.36.38.40.42
.4150.52.54.56.58.60.62.6
4.7o、72.80.92,100:樹脂モールドコ
イル、4:巻線、5.74.107:内周絶縁層、6.
76.108:外周絶縁層、9:樹脂層、10.78.
110:端部絶縁層、16− 17:阻止層。
クト、χりMNJ
5:内S地ル眉
り畳Je、檀漕
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し主)
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図FIGS. 1 and 2 are a partial cross-sectional view and bottom perspective view showing the structure of a molded coil according to the first embodiment of the present invention, and a perspective view showing the external appearance, and FIG. 4 is an enlarged view showing a part of FIG. 3, and FIGS. 5 to 7 each show a method for manufacturing a molded coil in the first embodiment of the present invention. , Figure 5 is a side view showing the state in which the inner and outer peripheral insulation and the winding wire are wound around the winding core set in the winding machine, and Figure 6 is a side view showing the state in which the winding core is removed from the winding machine and filled with resin. Fig. 7 is a side view showing the state in which curing is completed and the core is removed;
FIG. 8 is a diagram showing the change in viscosity depending on the amount of the coupling agent blended in this example, FIG. 9 is a diagram showing the change in glass transition temperature depending on the amount of the titanate coupling agent blended,
Fig. 10 is a diagram showing the relationship between the degree of vacuum and the corona starting voltage, Fig. 11 is a diagram comparing the characteristics of the resin of this embodiment and a conventional resin, and Fig. 12 is a diagram showing the molded coil in the second embodiment of the present invention. FIG. 13 is a side view with a part of the molded coil in cross section according to the third embodiment of the present invention, and FIG. 14 and FIG. A partially sectional side view and a partially sectional perspective view of the molded coil in the example, FIGS. 16 and 1
7 is a partially sectional side view and partially sectional perspective view of a molded coil according to a fifth embodiment of the present invention, and FIGS. 18 to 22 are a partially sectional side view and a partially sectional perspective view of a molded coil according to a fifth embodiment of the present invention
A side view showing a part of the molded coil in a cross section in Examples to a Tenth Example, and FIGS. 31 and 32 are respectively a sectional view and a perspective view of a molded coil according to a nineteenth embodiment of the present invention, and FIG. 33 is a cross-sectional view of a molded coil according to a twentieth embodiment of the present invention, and FIG. 38 are a perspective view showing the external shape of the molded coil in the 21st embodiment of the present invention, a sectional view showing the BB' cross section,
A sectional view showing the cC′ cross section, a sectional view showing the DD′ cross section, a perspective view showing the state in which it is used as a transformer, FIGS. 39 and 40
The figures are a perspective view showing the outer shape of a molded coil according to a twenty-second embodiment of the present invention, and a perspective view showing a state in which it is used as a transformer, and FIGS. 41 to 43 are a perspective view showing a molded coil according to a twenty-third embodiment of the present invention. They are a perspective view showing the external shape of a molded coil, a perspective view showing a state in which it is assembled into an injection mold, and a sectional view showing a state in which low viscosity liquid resin has been injected. 1.20.30.32.34.36.38.40.42
.. 4150.52.54.56.58.60.62.6
4.7o, 72.80.92, 100: Resin molded coil, 4: Winding wire, 5.74.107: Inner peripheral insulating layer, 6.
76.108: Peripheral insulating layer, 9: Resin layer, 10.78.
110: Edge insulating layer, 16-17: Blocking layer. Kut, χri MNJ 5: Inner S ground eyebrow tatami Je, Danko Shirare thread cuff ring Blue J filling 4 1st; Yusai 1 Ro 1
1゛Uphi(Two θ 015 03 σJ′ σiI
5 seeds = Y-type cutlet ring) filling material 1; vs. t4
萱1上HICgu) J diagrammatic master) ) same value as the same size, round material) this supporter t4 pierced) combination (! = parable 1 R2 ni attack. 1st concave base concave 11.1 1st concave diagram fig. fig. fig. fig. fig. fig. -L N q Fig. Concave Fig. Fig. q Fig. Fig. 7a Fig. Fig. Fig. Fig. Concave Fig. Fig. I Fig. I Fig. I Fig.: Resin top - Rutoko A/θ7: Inner shoulder loquat Edge brow 10θ: Tato y11 Ue to Jufuno no 1 1/θ: Zanegojigeki//2: Refi' Fig. t Fig. Fig.
Claims (18)
れた内周絶縁層および外周絶縁層と、前記巻線の軸方向
端面に形成された端部絶縁層とを備えて成る樹脂モール
ドコイルにおいて、前記内周絶縁層、前記外周絶縁層、
前記端部絶縁層、および前記巻線内部の空間の少なくと
もいずれか一つを、少なくとも多官能エポキシ化合物、
充填材、該充填材に対してそれぞれ所定の割合で配合さ
れたシラン系カップリング剤およびチタネート系カップ
リング剤より成る熱硬化性樹脂組成物を大気圧中で充填
し硬化させた樹脂層としたことを特徴とする樹脂モール
ドコイル。1. A resin molded coil comprising a winding, an inner insulating layer and an outer insulating layer formed on the inner and outer peripheries of the winding, respectively, and an end insulating layer formed on an axial end surface of the winding. The inner peripheral insulating layer, the outer peripheral insulating layer,
At least one of the end insulating layer and the space inside the winding is made of at least a polyfunctional epoxy compound,
A thermosetting resin composition consisting of a filler, a silane coupling agent, and a titanate coupling agent each blended in a predetermined ratio with respect to the filler was filled and cured at atmospheric pressure to form a resin layer. A resin molded coil characterized by:
れた内周絶縁層および外周絶縁層と、前記巻線の軸方向
端面に形成された端部絶縁層とを備えて成る樹脂モール
ドコイルにおいて、前記内周絶縁層、前記外周絶縁層、
前記端部絶縁層の少なくともいずれか一つを少なくとも
多官能エポキシ化合物、充填材、該充填材に対してそれ
ぞれ所定の割合で配合されたシラン系カップリング剤お
よびチタネート系カップリング剤より成る熱硬化性樹脂
組成物を大気圧中で充填し硬化させた樹脂層とするとと
もに、前記巻線の前記樹脂層と対向する面に前記巻線内
への樹脂の浸入を防止する阻止層を備えて成ることを特
徴とする樹脂モールドコイル。2. A resin molded coil comprising a winding, an inner insulating layer and an outer insulating layer formed on the inner and outer peripheries of the winding, respectively, and an end insulating layer formed on an axial end surface of the winding. The inner peripheral insulating layer, the outer peripheral insulating layer,
At least one of the end insulating layers is thermally cured by at least a polyfunctional epoxy compound, a filler, and a silane coupling agent and a titanate coupling agent each blended in a predetermined ratio with respect to the filler. The resin layer is filled with a synthetic resin composition at atmospheric pressure and cured, and a blocking layer is provided on a surface of the winding facing the resin layer to prevent the resin from penetrating into the winding. A resin molded coil characterized by:
とする請求項1記載の樹脂モールドコイル。3. The resin molded coil according to claim 1, wherein the resin layer is formed inside the winding.
プリプレグにより形成され、前記端部絶縁層の少なくと
もいずれか一方に前記樹脂層が形成されたことを特徴と
する請求項3記載の樹脂モールドコイル。4. The resin molded coil according to claim 3, wherein the inner circumferential insulating layer and the outer circumferential insulating layer are formed of heat-cured prepreg, and the resin layer is formed on at least one of the end insulating layers. .
パテ状樹脂により形成されたことを特徴とする請求項4
記載の樹脂モールドコイル。5. 4. The end insulating layer is characterized in that one side is the resin layer and the other side is formed of putty-like resin.
The resin molded coil described.
プリプレグにより形成され、前記端部絶縁層は両方共パ
テ状樹脂により形成されたことを特徴とする請求項3記
載の樹脂モールドコイル。6. 4. The resin-molded coil according to claim 3, wherein the inner circumferential insulating layer and the outer circumferential insulating layer are formed of heat-cured prepreg, and the end insulating layer is both formed of putty-like resin.
いずれか一方が加熱硬化されたプリプレグおよび該プリ
プレグと前記巻線との間に形成された前記樹脂層とによ
り形成されたことを特徴とする請求項3記載の樹脂モー
ルドコイル。7. Claim: wherein at least one of the inner circumferential insulating layer and the outer circumferential insulating layer is formed of heat-cured prepreg and the resin layer formed between the prepreg and the winding wire. 3. The resin molded coil described in 3.
に前記阻止層を備え、内部が大気圧に保たれることを特
徴とする請求項2記載の樹脂モールドコイル。8. 3. The resin-molded coil according to claim 2, wherein the winding includes the blocking layer on at least a surface facing the end insulating layer, and the inside thereof is maintained at atmospheric pressure.
いずれか一方が加熱硬化されたプリプレグおよび該プリ
プレグと前記巻線との間に形成された前記樹脂層とによ
り形成されたことを特徴とする請求項8記載の樹脂モー
ルドコイル。9. Claim: wherein at least one of the inner circumferential insulating layer and the outer circumferential insulating layer is formed of heat-cured prepreg and the resin layer formed between the prepreg and the winding wire. 8. The resin molded coil according to 8.
絶縁層がいずれも前記樹脂層により形成されたことを特
徴とする請求項3記載の樹脂モールドコイル。10. 4. The resin molded coil according to claim 3, wherein the inner circumferential insulating layer, the outer circumferential insulating layer, and the end insulating layer are all formed of the resin layer.
部絶縁層がいずれも前記樹脂層により形成されたことを
特徴とする請求項8記載の樹脂モールドコイル。11. 9. The resin molded coil according to claim 8, wherein the inner circumferential insulating layer, the outer circumferential insulating layer, and the end insulating layer are all formed of the resin layer.
し、該口出線と反対側の端面に設けられる前記端部絶縁
層はその外表面にリブを備えて成ることを特徴とする請
求項10記載の樹脂モールドコイル。12. The winding has a lead wire only on one end face in the axial direction, and the end insulating layer provided on the end face opposite to the lead wire has a rib on its outer surface. The resin molded coil according to claim 10.
された内周絶縁層および外周絶縁層と、前記巻線の軸方
向端面に形成された端部絶縁層と、少なくとも前記内周
絶縁層、前記外周絶縁層、前記端部絶縁層に低粘度の熱
硬化性樹脂組成物をそれぞれ大気圧中で充填し加熱硬化
して形成した樹脂層とを備え、前記外周絶縁層の表面に
前記巻線に接続された端子を配設するとともに、該端子
の近傍に形成されたリブを備えて成ることを特徴とする
樹脂モールドコイル。13. a winding; an inner insulating layer and an outer insulating layer formed on the inner and outer peripheries of the winding; an end insulating layer formed on an axial end surface of the winding; and at least the inner insulating layer. , a resin layer formed by filling the outer peripheral insulating layer and the end insulating layer with a low-viscosity thermosetting resin composition at atmospheric pressure and curing by heating, the outer insulating layer having the winding on the surface thereof; 1. A resin molded coil comprising a terminal connected to a wire and a rib formed near the terminal.
された内周絶縁層および外周絶縁層と、前記巻線の軸方
向端面に形成された端部絶縁層と、少なくとも前記内周
絶縁層、前記外周絶縁層、前記端部絶縁層に低粘度の熱
硬化性樹脂組成物をそれぞれ大気圧中で充填し加熱硬化
して形成した樹脂層とを備え、前記外周絶縁層にその表
面から突出するリブを配設したことを特徴とする樹脂モ
ールドコイル。14. a winding; an inner insulating layer and an outer insulating layer formed on the inner and outer peripheries of the winding; an end insulating layer formed on an axial end surface of the winding; and at least the inner insulating layer. , a resin layer formed by filling the outer peripheral insulating layer and the end insulating layer with a low-viscosity thermosetting resin composition at atmospheric pressure and curing by heating, wherein a resin layer protrudes from the surface of the outer peripheral insulating layer. A resin molded coil characterized by having ribs arranged to
線を巻回し、該巻線上に外周絶縁物を巻回した後、軸方
向の一方の端面を塞いで前記内周絶縁物、および前記外
周絶縁物を硬化させ、前記塞がれた側の端面を下側にし
て反対側の端面から多官能エポキシ化合物に充填材およ
び該充填材に対しシラン系カップリング剤およびチタネ
ート系カップリング剤とをそれぞれ所定の割合で配合し
て得られる低粘度の熱硬化性樹脂組成物を大気圧中で充
填し、加熱硬化したことを特徴とする樹脂モールドコイ
ルの製造方法。15. After winding an inner insulator around the winding core, winding a wire on the inner insulator, and winding an outer insulator on the winding, one end face in the axial direction is closed to remove the inner insulator. and the outer insulator are cured, and a filler is applied to the polyfunctional epoxy compound from the opposite end face with the closed end face facing down, and a silane coupling agent and a titanate base are applied to the filler. A method for manufacturing a resin molded coil, characterized in that a low viscosity thermosetting resin composition obtained by blending a coupling agent and a coupling agent in predetermined proportions is filled at atmospheric pressure and cured by heating.
線を巻回し、該巻線上に外周絶縁物を巻回した後、軸方
向の一方の端面をパテ状樹脂で塞ぐとともに前記巻線の
他方の端面に阻止層を形成し、前記内周絶縁物、前記外
周絶縁物、前記パテ状樹脂、および前記阻止層を硬化さ
せた後、前記パテ状樹脂の層を下側にして反対側の端面
から多官能エポキシ化合物に充填材と該充填材に対して
シラン系カップリング剤とチタネート系カップリング剤
とをそれぞれ所定の割合で配合した低粘度の熱硬化性樹
脂組成物を大気圧中で、充填し加熱硬化したことを特徴
とする樹脂モールドコイルの製造方法。16. After winding an inner insulating material around the winding core, winding a wire on the inner insulating material, and winding an outer insulating material on the winding, one end surface in the axial direction is closed with a putty-like resin. After forming a blocking layer on the other end surface of the winding and curing the inner peripheral insulator, the outer peripheral insulator, the putty-like resin, and the blocking layer, the putty-like resin layer is placed on the lower side. A low-viscosity thermosetting resin composition containing a filler and a silane coupling agent and a titanate coupling agent in predetermined ratios to the filler is added to the polyfunctional epoxy compound from the opposite end surface. A method for manufacturing a resin molded coil, characterized by filling the coil and heating and hardening it at atmospheric pressure.
ようセットした後、前記金型内に大気圧中で、多官能エ
ポキシ化合物に充填材と、該充填材に対してシラン系カ
ップリング剤とチタネート系カップリング剤とをそれぞ
れ所定の割合で配合した低粘度の熱硬化性樹脂組成物を
充填し、加熱硬化して前記巻線内部、前記巻線内周、前
記巻線外周および前記巻線端部に樹脂層を形成すること
を特徴とする樹脂モールドコイルの製造方法。17. After the winding wire is set in a mold so as to be spaced a predetermined distance from the inner periphery of the mold, a filler made of a polyfunctional epoxy compound and a silane cup are placed in the mold at atmospheric pressure. A low-viscosity thermosetting resin composition containing a ring agent and a titanate coupling agent in predetermined ratios is filled and cured by heating to form the inside of the winding, the inner periphery of the winding, the outer periphery of the winding, and A method for manufacturing a resin molded coil, comprising forming a resin layer at the end of the winding.
止する阻止層を形成し、その後前記巻線を金型内に該金
型の内周から所定距離離間するようセットした後、前記
金型内に大気圧中で多官能エポキシ化合物に充填材と、
該充填材に対してシラン系カップリング剤とチタネート
系カップリング剤とをそれぞれ所定の割合で配合した低
粘度の熱硬化性樹脂組成物を充填し、前記巻線内周、前
記巻線外周および前記巻線端部に樹脂層を形成すること
を特徴とする樹脂モールドコイルの製造方法。18. A blocking layer for preventing liquid resin from entering is formed on the inner and outer peripheries and both end surfaces of the winding, and then the winding is set in a mold so as to be spaced a predetermined distance from the inner periphery of the mold. with filler in polyfunctional epoxy compound at atmospheric pressure within
The filler is filled with a low-viscosity thermosetting resin composition containing a silane coupling agent and a titanate coupling agent in predetermined ratios, and the inner periphery of the winding, the outer periphery of the winding, and A method for manufacturing a resin molded coil, comprising forming a resin layer at the end of the winding.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63181908A JP2675086B2 (en) | 1988-07-22 | 1988-07-22 | Resin mold coil |
KR1019890009466A KR920005818B1 (en) | 1988-07-22 | 1989-07-04 | Resin bonded magnet |
GB8915945A GB2220945B (en) | 1988-07-22 | 1989-07-12 | "resin-molded coil" |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63181908A JP2675086B2 (en) | 1988-07-22 | 1988-07-22 | Resin mold coil |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0232508A true JPH0232508A (en) | 1990-02-02 |
JP2675086B2 JP2675086B2 (en) | 1997-11-12 |
Family
ID=16108998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63181908A Expired - Lifetime JP2675086B2 (en) | 1988-07-22 | 1988-07-22 | Resin mold coil |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2675086B2 (en) |
KR (1) | KR920005818B1 (en) |
GB (1) | GB2220945B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4217288A1 (en) * | 1991-05-23 | 1992-11-26 | Hitachi Ltd | HEAT-CURING RESIN COMPOSITION FOR THE MOLDING OF A HIGH-VOLTAGE COIL AND MOLDED COIL AND PANEL PRODUCED BY POURING AND HARDENING THE COMPOSITION |
CN105493210A (en) * | 2013-07-18 | 2016-04-13 | Abb技术有限公司 | Enhanced track resistant dome structure for dry-type cast coil transformer |
JP2021057476A (en) * | 2019-09-30 | 2021-04-08 | 株式会社村田製作所 | Coil component and method for manufacturing coil component |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05328681A (en) * | 1992-05-18 | 1993-12-10 | Mitsuba Electric Mfg Co Ltd | Coating material for armature core in motor of electrical equipment |
CA2114564C (en) * | 1993-02-05 | 1998-05-26 | Shigeo Ichida | Transformer unit and coil case and coil bobbin for use therefor |
US6198373B1 (en) * | 1997-08-19 | 2001-03-06 | Taiyo Yuden Co., Ltd. | Wire wound electronic component |
GB2345799A (en) * | 1997-08-19 | 2000-07-19 | Taiyo Yuden Kk | Filler material for a wire wound electronic component |
JPH11195550A (en) * | 1998-01-06 | 1999-07-21 | Kureha Chem Ind Co Ltd | Coil part |
US6147580A (en) * | 1998-12-29 | 2000-11-14 | Square D Company | Strip wound induction coil with improved heat transfer and short circuit withstandability |
US20110156853A1 (en) * | 2008-08-22 | 2011-06-30 | Masayuki Kato | Reactor-use component and reactor |
EP2518739B1 (en) * | 2011-04-27 | 2013-03-20 | ABB Research Ltd. | The insulating casing of a high-voltage winding |
US20130043966A1 (en) * | 2011-08-15 | 2013-02-21 | Abb Technology Ag | Transformer tap projection and cover |
KR20170097399A (en) * | 2016-02-18 | 2017-08-28 | 최정훈 | portable toothbrush |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6191232A (en) * | 1984-10-12 | 1986-05-09 | Asahi Glass Co Ltd | Production of magnesium oxide for resin filling |
US4721747A (en) * | 1985-09-04 | 1988-01-26 | The Sherwin-Williams Company | High solid coatings containing titanates and silanes |
-
1988
- 1988-07-22 JP JP63181908A patent/JP2675086B2/en not_active Expired - Lifetime
-
1989
- 1989-07-04 KR KR1019890009466A patent/KR920005818B1/en not_active IP Right Cessation
- 1989-07-12 GB GB8915945A patent/GB2220945B/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4217288A1 (en) * | 1991-05-23 | 1992-11-26 | Hitachi Ltd | HEAT-CURING RESIN COMPOSITION FOR THE MOLDING OF A HIGH-VOLTAGE COIL AND MOLDED COIL AND PANEL PRODUCED BY POURING AND HARDENING THE COMPOSITION |
DE4217288C2 (en) * | 1991-05-23 | 1998-08-27 | Hitachi Ltd | A thermosetting resin composition for casting high-voltage coils, and a method for producing such a resin composition and its use for producing high-voltage molded coils |
CN105493210A (en) * | 2013-07-18 | 2016-04-13 | Abb技术有限公司 | Enhanced track resistant dome structure for dry-type cast coil transformer |
JP2021057476A (en) * | 2019-09-30 | 2021-04-08 | 株式会社村田製作所 | Coil component and method for manufacturing coil component |
Also Published As
Publication number | Publication date |
---|---|
KR900002363A (en) | 1990-02-28 |
GB2220945A (en) | 1990-01-24 |
KR920005818B1 (en) | 1992-07-20 |
GB8915945D0 (en) | 1989-08-31 |
JP2675086B2 (en) | 1997-11-12 |
GB2220945B (en) | 1992-10-28 |
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