JPH0232369U - - Google Patents
Info
- Publication number
- JPH0232369U JPH0232369U JP10831288U JP10831288U JPH0232369U JP H0232369 U JPH0232369 U JP H0232369U JP 10831288 U JP10831288 U JP 10831288U JP 10831288 U JP10831288 U JP 10831288U JP H0232369 U JPH0232369 U JP H0232369U
- Authority
- JP
- Japan
- Prior art keywords
- reflow soldering
- legs
- walls
- tool
- pulse heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10831288U JPH0230145Y2 (ja�@�@) | 1988-08-19 | 1988-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10831288U JPH0230145Y2 (ja�@�@) | 1988-08-19 | 1988-08-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0232369U true JPH0232369U (ja�@�@) | 1990-02-28 |
| JPH0230145Y2 JPH0230145Y2 (ja�@�@) | 1990-08-14 |
Family
ID=31343522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10831288U Expired JPH0230145Y2 (ja�@�@) | 1988-08-19 | 1988-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0230145Y2 (ja�@�@) |
-
1988
- 1988-08-19 JP JP10831288U patent/JPH0230145Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0230145Y2 (ja�@�@) | 1990-08-14 |