JPH0232369U - - Google Patents
Info
- Publication number
- JPH0232369U JPH0232369U JP10831288U JP10831288U JPH0232369U JP H0232369 U JPH0232369 U JP H0232369U JP 10831288 U JP10831288 U JP 10831288U JP 10831288 U JP10831288 U JP 10831288U JP H0232369 U JPH0232369 U JP H0232369U
- Authority
- JP
- Japan
- Prior art keywords
- reflow soldering
- legs
- walls
- tool
- pulse heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図が考案になるリフロソルダリング用パル
スヒートツールを示す斜視図、第２，３図はその
正面図と側面図、第４図は従来のリフロソルダリ
ング用パルスヒートツールを示す斜視図、第５図
は第４図に示したツールの使用状態を示す正面図
、また第６図は押圧面の温度分布を示す図である
。
１……発熱体、４，５……通電用脚部、２，３
，２２，２４……壁、２０，２０Ａ……ツール、
２６，２８……放熱部。
Fig. 1 is a perspective view showing the proposed pulse heat tool for reflow soldering, Figs. 2 and 3 are front and side views thereof, and Fig. 4 is a perspective view showing a conventional pulse heat tool for reflow soldering. FIG. 5 is a front view showing how the tool shown in FIG. 4 is used, and FIG. 6 is a diagram showing the temperature distribution on the pressing surface. 1... Heating element, 4, 5... Legs for electricity supply, 2, 3
, 22, 24...Wall, 20, 20A...Tool,
26, 28... Heat dissipation section.
Claims (1)
２壁に、通電用脚部をそれぞれ一体に設けてなる
リフロソルダリング用パルスヒートツールにおい
て、 前記発熱体の前記通電用脚部が無い２壁に放熱
部を一体に形成したことを特徴とするリフロソル
ダリング用パルスヒートツール。[Scope of Claim for Utility Model Registration] A pulse heat tool for reflow soldering, in which energizing legs are integrally provided on two arbitrary opposing walls of a heating element formed in the shape of a rectangular frame, comprising: A pulse heat tool for reflow soldering, characterized in that a heat dissipation part is integrally formed on the two walls without the current-carrying legs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10831288U JPH0230145Y2 (en) | 1988-08-19 | 1988-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10831288U JPH0230145Y2 (en) | 1988-08-19 | 1988-08-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0232369U true JPH0232369U (en) | 1990-02-28 |
| JPH0230145Y2 JPH0230145Y2 (en) | 1990-08-14 |
Family
ID=31343522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10831288U Expired JPH0230145Y2 (en) | 1988-08-19 | 1988-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0230145Y2 (en) |
-
1988
- 1988-08-19 JP JP10831288U patent/JPH0230145Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0230145Y2 (en) | 1990-08-14 |