JPH0232293Y2 - - Google Patents
Info
- Publication number
- JPH0232293Y2 JPH0232293Y2 JP1984174014U JP17401484U JPH0232293Y2 JP H0232293 Y2 JPH0232293 Y2 JP H0232293Y2 JP 1984174014 U JP1984174014 U JP 1984174014U JP 17401484 U JP17401484 U JP 17401484U JP H0232293 Y2 JPH0232293 Y2 JP H0232293Y2
- Authority
- JP
- Japan
- Prior art keywords
- opening
- container
- memory alloy
- opening adjustment
- shape memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 34
- 230000008602 contraction Effects 0.000 claims description 10
- 239000003205 fragrance Substances 0.000 description 17
- 239000003795 chemical substances by application Substances 0.000 description 12
- 238000009792 diffusion process Methods 0.000 description 11
- 239000002386 air freshener Substances 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 7
- 235000019645 odor Nutrition 0.000 description 3
- 238000004332 deodorization Methods 0.000 description 2
- 230000001877 deodorizing effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Springs (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984174014U JPH0232293Y2 (de) | 1984-11-16 | 1984-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984174014U JPH0232293Y2 (de) | 1984-11-16 | 1984-11-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6188747U JPS6188747U (de) | 1986-06-10 |
| JPH0232293Y2 true JPH0232293Y2 (de) | 1990-09-03 |
Family
ID=30731646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984174014U Expired JPH0232293Y2 (de) | 1984-11-16 | 1984-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0232293Y2 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11848249B2 (en) | 2019-09-26 | 2023-12-19 | Fujifilm Corporation | Manufacturing method for thermal conductive layer, manufacturing method for laminate, and manufacturing method for semiconductor device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH031008Y2 (de) * | 1984-12-03 | 1991-01-14 | ||
| ATE388725T1 (de) * | 2003-12-02 | 2008-03-15 | Givaudan Sa | Gerät zum abgeben einer flüchtigen flüssigkeit in die atmosphäre |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5892944U (ja) * | 1981-12-19 | 1983-06-23 | 株式会社リコー | 香料容器 |
| JPS59145927U (ja) * | 1983-03-18 | 1984-09-29 | 豊田合成株式会社 | 放香容器 |
-
1984
- 1984-11-16 JP JP1984174014U patent/JPH0232293Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11848249B2 (en) | 2019-09-26 | 2023-12-19 | Fujifilm Corporation | Manufacturing method for thermal conductive layer, manufacturing method for laminate, and manufacturing method for semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6188747U (de) | 1986-06-10 |
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