JPH0231875B2 - - Google Patents

Info

Publication number
JPH0231875B2
JPH0231875B2 JP62127279A JP12727987A JPH0231875B2 JP H0231875 B2 JPH0231875 B2 JP H0231875B2 JP 62127279 A JP62127279 A JP 62127279A JP 12727987 A JP12727987 A JP 12727987A JP H0231875 B2 JPH0231875 B2 JP H0231875B2
Authority
JP
Japan
Prior art keywords
circuit
core
impurities
cores
lines
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62127279A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63110797A (ja
Inventor
Jeraado Hofuaasu Josefu
Josefu Razarini Donarudo
Andoryuu Uerushu Jon
Penotsuku Wairi Jon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS63110797A publication Critical patent/JPS63110797A/ja
Publication of JPH0231875B2 publication Critical patent/JPH0231875B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP12727987A 1986-10-23 1987-05-26 多層回路板 Granted JPS63110797A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US92242286A 1986-10-23 1986-10-23
US922422 1986-10-23

Publications (2)

Publication Number Publication Date
JPS63110797A JPS63110797A (ja) 1988-05-16
JPH0231875B2 true JPH0231875B2 (enExample) 1990-07-17

Family

ID=25447017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12727987A Granted JPS63110797A (ja) 1986-10-23 1987-05-26 多層回路板

Country Status (2)

Country Link
EP (1) EP0264617A1 (enExample)
JP (1) JPS63110797A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4854038A (en) * 1988-03-16 1989-08-08 International Business Machines Corporation Modularized fabrication of high performance printed circuit boards
DE10126002A1 (de) * 2000-06-24 2002-01-31 Rotra Leiterplatten Produktion Mehrlagen-Leiterplatten-Verbundkörper und Verfahren zu dessen Herstellung
AT412681B (de) * 2002-04-22 2005-05-25 Hueck Folien Gmbh Substrate mit unsichtbaren elektrisch leitfähigen schichten

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5511184Y2 (enExample) * 1973-09-04 1980-03-11
JPS51131652U (enExample) * 1975-04-17 1976-10-23
US4180608A (en) * 1977-01-07 1979-12-25 Del Joseph A Process for making multi-layer printed circuit boards, and the article resulting therefrom

Also Published As

Publication number Publication date
EP0264617A1 (en) 1988-04-27
JPS63110797A (ja) 1988-05-16

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