JPH0231784Y2 - - Google Patents

Info

Publication number

JPH0231784Y2

JPH0231784Y2 JP16964984U JP16964984U JPH0231784Y2 JP H0231784 Y2 JPH0231784 Y2 JP H0231784Y2 JP 16964984 U JP16964984 U JP 16964984U JP 16964984 U JP16964984 U JP 16964984U JP H0231784 Y2 JPH0231784 Y2 JP H0231784Y2

Authority

JP

Japan

Prior art keywords

layer

insulating layer

fuse metal

capacitor element

lead

Prior art date

1984-11-07

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
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• 239000003990 capacitor Substances 0.000 claims description 41
• 229910052751 metal Inorganic materials 0.000 claims description 37
• 239000002184 metal Substances 0.000 claims description 37
• 229920005989 resin Polymers 0.000 claims description 10
• 239000011347 resin Substances 0.000 claims description 10
• 239000007787 solid Substances 0.000 claims description 9
• 239000000463 material Substances 0.000 claims description 7
• 239000000843 powder Substances 0.000 claims description 4
• 239000000853 adhesive Substances 0.000 claims description 2
• 230000001070 adhesive effect Effects 0.000 claims description 2
• 238000007598 dipping method Methods 0.000 description 5
• 238000007740 vapor deposition Methods 0.000 description 5
• 238000000034 method Methods 0.000 description 4
• 239000007788 liquid Substances 0.000 description 3
• 230000009993 protective function Effects 0.000 description 3
• 238000005476 soldering Methods 0.000 description 3
• OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
• 239000011248 coating agent Substances 0.000 description 2
• 238000000576 coating method Methods 0.000 description 2
• 230000006866 deterioration Effects 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 229910002804 graphite Inorganic materials 0.000 description 2
• 239000010439 graphite Substances 0.000 description 2
• 238000000465 moulding Methods 0.000 description 2
• 239000004065 semiconductor Substances 0.000 description 2
• 229910052709 silver Inorganic materials 0.000 description 2
• 239000004332 silver Substances 0.000 description 2
• 238000005245 sintering Methods 0.000 description 2
• 229910000679 solder Inorganic materials 0.000 description 2
• 229910001128 Sn alloy Inorganic materials 0.000 description 1
• 230000005856 abnormality Effects 0.000 description 1
• 239000007767 bonding agent Substances 0.000 description 1
• 238000007796 conventional method Methods 0.000 description 1
• 230000003111 delayed effect Effects 0.000 description 1
• 238000000151 deposition Methods 0.000 description 1
• 230000008021 deposition Effects 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 230000006870 function Effects 0.000 description 1
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
• 239000010931 gold Substances 0.000 description 1
• 229910052737 gold Inorganic materials 0.000 description 1
• 238000010438 heat treatment Methods 0.000 description 1
• LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 230000008018 melting Effects 0.000 description 1
• 238000002844 melting Methods 0.000 description 1
• 238000004806 packaging method and process Methods 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 230000001681 protective effect Effects 0.000 description 1
• 239000007921 spray Substances 0.000 description 1
• 229920001187 thermosetting polymer Polymers 0.000 description 1
• 238000003466 welding Methods 0.000 description 1